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MM74HC08MX

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by adom

onsemi Logic Gates, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MM74HC08MX

onsemi · Logic Gates · SOIC-14

MM74HC08MX from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 input Gate 1 input A; inputs are clamped to VCC and ground with low input current of 1µA maximum.
2 B1 input Gate 1 input B; inputs are clamped to VCC and ground with low input current of 1µA maximum.
3 Y1 output Gate 1 buffered AND output able to drive 10 LS-TTL loads.
4 A2 input Gate 2 input A; inputs are clamped to VCC and ground with low input current of 1µA maximum.
5 B2 input Gate 2 input B; inputs are clamped to VCC and ground with low input current of 1µA maximum.
6 Y2 output Gate 2 buffered AND output able to drive 10 LS-TTL loads.
7 GND power_in Ground reference (0 V) for the device.
8 Y3 output Gate 3 buffered AND output able to drive 10 LS-TTL loads.
9 A3 input Gate 3 input A; inputs are clamped to VCC and ground with low input current of 1µA maximum.
10 B3 input Gate 3 input B; inputs are clamped to VCC and ground with low input current of 1µA maximum.
11 Y4 output Gate 4 buffered AND output able to drive 10 LS-TTL loads.
12 A4 input Gate 4 input A; inputs are clamped to VCC and ground with low input current of 1µA maximum.
13 B4 input Gate 4 input B; inputs are clamped to VCC and ground with low input current of 1µA maximum.
14 VCC power_in Supply voltage, recommended 2 V to 6 V (absolute maximum -0.5 to +7.0 V).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 2 6 V 3
Operating Temperature Range TA -40 85 °C 3
Input Rise or Fall Time tr, tf 1000 ns VCC = 2.0 V 3
Input Rise or Fall Time tr, tf 500 ns VCC = 4.5 V 3
Input Rise or Fall Time tr, tf 400 ns VCC = 6.0 V 3
Supply Voltage VCC -0.5 7 V 3
DC Input Voltage VIN -1.5 V Upper limit printed as VCC+1.5 V 3
DC Output Voltage VOUT -0.5 V Upper limit printed as VCC+0.5 V 3
Clamp Diode Current IIK, IOK -20 20 mA 3
DC Output Current, per pin IOUT -25 25 mA 3
DC VCC or GND Current, per pin ICC -50 50 mA 3
Storage Temperature Range TSTG -65 150 °C 3
Power Dissipation PD 600 mW Note 2 3
Power Dissipation (S.O. package only) PD 500 mW S.O. package only 3
Lead Temperature (soldering) TL 260 °C Soldering 10 seconds 3
Minimum HIGH Level Input Voltage VIH 1.5 1.5 V VCC = 2.0 V 4
Minimum HIGH Level Input Voltage VIH 3.15 3.15 V VCC = 4.5 V 4
Minimum HIGH Level Input Voltage VIH 4.2 4.2 V VCC = 6.0 V 4
Maximum LOW Level Input Voltage VIL 0.5 0.5 V VCC = 2.0 V 4
Maximum LOW Level Input Voltage VIL 1.35 1.35 V VCC = 4.5 V 4
Maximum LOW Level Input Voltage VIL 1.8 1.8 V VCC = 6.0 V 4
Minimum HIGH Level Output Voltage VOH 1.9 2 V VCC = 2.0 V, VIN = VIH, /IOUT/ ≤ 20µA 4
Minimum HIGH Level Output Voltage VOH 4.4 4.5 V VCC = 4.5 V, VIN = VIH, /IOUT/ ≤ 20µA 4
Minimum HIGH Level Output Voltage VOH 5.9 6 V VCC = 6.0 V, VIN = VIH, /IOUT/ ≤ 20µA 4
Minimum HIGH Level Output Voltage VOH 3.84 4.2 V VCC = 4.5 V, VIN = VIH, /IOUT/ ≤ 4.0mA 4
Minimum HIGH Level Output Voltage VOH 5.34 5.7 V VCC = 6.0 V, VIN = VIH, /IOUT/ ≤ 5.2mA 4
Maximum LOW Level Output Voltage VOL 0 0.1 V VCC = 2.0 V, VIN = VIH or VIL, /IOUT/ ≤ 20µA 4
Maximum LOW Level Output Voltage VOL 0.2 0.33 V VCC = 4.5 V, VIN = VIH or VIL, /IOUT/ ≤ 4.0mA 4
Maximum Input Current IIN -1 0.1 1 µA VCC = 6.0 V, VIN = VCC or GND 4
Maximum Quiescent Supply Current ICC 20 µA VCC = 6.0 V, VIN = VCC or GND, IOUT = 0 µA 4
Maximum Propagation Delay, Output HIGH-to-LOW tPHL 12 20 ns VCC = 5 V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns 5
Maximum Propagation Delay, Output LOW-to-HIGH tPLH 7 15 ns VCC = 5 V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns 5
Maximum Propagation Delay, Output HIGH-to-LOW tPHL 77 121 ns VCC = 2.0 V, CL = 50 pF, tr = tf = 6 ns 5
Maximum Propagation Delay, Output HIGH-to-LOW tPHL 15 24 ns VCC = 4.5 V, CL = 50 pF, tr = tf = 6 ns 5
Maximum Propagation Delay, Output HIGH-to-LOW tPHL 13 20 ns VCC = 6.0 V, CL = 50 pF, tr = tf = 6 ns 5
Maximum Propagation Delay, Output LOW-to-HIGH tPLH 30 90 ns VCC = 2.0 V, CL = 50 pF, tr = tf = 6 ns 5
Maximum Propagation Delay, Output LOW-to-HIGH tPLH 10 18 ns VCC = 4.5 V, CL = 50 pF, tr = tf = 6 ns 5
Maximum Propagation Delay, Output LOW-to-HIGH tPLH 8 15 ns VCC = 6.0 V, CL = 50 pF, tr = tf = 6 ns 5
Maximum Output Rise and Fall Time tTLH, tTHL 30 75 ns VCC = 2.0 V 5
Maximum Output Rise and Fall Time tTLH, tTHL 8 15 ns VCC = 4.5 V 5
Maximum Output Rise and Fall Time tTLH, tTHL 7 13 ns VCC = 6.0 V 5
Maximum Input Capacitance CIN 4 10 pF 5

CAD (KiCad official)

  • Symbol: MM74HC08MX
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mm74hc08mx-etched.step / mm74hc08mx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mm74hc08mx.step / mm74hc08mx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 c0f3db7de36cc716, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF