component

MMBZ15VDLT1G

Public Made by Adom

by adom

onsemi ESD And Surge Protection (TVS/ESD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMBZ15VDLT1G

onsemi · ESD And Surge Protection (TVS/ESD) · SOT-23

MMBZ15VDLT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE 1 passive Anode of the first zener diode of the dual common-cathode pair; for unidirectional use the circuit is tied between pins 1 and 3.
2 ANODE 2 passive Anode of the second zener diode of the dual common-cathode pair; for unidirectional use the circuit is tied between pins 2 and 3.
3 CATHODE passive Common cathode shared by both zener diodes, which allows two separate unidirectional lines or a single bidirectional configuration.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 14.3 15 15.8 V @ IT = 1.0 mA 2
Maximum Reverse Leakage Current IR 100 nA @ VRWM 2
Maximum Reverse Peak Pulse Current IPP 1.9 A Surge waveform per Figure 5 (Note 5) 2
Forward Voltage VF 0.9 V @ IF = 10 mA 2
Maximum Temperature Coefficient of VBR VBR 12 mV/C 2
Peak Power Dissipation Ppk 40 Watts @ 1.0 ms (Note 1), TL ≤ 25°C 2
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C (FR-5 board, Note 2) 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C (Alumina substrate, Note 3) 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Lead Solder Temperature - Maximum (10 Second Duration) TL 260 °C 10 second duration 2
Working Peak Reverse Voltage VRWM 12.8 V 2
Clamping Voltage VC 21.2 V @ IPP (surge per Figure 5, Note 5) 2
Derate above 25°C (FR-5 board) PD 1.8 mW/°C Derate above TA = 25°C 2
Derate above 25°C (Alumina substrate) PD 2.4 mW/°C Derate above TA = 25°C 2
Thermal Resistance Junction-to-Ambient (FR-5 board) RθJA 556 °C/W FR-5 board (Note 2) 2
Thermal Resistance Junction-to-Ambient (Alumina substrate) RθJA 417 °C/W Alumina substrate (Note 3) 2

CAD (KiCad official)

  • Symbol: MMBZ15VDLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbz15vdlt1g-etched.step / mmbz15vdlt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz15vdlt1g.step / mmbz15vdlt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 138275f577e063b5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF