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MMBZ12VA

Public Made by Adom

by adom

Slkor(SLKORMICRO Elec.) ESD And Surge Protection (TVS/ESD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMBZ12VA

Slkor(SLKORMICRO Elec.) · ESD And Surge Protection (TVS/ESD) · SOT-23

MMBZ12VA from Slkor(SLKORMICRO Elec.), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Zener TVS cathode 1, used unidirectionally with pin 3 (VRWM 8.5 V, VBR 11.40 to 12.60 V at 1.0 mA, VC 17 V at IPP 2.35 A for MMBZ12VA), or tied to pin 2 for bidirectional use.
2 K2 passive Zener TVS cathode 2, used unidirectionally with pin 3 (VRWM 8.5 V, VBR 11.40 to 12.60 V at 1.0 mA, VC 17 V at IPP 2.35 A for MMBZ12VA), or tied to pin 1 for bidirectional use.
3 A passive Common anode of the two Zener TVS diodes, shared by the circuits tied to pins 1 and 3 or pins 2 and 3, with forward voltage VF 0.9 V max at IF 10 mA.

Key specifications

Parameter Value
Manufacturer Slkor(SLKORMICRO Elec.)
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 11.4 12 12.6 V @ IT = 1.0 mA 2
Maximum Reverse Leakage Current IR 200 nA @ VRWM 2
Maximum Reverse Peak Pulse Current IPP 2.35 A 2
Maximum Temperature Coefficient of VBR VBR 7.5 mV/°C 2
Forward Voltage VF 0.9 V @ IF = 10 mA 2
Clamping Voltage VC 17 V @ IPP 2
Working Peak Reverse Voltage VRWM 8.5 V 2
Peak Power Dissipation PPK 40 W 1.0 ms pulse, TA = 25°C; MMBZ12VA-MMBZ33VA column 1
Total Power Dissipation on FR-5 Board PD 225 mW FR-5 board, TA = 25°C 1
Derate above 25°C (FR-5 Board) PD 1.8 mW/°C FR-5 board, above TA = 25°C 1
Total Power Dissipation on Alumina Substrate PD 300 mW Alumina substrate, TA = 25°C 1
Derate above 25°C (Alumina Substrate) PD 2.4 mW/°C Alumina substrate, above TA = 25°C 1
Thermal Resistance Junction-to-Ambient (FR-5 Board) RθJA 556 °C/W FR-5 board 1
Thermal Resistance Junction-to-Ambient (Alumina Substrate) RθJA 417 °C/W Alumina substrate 1
Junction and Storage Temperature Range TJ, TSTG -55 150 °C 1
Lead Solder Temperature (Maximum) TL 260 °C 10 second duration 1

CAD (KiCad official)

  • Symbol: MMBZ12VA
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbz12va-etched.step / mmbz12va-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz12va.step / mmbz12va.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Slkor(SLKORMICRO Elec.) datasheet (5 pp, sha256 58984ec1f3d02363, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF