component
MMBZ20VCL
Public Made by Adomby adom
Nexperia ESD Protection Devices, TO-236AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MMBZ20VCL
Nexperia · ESD Protection Devices · TO-236AB
MMBZ20VCL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of diode 1; protects signal line 1 (unidirectional), with VRWM up to 17 V and breakdown voltage 19 to 21 V measured to pin 3. |
| 2 | A2 | passive | Anode of diode 2; protects signal line 2 (unidirectional), with VRWM up to 17 V and breakdown voltage 19 to 21 V measured to pin 3. |
| 3 | CC | passive | Common cathode of both diodes, also the solder point for thermal measurement (Rth(j-sp) max 60 K/W), connected to the reference side in the application. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Circuit Protection |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Rated peak pulse power | PPPM | 40 | W | tp = 10/1000 µs; pin 1 or 2 to pin 3 | 3 | ||
| Rated peak pulse current | IPPM | 1.4 | A | tp = 10/1000 µs; pin 1 or 2 to pin 3 | 3 | ||
| Total power dissipation (standard footprint) | Ptot | 350 | mW | Tamb ≤ 25 °C; FR4 PCB, standard footprint | 3 | ||
| Total power dissipation (1 cm2 cathode pad) | Ptot | 440 | mW | Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm2 | 3 | ||
| Junction temperature | Tj | 150 | °C | 3 | |||
| Ambient temperature | Tamb | -55 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| ESD voltage, IEC 61000-4-2 contact | VESD | 30 | kV | IEC 61000-4-2; contact discharge; Tamb = 25 °C | 3 | ||
| ESD voltage, IEC 61000-4-2 air | VESD | 15 | kV | IEC 61000-4-2; air discharge | 3 | ||
| ESD voltage, HBM | VESD | 8 | kV | MIL-STD-883; human body model (HBM) | 3 | ||
| Thermal resistance junction to ambient (standard footprint) | Rth(j-a) | 350 | K/W | FR4 PCB, standard footprint | 4 | ||
| Thermal resistance junction to ambient (1 cm2 cathode pad) | Rth(j-a) | 280 | K/W | FR4 PCB, mounting pad for cathode 1 cm2 | 4 | ||
| Thermal resistance junction to solder point | Rth(j-sp) | 60 | K/W | Soldering point at pin 3 | 4 | ||
| Forward voltage | VF | 0.9 | V | IF = 10 mA; Tamb = 25 °C | 4 | ||
| Reverse standoff voltage | VRWM | 17 | V | Tamb = 25 °C | 4 | ||
| Breakdown voltage | VBR | 19 | 20 | 21 | V | IR = 1 mA; Tamb = 25 °C | 4 |
| Reverse leakage current | IRM | 0.1 | 5 | nA | VRWM = 17 V; Tamb = 25 °C | 4 | |
| Diode capacitance | Cd | 65 | 80 | pF | f = 1 MHz; VR = 0 V; Tamb = 25 °C | 4 | |
| Clamping voltage | VCL | 28 | V | IPPM = 1.4 A; tp = 10/1000 µs; Tamb = 25 °C | 4 | ||
| Temperature coefficient | SZ | 15.8 | mV/K | IZ = 1 mA | 4 |
CAD (KiCad official)
- Symbol:
MMBZ20VCL - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files:
mmbz20vcl-etched.step/mmbz20vcl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mmbz20vcl.step/mmbz20vcl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (11 pp, sha256
95847ad8a73ea83b, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MMBZ20VCL
**Nexperia** · ESD Protection Devices · TO-236AB
MMBZ20VCL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of diode 1; protects signal line 1 (unidirectional), with VRWM up to 17 V and breakdown voltage 19 to 21 V measured to pin 3. |
| 2 | A2 | passive | Anode of diode 2; protects signal line 2 (unidirectional), with VRWM up to 17 V and breakdown voltage 19 to 21 V measured to pin 3. |
| 3 | CC | passive | Common cathode of both diodes, also the solder point for thermal measurement (Rth(j-sp) max 60 K/W), connected to the reference side in the application. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Circuit Protection |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Rated peak pulse power | PPPM | | | 40 | W | tp = 10/1000 µs; pin 1 or 2 to pin 3 | 3 |
| Rated peak pulse current | IPPM | | | 1.4 | A | tp = 10/1000 µs; pin 1 or 2 to pin 3 | 3 |
| Total power dissipation (standard footprint) | Ptot | | | 350 | mW | Tamb ≤ 25 °C; FR4 PCB, standard footprint | 3 |
| Total power dissipation (1 cm2 cathode pad) | Ptot | | | 440 | mW | Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm2 | 3 |
| Junction temperature | Tj | | | 150 | °C | | 3 |
| Ambient temperature | Tamb | -55 | | 150 | °C | | 3 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 3 |
| ESD voltage, IEC 61000-4-2 contact | VESD | | | 30 | kV | IEC 61000-4-2; contact discharge; Tamb = 25 °C | 3 |
| ESD voltage, IEC 61000-4-2 air | VESD | | | 15 | kV | IEC 61000-4-2; air discharge | 3 |
| ESD voltage, HBM | VESD | | | 8 | kV | MIL-STD-883; human body model (HBM) | 3 |
| Thermal resistance junction to ambient (standard footprint) | Rth(j-a) | | | 350 | K/W | FR4 PCB, standard footprint | 4 |
| Thermal resistance junction to ambient (1 cm2 cathode pad) | Rth(j-a) | | | 280 | K/W | FR4 PCB, mounting pad for cathode 1 cm2 | 4 |
| Thermal resistance junction to solder point | Rth(j-sp) | | | 60 | K/W | Soldering point at pin 3 | 4 |
| Forward voltage | VF | | | 0.9 | V | IF = 10 mA; Tamb = 25 °C | 4 |
| Reverse standoff voltage | VRWM | | | 17 | V | Tamb = 25 °C | 4 |
| Breakdown voltage | VBR | 19 | 20 | 21 | V | IR = 1 mA; Tamb = 25 °C | 4 |
| Reverse leakage current | IRM | | 0.1 | 5 | nA | VRWM = 17 V; Tamb = 25 °C | 4 |
| Diode capacitance | Cd | | 65 | 80 | pF | f = 1 MHz; VR = 0 V; Tamb = 25 °C | 4 |
| Clamping voltage | VCL | | | 28 | V | IPPM = 1.4 A; tp = 10/1000 µs; Tamb = 25 °C | 4 |
| Temperature coefficient | SZ | | 15.8 | | mV/K | IZ = 1 mA | 4 |
## CAD (KiCad official)
- Symbol: `MMBZ20VCL`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files: `mmbz20vcl-etched.step` / `mmbz20vcl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mmbz20vcl.step` / `mmbz20vcl.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Nexperia datasheet](https://assets.nexperia.com/documents/data-sheet/MMBZ20VCL.pdf) (11 pp, sha256 `95847ad8a73ea83b`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mmbz20vcl-datasheet.pdf)