# MLX92211LSE-AAA-000-SP

**Melexis** · Hall Switches · TSOT-23

MLX92211LSE-AAA-000-SP from Melexis, in a TSOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Supply voltage pin; the device operates from 2.7 V to 24 V and has built-in reverse supply voltage protection. |
| 2 | OUT | output | Open-drain output pin, fully protected against short circuit by a built-in current limit with automatic output shut-off during prolonged short circuit. |
| 3 | GND | power_in | Ground pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Melexis |
| Package | TSOT-23 |
| Category | Magnetic Sensors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature Range | TA | -40 |  | 150 | °C |  | 5 |
| Storage Temperature Range | TS | -55 |  | 165 | °C |  | 5 |
| Supply Voltage | VDD |  |  | 27 | V | fn 1,2: max 1 hour | 5 |
| Supply Voltage (Load dump) | VDD |  |  | 32 | V | fn 1,3: max 0.5 s | 5 |
| Supply Current | IDD |  |  | 20 | mA | fn 1,2,4 | 5 |
| Supply Current (Load dump) | IDD |  |  | 50 | mA | fn 1,3,4 | 5 |
| Reverse Supply Voltage | VDDREV | -24 |  |  | V | fn 1,2 | 5 |
| Reverse Supply Voltage (Load dump) | VDDREV | -30 |  |  | V | fn 1,3 | 5 |
| Reverse Supply Current | IDDREV | -20 |  |  | mA | fn 1,2,5 | 5 |
| Reverse Supply Current (Load dump) | IDDREV | -50 |  |  | mA | fn 1,3,5 | 5 |
| Output Voltage | VOUT |  |  | 27 | V | fn 1,2 | 5 |
| Output Current | IOUT |  |  | 20 | mA | fn 1,2,5 | 5 |
| Output Current | IOUT |  |  | 75 | mA | fn 1,3,6,10 (valid for AAA/ACA) | 5 |
| Reverse Output Voltage | VOUTREV | -0.5 |  |  | V | fn 1 | 5 |
| Reverse Output Current | IOUTREV | -50 |  |  | mA | fn 1,2 | 5 |
| Maximum Junction Temperature | TJ |  |  | 165 | °C | fn 7: 1000 hours | 5 |
| ESD Sensitivity, HBM |  |  |  | 4000 | V | AEC-Q100-002; valid for AAA/ACA | 5 |
| ESD Sensitivity, CDM |  |  |  | 1000 | V | AEC-Q100-011 | 5 |
| Supply Voltage | VDD | 2.7 |  | 24 | V | Operating | 6 |
| Supply Current | IDD | 1.5 | 3 | 4.5 | mA |  | 6 |
| Reverse Supply Current | IDDREV |  |  | -1 | mA | VDD = -18V | 6 |
| Output Leakage Current | IOFF |  | 0.1 | 10 | µA | VOUT = 12V, VDD = 12V, B < Brp | 6 |
| Output Saturation Voltage | VDSon |  | 0.2 | 0.5 | V | B > BOP, VDD = 3.8 to 18V, IOUT = 20mA | 6 |
| Output Rise Time (RPU dependent) | tR | 0.1 | 0.3 | 1 | µs | VDD = 12V, VPU = 5V, RPU = 1kΩ, CLOAD = 50pF to GND | 6 |
| Output Fall Time (on-chip controlled) | tF | 0.1 | 0.3 | 1 | µs | VDD = 12V, VPU = 5V, RPU = 1kΩ, CLOAD = 50pF to GND | 6 |
| Output Current Limit | ICL | 22 | 40 | 70 | mA | B > BOP, VDD = 3.8 to 18V, VOUT = 12V; valid for AAA | 6 |
| Output ON Time under Current Limit conditions | tCLON |  | 150 | 240 | µs | B > BOP, VPU = 12V, RPU = 100Ω | 6 |
| Output OFF Time under Current Limit conditions | tCLOFF |  | 3.5 |  | ms | B > BOP, VPU = 12V, RPU = 100Ω | 6 |
| Chopping Frequency | fCHOP |  | 340 |  | kHz |  | 6 |
| Output Refresh Period | tPER |  | 6 |  | µs |  | 6 |
| Delay time | tD |  | 6 |  | µs | Average over 1000 successive switching events @10kHz, square wave with B≥30mT, tRISE=tFALL≤20μs | 6 |
| Output Jitter (p-p) | tJITTER | -3 |  | 3 | µs | Over 1000 successive switching events @1kHz, square wave with B≥30mT, tRISE=tFALL≤100μs | 6 |
| Maximum Switching Frequency | fSW |  | 30 | 50 | kHz | B≥30mT and square wave magnetic field | 6 |
| Power-On Time | tON |  | 16 | 35 | µs | VDD = 5V, dVDD/dt > 2V/us | 7 |
| Under-voltage Lockout Threshold | VUVL | 2.2 | 2.4 | 2.7 | V |  | 7 |
| Under-voltage Lockout Reaction time | tUVL |  | 1 |  | µs |  | 7 |
| Thermal Protection Threshold | TPROT |  | 185 |  | °C | Junction temperature | 7 |
| Thermal Protection Release | TREL |  | 170 |  | °C | Junction temperature | 7 |
| SE Package Thermal Resistance | RTH |  | 300 |  | °C/W | Single layer (1S) JEDEC board | 7 |
| Operating Point (TA = -40°C) | BOP | 1.4 | 3.2 | 4.7 | mT | TA = -40°C; VDD = 3.8 to 24V | 8 |
| Release Point (TA = -40°C) | BRP | -4.7 | -3.2 | -1.4 | mT | TA = -40°C; VDD = 3.8 to 24V | 8 |
| Operating Point (TA = 25°C) | BOP | 1.4 | 3 | 4.7 | mT | TA = 25°C; VDD = 3.8 to 24V | 8 |
| Release Point (TA = 25°C) | BRP | -4.7 | -3 | -1.4 | mT | TA = 25°C; VDD = 3.8 to 24V | 8 |
| Operating Point (TA = 150°C) | BOP | 0.7 | 2.6 | 5 | mT | TA = 150°C; VDD = 3.8 to 24V | 8 |
| Release Point (TA = 150°C) | BRP | -5 | -2.6 | -0.7 | mT | TA = 150°C; VDD = 3.8 to 24V | 8 |
| Temperature Coefficient of BOP/BRP | TC |  | -1100 |  | ppm/°C | TA = -40°C to 150°C; guaranteed by design, not production tested | 8 |

## CAD (KiCad official)

- Symbol: `MLX92211LSE-AAA-000-SP`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: TSOT-23 (KiCad packages3D, STEP)
- 3D model files: `mlx92211lse-aaa-000-sp-etched.step` / `mlx92211lse-aaa-000-sp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mlx92211lse-aaa-000-sp.step` / `mlx92211lse-aaa-000-sp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Melexis datasheet](docs/mlx92211lse-aaa-000-sp-datasheet.pdf) (16 pp, sha256 `bdd1b6b7efdcb261`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mlx92211lse-aaa-000-sp-datasheet.pdf)