component
MM1W33
Public Made by Adomby adom
Shandong Jingdao Microelectronics Zener Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMM1W33
Shandong Jingdao Microelectronics · Zener Diodes · SOD-123
MM1W33 from Shandong Jingdao Microelectronics, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the zener diode, pin 1 in the SOD-123 PINNING table and outline symbol. |
| 2 | Anode | passive | Anode terminal of the zener diode, pin 2 in the SOD-123 PINNING table and outline symbol. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage (min / nominal / max) | VZT | 31.3 | 33 | 34.9 | V | Test current IZT = 7.5 mA; VZT tested with pulses (20 ms) | 2 |
| Dynamic impedance | ZZT | 45 | Ω | at IZT = 7.5 mA | 2 | ||
| Reverse current | IR | 5 | μA | at VR = 25 V | 2 | ||
| Admissible Zener current | IZM | 28 | mA | 2 | |||
| Forward voltage | VF | 1.2 | V | at IF = 200 mA | 1 | ||
| Total power dissipation | PD | 1 | W | Power dissipation at TL = 75 °C | 1 | ||
| Operating and storage temperature range | Tj, Tstg | -55 | 150 | °C | Operating and storage temperature range | 1 | |
| Typical thermal resistance, junction to ambient | RθJA | 300 | °C/W | Junction to ambient, PCB mounted with 2.0" x 2.0" (5 x 5 cm) copper pads | 1 |
CAD (KiCad official)
- Symbol:
MM1W33 - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files:
mm1w33-etched.step/mm1w33-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mm1w33.step/mm1w33.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256
013135782e49243c, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).