component
MMBD6050LT1G
Public Made by Adomby adom
onsemi Switching Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMMBD6050LT1G
onsemi · Switching Diodes · SOT-23
MMBD6050LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ANODE | passive | Anode terminal of the switching diode; the device is rated for a 70 V reverse voltage (VR) and 200 mA forward current (IF). |
| 2 | NC | unconnected | No connection (Style 8 pin 2); this pin is not connected internally. |
| 3 | CATHODE | passive | Cathode terminal of the switching diode; the device is rated for a 70 V reverse voltage (VR) and 200 mA forward current (IF). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Voltage | VR | 70 | Vdc | 1 | |||
| Forward Current | IF | 200 | mAdc | 1 | |||
| Peak Forward Surge Current | IFM(surge) | 500 | mAdc | 1 | |||
| Junction and Storage Temperature | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Reverse Breakdown Voltage | VR | 70 | Vdc | I(BR) = 100 Adc | 1 | ||
| Reverse Voltage Leakage Current | IR | 0.1 | Adc | VR = 50 Vdc | 1 | ||
| Forward Voltage | VF | 0.55 | 0.7 | Vdc | IF = 1.0 mAdc | 1 | |
| Forward Voltage | VF | 0.85 | 1.1 | Vdc | IF = 100 mAdc | 1 | |
| Reverse Recovery Time | tRR | 4 | ns | IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc (Figure 1) | 1 | ||
| Capacitance | CD | 2.5 | pF | VR = 0 V | 1 | ||
| Total Device Dissipation, FR-5 Board | PD | 225 | mW | FR-5 board (Note 1), TA = 25°C | 1 | ||
| Thermal Resistance, Junction-to-Ambient, FR-5 Board | RθJA | 556 | °C/W | FR-5 board (Note 1) | 1 | ||
| Total Device Dissipation, Alumina Substrate | PD | 300 | mW | Alumina substrate (Note 2), TA = 25°C | 1 | ||
| Thermal Resistance, Junction-to-Ambient, Alumina Substrate | RθJA | 417 | °C/W | Alumina substrate (Note 2) | 1 |
CAD (KiCad official)
- Symbol:
MMBD6050LT1G - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
mmbd6050lt1g-etched.step/mmbd6050lt1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mmbd6050lt1g.step/mmbd6050lt1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (3 pp, sha256
7a42d6bbed1cf2a3, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).