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MMBZ16VALT1G

Public Made by Adom

by adom

onsemi Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMBZ16VALT1G

onsemi · Zener Diodes · SOT-23

MMBZ16VALT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE 1 passive Cathode of the first Zener junction in the dual common-anode SOT-23 package; for unidirectional use the circuit is tied to Pins 1 and 3.
2 CATHODE 2 passive Cathode of the second Zener junction in the dual common-anode SOT-23 package; for unidirectional use the circuit is tied to Pins 2 and 3.
3 ANODE passive Common anode shared by both Zener junctions, allowing two separate unidirectional configurations or a single bidirectional configuration in one package.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working peak reverse voltage VRWM 13 V 3
Maximum reverse leakage current IR 50 nA @ VRWM 3
Breakdown voltage VBR 15.2 16 16.8 V @ IT = 1.0 mA 3
Maximum temperature coefficient of VBR VBR 13.8 mV/C 3
Forward voltage VF 0.9 V @ IF = 10 mA 3
Clamping voltage VC 23 V @ IPP = 1.7 A, surge per Figure 6 (Note 6) 3
Maximum reverse peak pulse current IPP 1.7 A 3
Peak power dissipation Ppk 40 W @ 1.0 ms, TL ≤ 25°C (Note 1) 2
Total power dissipation on FR-5 board PD 225 mW @ TA = 25°C (Note 2) 2
Total power dissipation on alumina substrate PD 300 mW @ TA = 25°C (Note 3) 2
Junction and storage temperature range TJ, Tstg -55 150 °C 2
Lead solder temperature, maximum (10 s duration) TL 260 °C 10 second duration 2
Thermal resistance junction-to-ambient (FR-5 board) RθJA 556 °C/W FR-5 board (Note 2) 2
Thermal resistance junction-to-ambient (alumina substrate) RθJA 417 °C/W Alumina substrate (Note 3) 2

CAD (KiCad official)

  • Symbol: MMBZ16VALT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbz16valt1g-etched.step / mmbz16valt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz16valt1g.step / mmbz16valt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 5cb1c4fad5e02c73, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF