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MMBFJ202

onsemi · MOSFETs · SOT-23

MMBFJ202 from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D passive Drain; the datasheet notes source and drain are interchangeable, with VDG rated at 40 V maximum.
2 S passive Source; interchangeable with drain per the datasheet note, with VGS rated at -40 V.
3 G input Gate of the N-channel JFET; forward gate current is limited to 50 mA maximum and gate-source breakdown voltage is -40 V minimum.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-Source Breakdown Voltage V(BR)GSS -40 V IG = -1.0 μA, VDS = 0 3
Gate Reverse Current IGSS -100 pA VGS = -20 V, VDS = 0 3
Gate-Source Cut-Off Voltage (MMBFJ202) VGS(off) -0.8 -4 V VDS = 20 V, ID = 10 nA 3
Zero-Gate Voltage Drain Current (MMBFJ202) IDSS 0.9 4.5 mA VDS = 20 V, IGS = 0 3
Forward Transfer Admittance (MMBFJ202) yFS 1000 μmhos VDS = 20 V, f = 1.0 kHz 3
Drain-Gate Voltage VDG 40 V 2
Gate-Source Voltage VGS -40 V 2
Forward Gate Current IGF 50 mA 2
Operating and Storage Junction Temperature Range TJ, TSTG -55 150 °C 2
Total Device Dissipation PD 350 mW Device mounted on FR-4 PCB 36mm × 18mm × 1.5mm; mounting pad for the collector lead minimum 6cm2 3
Derate Above 25°C 2.8 mW/°C Device mounted on FR-4 PCB 36mm × 18mm × 1.5mm; mounting pad for the collector lead minimum 6cm2 3
Thermal Resistance, Junction-to-Ambient RθJA 357 °C/W Device mounted on FR-4 PCB 36mm × 18mm × 1.5mm; mounting pad for the collector lead minimum 6cm2 3

CAD (KiCad official)

  • Symbol: MMBFJ202
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbfj202-etched.step / mmbfj202-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbfj202.step / mmbfj202.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (10 pp, sha256 26c79daa9020edaa, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF