component

MM74HCT245WM

Public Made by Adom

by adom

onsemi Buffers / Drivers, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentlogic icsmm74hct245wmfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 3h ago
viewers mm74hct245wm: viewers · Ray 3h ago
mm74hct245wm-etched.glb Publish 0.1.0 · Ray 3h ago
mm74hct245wm-etched.step mm74hct245wm: factory component page (tier=mfr) · Ray 3h ago
mm74hct245wm-hero.glb mm74hct245wm: hero GLB from the etched model (keeps the MPN mark) · Ray 3h ago
mm74hct245wm-hero.overlay.json Publish 0.1.0 · Ray 3h ago
mm74hct245wm.glb Publish 0.1.0 · Ray 3h ago
mm74hct245wm.kicad_mod Publish 0.1.0 · Ray 3h ago
mm74hct245wm.kicad_sym Publish 0.1.0 · Ray 3h ago
mm74hct245wm.lbr Publish 0.1.0 · Ray 3h ago
mm74hct245wm.step Publish 0.1.0 · Ray 3h ago
package.json Publish 0.1.0 · Ray 3h ago
page.json Set visibility: public · Ray 3h ago
README.md Publish 0.1.0 · Ray 3h ago

MM74HCT245WM

onsemi · Buffers / Drivers · SOIC-20-300mil

MM74HCT245WM from onsemi, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIR input Direction control input: HIGH passes data from A to B, LOW passes data from B to A.
2 A1 bidirectional A-bus data I/O 1, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
3 A2 bidirectional A-bus data I/O 2, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
4 A3 bidirectional A-bus data I/O 3, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
5 A4 bidirectional A-bus data I/O 4, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
6 A5 bidirectional A-bus data I/O 5, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
7 A6 bidirectional A-bus data I/O 6, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
8 A7 bidirectional A-bus data I/O 7, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
9 A8 bidirectional A-bus data I/O 8, 3-STATE; input when DIR is HIGH, output when DIR is LOW.
10 GND power_in Ground, 0 V reference.
11 B8 bidirectional B-bus data I/O 8, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
12 B7 bidirectional B-bus data I/O 7, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
13 B6 bidirectional B-bus data I/O 6, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
14 B5 bidirectional B-bus data I/O 5, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
15 B4 bidirectional B-bus data I/O 4, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
16 B3 bidirectional B-bus data I/O 3, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
17 B2 bidirectional B-bus data I/O 2, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
18 B1 bidirectional B-bus data I/O 1, 3-STATE; output when DIR is HIGH, input when DIR is LOW.
19 G input Active-low enable input; when HIGH the A and B buses are isolated (outputs 3-STATE).
20 VCC power_in Supply voltage, recommended 4.5 V to 5.5 V (absolute maximum -0.5 to 7.0 V).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-20-300mil
Category Logic ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum HIGH Level Input Voltage VIH 2 V VCC 5V ±10%, TA -40 to 85°C 4
Maximum LOW Level Input Voltage VIL 0.8 V VCC 5V ±10%, TA -40 to 85°C 4
Minimum HIGH Level Output Voltage VOH 3.84 4.2 V VIN = VIH or VIL, /IOUT/ = 6.0 mA, VCC = 4.5V, TA -40 to 85°C 4
Minimum HIGH Level Output Voltage VOH 4.84 5.2 V VIN = VIH or VIL, /IOUT/ = 7.2 mA, VCC = 5.5V, TA -40 to 85°C 4
Maximum LOW Level Output Voltage VOL 0 0.1 V VIN = VIH or VIL, /IOUT/ = 20 µA, TA -40 to 85°C 4
Maximum LOW Level Output Voltage VOL 0.2 0.33 V VIN = VIH or VIL, /IOUT/ = 6.0 mA, VCC = 4.5V, TA -40 to 85°C 4
Maximum Input Current IIN -1 1 µA VIN = VCC or GND, VIH or VIL, Pin 1 or 19, TA -40 to 85°C 4
Maximum 3-STATE Output Leakage Current IOZ -5 5 µA VOUT = VCC or GND, G = VIH, TA -40 to 85°C 4
Maximum Quiescent Supply Current ICC 8 80 µA VIN = VCC or GND, IOUT = 0 µA, TA -40 to 85°C 4
Maximum Quiescent Supply Current ICC 0.6 1.3 mA VIN = 2.4V or 0.5V (Note 4), TA -40 to 85°C 4
Maximum Output Propagation Delay tPHL, tPLH 17 29 ns CL = 50 pF, VCC 5.0V ±10%, TA -40 to 85°C 5
Maximum Output Propagation Delay tPHL, tPLH 24 38 ns CL = 150 pF, VCC 5.0V ±10%, TA -40 to 85°C 5
Maximum Output Enable Time tPZL 31 53 ns RL = 1 kΩ, CL = 50 pF, TA -40 to 85°C 5
Maximum Output Enable Time tPZH 23 41 ns RL = 1 kΩ, CL = 50 pF, TA -40 to 85°C 5
Maximum Output Disable Time tPHZ, tPLZ 21 38 ns RL = 1 kΩ, CL = 50 pF, TA -40 to 85°C 5
Maximum Output Rise and Fall Time tTHL, tTLH 8 15 ns CL = 50 pF, TA -40 to 85°C 5
Maximum Input Capacitance CIN 10 15 pF TA -40 to 85°C 5
Maximum Output/Input Capacitance COUT 20 25 pF TA -40 to 85°C 5
Supply Voltage VCC 4.5 5.5 V 4
DC Input or Output Voltage VIN, VOUT 0 V 0 to VCC 4
Operating Temperature Range TA -40 85 °C 4
Input Rise or Fall Times tr, tf 500 ns 4
Supply Voltage VCC -0.5 7 V 4
DC Input Voltage VIN -1.5 V -1.5 to VCC + 1.5V 4
DC Output Voltage VOUT -0.5 V -0.5 to VCC + 0.5V 4
Clamp Diode Current IIK, IOK -20 20 mA 4
DC Output Current IOUT -35 35 mA 4
DC VCC or GND Current, per pin ICC -70 70 mA 4
Storage Temperature Range TSTG -65 150 °C 4
Power Dissipation PD 600 mW Note 3 4
Power Dissipation, S.O. Package only PD 500 mW S.O. Package only 4
Lead Temperature TL 260 °C Soldering 10 seconds 4
Power Dissipation Capacitance CPD 7 pF G = VCC (Note 5) 5
Power Dissipation Capacitance CPD 100 pF G = GND (Note 5) 5

CAD (KiCad official)

  • Symbol: MM74HCT245WM
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: mm74hct245wm-etched.step / mm74hct245wm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mm74hct245wm.step / mm74hct245wm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (10 pp, sha256 6d9408b00aa346a8, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF