component
MMBD4448HSDW-7-F
Public Made by Adomby adom
Diodes Incorporated Fast Recovery / High Efficiency Diodes, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MMBD4448HSDW-7-F
Diodes Incorporated · Fast Recovery / High Efficiency Diodes · SOT-363
MMBD4448HSDW-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of diode 1 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 2 | C1 | passive | Cathode of diode 1 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 3 | AC2 | passive | Combined anode/cathode node (AC2) of the MMBD4448HSDW array, shown as a junction between two diodes in the pin diagram. |
| 4 | A2 | passive | Anode of diode 2 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 5 | C2 | passive | Cathode of diode 2 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 6 | AC1 | passive | Combined anode/cathode node (AC1) of the MMBD4448HSDW array, shown as a junction between two diodes in the pin diagram. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-363 |
| Category | Diodes |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Non-Repetitive Peak Reverse Voltage | VRM | 100 | V | 2 | |||
| Peak Repetitive Reverse Voltage | VRRM | 80 | V | 2 | |||
| Working Peak Reverse Voltage | VRWM | 80 | V | 2 | |||
| DC Blocking Voltage | VR | 80 | V | 2 | |||
| RMS Reverse Voltage | VR(RMS) | 57 | V | 2 | |||
| Forward Continuous Current | IFM | 500 | mA | Note 5 | 2 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 4 | A | t = 1.0 µs | 2 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 1 | A | t = 1.0 ms | 2 | ||
| Power Dissipation | PD | 200 | mW | Note 5 (device on FR-4 PCB, 1 inch square, 2oz copper pad) | 2 | ||
| Thermal Resistance Junction to Ambient Air | RθJA | 625 | °C/W | Note 5 (device on FR-4 PCB, 1 inch square, 2oz copper pad) | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Reverse Breakdown Voltage | V(BR)R | 80 | V | IR = 100µA | 2 | ||
| Forward Voltage | VF | 0.62 | 0.72 | V | IF = 5.0mA | 2 | |
| Forward Voltage | VF | 0.855 | V | IF = 10mA | 2 | ||
| Forward Voltage | VF | 1 | V | IF = 100mA | 2 | ||
| Forward Voltage | VF | 1.25 | V | IF = 150mA | 2 | ||
| Reverse Current | IR | 100 | nA | VR = 70V | 2 | ||
| Reverse Current | IR | 50 | µA | VR = 75V, TJ = +150°C | 2 | ||
| Reverse Current | IR | 30 | µA | VR = 25V, TJ = +150°C | 2 | ||
| Reverse Current | IR | 25 | nA | VR = 20V | 2 | ||
| Total Capacitance | CT | 3.5 | pF | VR = 6V, f = 1.0MHz | 2 | ||
| Reverse-Recovery Time | trr | 4 | ns | VR = 6V, IF = 5mA | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
MMBD4448HSDW-7-F - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
mmbd4448hsdw-7-f-etched.step/mmbd4448hsdw-7-f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mmbd4448hsdw-7-f.step/mmbd4448hsdw-7-f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (6 pp, sha256
85746316f9922222, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MMBD4448HSDW-7-F
**Diodes Incorporated** · Fast Recovery / High Efficiency Diodes · SOT-363
MMBD4448HSDW-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of diode 1 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 2 | C1 | passive | Cathode of diode 1 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 3 | AC2 | passive | Combined anode/cathode node (AC2) of the MMBD4448HSDW array, shown as a junction between two diodes in the pin diagram. |
| 4 | A2 | passive | Anode of diode 2 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 5 | C2 | passive | Cathode of diode 2 in the MMBD4448HSDW array (80V VRRM, 500mA forward continuous current per datasheet ratings). |
| 6 | AC1 | passive | Combined anode/cathode node (AC1) of the MMBD4448HSDW array, shown as a junction between two diodes in the pin diagram. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-363 |
| Category | Diodes |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Non-Repetitive Peak Reverse Voltage | VRM | | | 100 | V | | 2 |
| Peak Repetitive Reverse Voltage | VRRM | | | 80 | V | | 2 |
| Working Peak Reverse Voltage | VRWM | | | 80 | V | | 2 |
| DC Blocking Voltage | VR | | | 80 | V | | 2 |
| RMS Reverse Voltage | VR(RMS) | | | 57 | V | | 2 |
| Forward Continuous Current | IFM | | | 500 | mA | Note 5 | 2 |
| Non-Repetitive Peak Forward Surge Current | IFSM | | | 4 | A | t = 1.0 µs | 2 |
| Non-Repetitive Peak Forward Surge Current | IFSM | | | 1 | A | t = 1.0 ms | 2 |
| Power Dissipation | PD | | | 200 | mW | Note 5 (device on FR-4 PCB, 1 inch square, 2oz copper pad) | 2 |
| Thermal Resistance Junction to Ambient Air | RθJA | | | 625 | °C/W | Note 5 (device on FR-4 PCB, 1 inch square, 2oz copper pad) | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | °C | | 2 |
| Reverse Breakdown Voltage | V(BR)R | 80 | | | V | IR = 100µA | 2 |
| Forward Voltage | VF | 0.62 | | 0.72 | V | IF = 5.0mA | 2 |
| Forward Voltage | VF | | | 0.855 | V | IF = 10mA | 2 |
| Forward Voltage | VF | | | 1 | V | IF = 100mA | 2 |
| Forward Voltage | VF | | | 1.25 | V | IF = 150mA | 2 |
| Reverse Current | IR | | | 100 | nA | VR = 70V | 2 |
| Reverse Current | IR | | | 50 | µA | VR = 75V, TJ = +150°C | 2 |
| Reverse Current | IR | | | 30 | µA | VR = 25V, TJ = +150°C | 2 |
| Reverse Current | IR | | | 25 | nA | VR = 20V | 2 |
| Total Capacitance | CT | | | 3.5 | pF | VR = 6V, f = 1.0MHz | 2 |
| Reverse-Recovery Time | trr | | | 4 | ns | VR = 6V, IF = 5mA | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | • Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 | 1 |
## CAD (KiCad official)
- Symbol: `MMBD4448HSDW-7-F`
- Footprint: `Package_TO_SOT_SMD:SOT-363_SC-70-6`
- 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files: `mmbd4448hsdw-7-f-etched.step` / `mmbd4448hsdw-7-f-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mmbd4448hsdw-7-f.step` / `mmbd4448hsdw-7-f.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588909486925369344) (6 pp, sha256 `85746316f9922222`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mmbd4448hsdw-7-f-datasheet.pdf)