component

MMBZ15VDL

Public Made by Adom

by adom

Nexperia ESD Protection Devices, TO-236AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMBZ15VDL

Nexperia · ESD Protection Devices · TO-236AB

MMBZ15VDL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of diode 1; unidirectional ESD protection for line 1, measured from pin 1 to pin 3 (VRWM 12.8 V max, VBR 15 V typ).
2 A2 passive Anode of diode 2; unidirectional ESD protection for line 2, measured from pin 2 to pin 3 (VRWM 12.8 V max, VBR 15 V typ).
3 CC passive Common cathode of both diodes and solder point for thermal measurement (Rth(j-sp) 60 K/W max); connect to the ground.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TO-236AB
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage VF 0.9 V IF = 10 mA; Tamb = 25 °C 4
Reverse standoff voltage VRWM 12.8 V Tamb = 25 °C 4
Breakdown voltage VBR 14.3 15 15.8 V IR = 1 mA; Tamb = 25 °C 4
Reverse leakage current IRM 0.1 5 nA VRWM = 12.8 V; Tamb = 25 °C 4
Diode capacitance Cd 85 105 pF f = 1 MHz; VR = 0 V; Tamb = 25 °C 4
Clamping voltage VCL 21.2 V IPPM = 1.9 A; tp = 10/1000 µs; Tamb = 25 °C 4
Rated peak pulse power PPPM 40 W tp = 10/1000 µs 3
Rated peak pulse current IPPM 1.9 A tp = 10/1000 µs 3
Total power dissipation (standard footprint) Ptot 350 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 3
Total power dissipation (1 cm2 cathode pad) Ptot 440 mW Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm2 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
ESD voltage, IEC 61000-4-2 contact VESD 30 kV IEC 61000-4-2; contact discharge; Tamb = 25 °C 3
ESD voltage, IEC 61000-4-2 air VESD 15 kV IEC 61000-4-2; air discharge 3
ESD voltage, machine model VESD 2 kV machine model; Tamb = 25 °C 3
ESD voltage, HBM VESD 8 kV MIL-STD-883; human body model (HBM) 3
Thermal resistance junction to ambient (standard footprint) Rth(j-a) 350 K/W FR4 PCB, standard footprint 4
Thermal resistance junction to ambient (1 cm2 cathode pad) Rth(j-a) 280 K/W FR4 PCB, mounting pad for cathode 1 cm2 4
Thermal resistance junction to solder point Rth(j-sp) 60 K/W Soldering point at pin 3 4
Temperature coefficient SZ 11 mV/K IZ = 1 mA; Tamb = 25 °C 4

CAD (KiCad official)

  • Symbol: MMBZ15VDL
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: TO-236AB (KiCad packages3D, STEP)
  • 3D model files: mmbz15vdl-etched.step / mmbz15vdl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz15vdl.step / mmbz15vdl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 13c51f73e6377288, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF