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Contents

README

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MMBF0201NL-HXY

HXY MOSFET · MOSFETs · SOT-23

MMBF0201NL-HXY from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET, rated for VGS = ±12 V and specified with RDS(ON) below 60 mΩ at VGS = 4.5 V, with operation at gate voltages as low as 2.5 V.
2 D passive Drain terminal, rated for VDS = 20 V with continuous drain current ID = 2.3 A and pulsed drain current IDM = 16 A.
3 S passive Source terminal, the reference for the VGS ±12 V rating and the body diode forward current limit IS = 3.3 A.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 22 V VGS=0V, ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=20V, VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±12V, VDS=0V 2
Gate Threshold Voltage VGS(th) 0.5 0.75 1.2 V VDS=VGS, ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 54 72 mΩ VGS=2.5V, ID=2.0A 2
Drain-Source On-State Resistance RDS(ON) 48 60 mΩ VGS=4.5V, ID=2.3A 2
Total Gate Charge Qg 2.9 5 nC VDS=10V, ID=2.3A, VGS=4.5V 2
Diode Forward Voltage (Note 3) VSD 0.75 1.2 V VGS=0V, IS=2.3A; Pulse test: pulse width ≤ 300μs, duty cycle ≤ 2% 2
Diode Forward Current (Note 2) IS 3.3 A 2
Drain-Source Voltage VDS 20 V TA=25℃ unless otherwise noted 1
Gate-Source Voltage VGS -12 12 V TA=25℃ unless otherwise noted 1
Drain Current-Continuous ID 2.3 A TA=25℃ unless otherwise noted 1
Drain Current-Pulsed (Note 1) IDM 16 A Repetitive rating: pulse width limited by maximum junction temperature 1
Maximum Power Dissipation PD 0.9 W TA=25℃ unless otherwise noted 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient (Note 2) θJA 139 ℃/W Surface mounted on FR4 board, t ≤ 10 sec 1

CAD (KiCad official)

  • Symbol: MMBF0201NL-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbf0201nl-hxy-etched.step / mmbf0201nl-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbf0201nl-hxy.step / mmbf0201nl-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 b8491dd9c4e1e0e9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF