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Ray Publish 0.1.0 4342b41 17d ago

MMBFJ211

onsemi · MOSFETs · SOT-23-3

MMBFJ211 from onsemi, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Drain passive Drain terminal, interchangeable with the source; the drain-gate voltage is rated 25 V maximum (VDG).
2 Source passive Source terminal, interchangeable with the drain; the gate-source breakdown voltage V(BR)GSS is −25 V minimum.
3 Gate input Gate terminal; the gate-source voltage is rated −25 V and the forward gate current IGF is limited to 10 mA maximum.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-Source Breakdown Voltage V(BR)GSS -25 V IG = 1.0 A, VDS = 0 2
Gate Reverse Current IGSS -100 pA VGS = 15 V, VDS = 0 2
Gate-Source Cut-Off Voltage VGS(off) -2.5 -4.5 V VDS = 15 V, ID = 1.0 nA 2
Zero-Gate Voltage Drain Current (Note 4) IDSS 7 20 mA VDS = 15 V, VGS = 0 2
Common Source Forward Transconductance gfs 7000 12000 mhos VDS = 15 V, VGS = 0, f = 1.0 kHz 2
Common Source Output Conductance goss 200 mhos VDS = 15 V, VGS = 0, f = 1.0 kHz 2
Drain-Gate Voltage VDG 25 V 1
Gate-Source Voltage VGS -25 V 1
Forward Gate Current IGF 10 mA 1
Operating and Storage Junction Temperature Range TJ, TSTG -55 150 °C 1
Total Device Dissipation (MMBFJ211) PD 225 mW TA = 25°C, device mounted on FR-4 PCB 36 mm x 18 mm x 1.5 mm, collector pad min 6 cm2 (Note 3) 1
Derate Above 25°C (MMBFJ211) PD derate 1.8 mW/°C Above 25°C, Note 3 1
Thermal Resistance, Junction-to-Ambient (MMBFJ211) RJA 556 °C/W Note 3 1

CAD (KiCad official)

  • Symbol: MMBFJ211
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: mmbfj211-etched.step / mmbfj211-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbfj211.step / mmbfj211.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 d883d483cd3509d8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF