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Contents

README

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MMBZ18VCL

Nexperia · ESD And Surge Protection (TVS/ESD) · TO-236AB

MMBZ18VCL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of diode 1 (unidirectional ESD/transient protection for line 1); ratings are measured from pin 1 to pin 3, with rated peak pulse current IPPM 1.6 A (10/1000 µs) and contact-discharge ESD up to 30 kV per IEC 61000-4-2.
2 A2 passive Anode of diode 2 (unidirectional ESD/transient protection for line 2); ratings are measured from pin 2 to pin 3, with rated peak pulse current IPPM 1.6 A (10/1000 µs) and contact-discharge ESD up to 30 kV per IEC 61000-4-2.
3 CC passive Common cathode shared by both diodes and the reference terminal for the pin 1 and pin 2 ratings; it is also the soldering point for the junction-to-solder-point thermal resistance Rth(j-sp) of 60 K/W.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TO-236AB
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
rated peak pulse power PPPM 40 W 2
rated peak pulse current IPPM 1.6 A tp = 10/1000 µs 2
total power dissipation Ptot 350 mW Tamb ≤ 25 °C; device on FR4 PCB, single-sided copper, standard footprint 2
total power dissipation Ptot 440 mW mounting pad for cathode 1 cm2 (footnote [4]); Tamb ≤ 25 °C shared cell 2
junction temperature Tj 150 °C 2
ambient temperature Tamb -55 150 °C 2
storage temperature Tstg -65 150 °C 2
electrostatic discharge voltage VESD 30 kV IEC 61000-4-2; contact discharge; Tamb = 25 °C 3
electrostatic discharge voltage VESD 15 kV IEC 61000-4-2; air discharge 3
electrostatic discharge voltage VESD 8 kV MIL-STD-883; human body model (HBM) 3
thermal resistance from junction to ambient Rth(j-a) 350 K/W Device mounted on FR4 PCB, single-sided copper, tin-plated and standard footprint 4
thermal resistance from junction to ambient Rth(j-a) 280 K/W Device mounted on FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 4
thermal resistance from junction to solder point Rth(j-sp) 60 K/W Soldering point at pin 3 4
forward voltage VF 0.9 V IF = 10 mA; Tamb = 25 °C 4
reverse standoff voltage VRWM 14.5 V Tamb = 25 °C 4
breakdown voltage VBR 17.1 18 18.9 V IR = 1 mA; Tamb = 25 °C 4
reverse leakage current IRM 0.1 5 nA VRWM = 14.5 V; Tamb = 25 °C 4
diode capacitance Cd 70 90 pF f = 1 MHz; VR = 0 V; Tamb = 25 °C 4
clamping voltage VCL 25 V IPPM = 1.6 A; tp = 10/1000 µs; Tamb = 25 °C 4

CAD (KiCad official)

  • Symbol: MMBZ18VCL
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: TO-236AB (KiCad packages3D, STEP)
  • 3D model files: mmbz18vcl-etched.step / mmbz18vcl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz18vcl.step / mmbz18vcl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 a59b08907adcd80c, retrieved 2026-10-16, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF