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MM1Z56

Public Made by Adom

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Shandong Jingdao Microelectronics Zener Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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MM1Z56

Shandong Jingdao Microelectronics · Zener Diodes · SOD-123

MM1Z56 from Shandong Jingdao Microelectronics, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the Zener diode; the datasheet gives the pinout only, with the device rated at 500 mW maximum total power dissipation and -55 to +150 °C junction and storage temperature.
2 Anode passive Anode terminal of the Zener diode; the datasheet gives the pinout only, with the device rated at 500 mW maximum total power dissipation and -55 to +150 °C junction and storage temperature.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZT 52 56 60 V VZT tested with pulses (20 ms) at IZT; Min/Nom/Max columns for MM1Z56 2
Tolerance (series, as printed) -5 5 % Printed as 'Tolerance approximately ±5%' in FEATURES; no part-number tolerance letter in datasheet 1
Dynamic impedance ZZT 180 Ω at IZT (test current column value for MM1Z56) 2
Total power dissipation Ptot 500 mW Ta = 25 °C 1
Operating and storage temperature range Tj, Tstg -55 150 °C 1
Forward voltage VF 0.9 V IF = 10 mA 1
Typical thermal resistance junction to ambient RθJA 340 °C/W PCB mounted with 2.0" x 2.0" (54 x 5 cm) copper pad areas (footnote 1) 1

CAD (KiCad official)

  • Symbol: MM1Z56
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: mm1z56-etched.step / mm1z56-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mm1z56.step / mm1z56.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 8602e76c9086db90, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF