component
MM74HC08M
Public Made by Adomby adom
onsemi Gates, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| docs | 7d ago |
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| mm74hc08m-etched.step | 7d ago |
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| README.md | 7d ago |
MM74HC08M
onsemi · Gates · SOIC-14
MM74HC08M from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | input | Gate 1 input A; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 2 | B1 | input | Gate 1 input B; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 3 | Y1 | output | Gate 1 buffered output (A1 AND B1), drives 10 LS-TTL loads, with max DC output current of ±25mA per pin. |
| 4 | A2 | input | Gate 2 input A; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 5 | B2 | input | Gate 2 input B; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 6 | Y2 | output | Gate 2 buffered output (A2 AND B2), drives 10 LS-TTL loads, with max DC output current of ±25mA per pin. |
| 7 | GND | power_in | Ground reference (0V) for the device; max DC VCC or GND current is ±50mA. |
| 8 | Y3 | output | Gate 3 buffered output (A3 AND B3), drives 10 LS-TTL loads, with max DC output current of ±25mA per pin. |
| 9 | A3 | input | Gate 3 input A; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 10 | B3 | input | Gate 3 input B; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 11 | Y4 | output | Gate 4 buffered output (A4 AND B4), drives 10 LS-TTL loads, with max DC output current of ±25mA per pin. |
| 12 | A4 | input | Gate 4 input A; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 13 | B4 | input | Gate 4 input B; inputs are clamped to VCC and ground, max input current ±1.0µA at VCC = 6.0V over -40°C to 85°C. |
| 14 | VCC | power_in | Positive supply voltage, recommended 2V to 6V (absolute maximum -0.5 to +7.0V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-14 |
| Category | Logic ICs |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | -0.5 | 7 | V | 3 | ||
| DC Output Voltage | VOUT | -0.5 | V | -0.5 to VCC+0.5V | 3 | ||
| Clamp Diode Current | IIK, IOK | -20 | 20 | mA | ±20mA | 3 | |
| DC Output Current, per pin | IOUT | -25 | 25 | mA | ±25mA | 3 | |
| DC VCC or GND Current, per pin | ICC | -50 | 50 | mA | ±50mA | 3 | |
| Storage Temperature Range | TSTG | -65 | 150 | °C | 3 | ||
| Power Dissipation | PD | 600 | mW | Note 2 | 3 | ||
| Power Dissipation, S.O. Package only | PD | 500 | mW | S.O. Package only | 3 | ||
| Lead Temperature | TL | 260 | °C | Soldering 10 seconds | 3 | ||
| Supply Voltage | VCC | 2 | 6 | V | 3 | ||
| DC Input or Output Voltage | VIN, VOUT | 0 | V | 0 to VCC | 3 | ||
| Operating Temperature Range | TA | -40 | 85 | °C | 3 | ||
| Input Rise or Fall Time | tr, tf | 1000 | ns | VCC = 2.0V | 3 | ||
| Input Rise or Fall Time | tr, tf | 500 | ns | VCC = 4.5V | 3 | ||
| Input Rise or Fall Time | tr, tf | 400 | ns | VCC = 6.0V | 3 | ||
| Minimum HIGH Level Input Voltage | VIH | 1.5 | V | VCC = 2.0V, TA = -40°C to 85°C | 4 | ||
| Minimum HIGH Level Input Voltage | VIH | 3.15 | V | VCC = 4.5V, TA = -40°C to 85°C | 4 | ||
| Minimum HIGH Level Input Voltage | VIH | 4.2 | V | VCC = 6.0V, TA = -40°C to 85°C | 4 | ||
| Maximum LOW Level Input Voltage | VIL | 0.5 | V | VCC = 2.0V, TA = -40°C to 85°C | 4 | ||
| Maximum LOW Level Input Voltage | VIL | 1.35 | V | VCC = 4.5V, TA = -40°C to 85°C | 4 | ||
| Maximum LOW Level Input Voltage | VIL | 1.8 | V | VCC = 6.0V, TA = -40°C to 85°C | 4 | ||
| Minimum HIGH Level Output Voltage | VOH | 1.9 | 2 | V | VCC = 2.0V, VIN = VIH, /IOUT/ ≤ 20µA, TA = -40°C to 85°C | 4 | |
| Minimum HIGH Level Output Voltage | VOH | 4.4 | 4.5 | V | VCC = 4.5V, VIN = VIH, /IOUT/ ≤ 20µA, TA = -40°C to 85°C | 4 | |
| Minimum HIGH Level Output Voltage | VOH | 5.9 | 6 | V | VCC = 6.0V, VIN = VIH, /IOUT/ ≤ 20µA, TA = -40°C to 85°C | 4 | |
| Minimum HIGH Level Output Voltage | VOH | 3.84 | 4.2 | V | VCC = 4.5V, VIN = VIH, /IOUT/ ≤ 4.0mA, TA = -40°C to 85°C | 4 | |
| Minimum HIGH Level Output Voltage | VOH | 5.34 | 5.7 | V | VCC = 6.0V, VIN = VIH, /IOUT/ ≤ 5.2mA, TA = -40°C to 85°C | 4 | |
| Maximum LOW Level Output Voltage | VOL | 0 | 0.1 | V | VCC = 2.0V, VIN = VIH or VIL, /IOUT/ ≤ 20µA, TA = -40°C to 85°C | 4 | |
| Maximum LOW Level Output Voltage | VOL | 0.2 | 0.33 | V | VCC = 4.5V, VIN = VIH or VIL, /IOUT/ ≤ 4.0mA, TA = -40°C to 85°C | 4 | |
| Maximum Input Current | IIN | -1 | 1 | µA | VCC = 6.0V, VIN = VCC or GND, TA = -40°C to 85°C | 4 | |
| Maximum Quiescent Supply Current | ICC | 2 | 20 | µA | VCC = 6.0V, VIN = VCC or GND, IOUT = 0µA, TA = -40°C to 85°C | 4 | |
| Maximum Propagation Delay, Output HIGH-to-LOW | tPHL | 12 | 20 | ns | VCC = 5V, TA = 25°C, CL = 15pF, tr = tf = 6ns | 5 | |
| Maximum Propagation Delay, Output LOW-to-HIGH | tPLH | 7 | 15 | ns | VCC = 5V, TA = 25°C, CL = 15pF, tr = tf = 6ns | 5 | |
| Maximum Propagation Delay, Output HIGH-to-LOW | tPHL | 77 | 121 | ns | VCC = 2.0V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Propagation Delay, Output HIGH-to-LOW | tPHL | 15 | 24 | ns | VCC = 4.5V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Propagation Delay, Output HIGH-to-LOW | tPHL | 13 | 20 | ns | VCC = 6.0V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Propagation Delay, Output LOW-to-HIGH | tPLH | 30 | 90 | ns | VCC = 2.0V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Propagation Delay, Output LOW-to-HIGH | tPLH | 10 | 18 | ns | VCC = 4.5V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Propagation Delay, Output LOW-to-HIGH | tPLH | 8 | 15 | ns | VCC = 6.0V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Output Rise and Fall Time | tTLH, tTHL | 30 | 75 | ns | VCC = 2.0V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Output Rise and Fall Time | tTLH, tTHL | 8 | 15 | ns | VCC = 4.5V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Output Rise and Fall Time | tTLH, tTHL | 7 | 13 | ns | VCC = 6.0V, CL = 50pF, TA = 25°C | 5 | |
| Maximum Propagation Delay, Output HIGH-to-LOW | tPHL | 175 | ns | VCC = 2.0V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Propagation Delay, Output HIGH-to-LOW | tPHL | 35 | ns | VCC = 4.5V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Propagation Delay, Output HIGH-to-LOW | tPHL | 30 | ns | VCC = 6.0V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Propagation Delay, Output LOW-to-HIGH | tPLH | 134 | ns | VCC = 2.0V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Propagation Delay, Output LOW-to-HIGH | tPLH | 27 | ns | VCC = 4.5V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Propagation Delay, Output LOW-to-HIGH | tPLH | 23 | ns | VCC = 6.0V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Output Rise and Fall Time | tTLH, tTHL | 110 | ns | VCC = 2.0V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Output Rise and Fall Time | tTLH, tTHL | 22 | ns | VCC = 4.5V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Output Rise and Fall Time | tTLH, tTHL | 19 | ns | VCC = 6.0V, CL = 50pF, TA = -40°C to 125°C (as printed) | 5 | ||
| Maximum Input Capacitance | CIN | 4 | 10 | pF | TA = 25°C and TA = -40°C to 125°C (as printed) | 5 | |
| Power Dissipation Capacitance (per gate) | CPD | 38 | pF | 5 |
CAD (KiCad official)
- Symbol:
MM74HC08M - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
mm74hc08m-etched.step/mm74hc08m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mm74hc08m.step/mm74hc08m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
a47f272265090245, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).