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MLX90333LDC-BCT-000-RE

Melexis(比利时迈来芯) · 3D Magnetic Sensors · SOIC-8

MLX90333LDC-BCT-000-RE from Melexis(比利时迈来芯), in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Supply pin; the absolute maximum supply overvoltage is +20 V and the reverse voltage protection is -10 V.
2 Test 0 passive Test pin that is recommended to be connected to ground for optimal EMC behaviour.
3 Not Used /SS input Not used in Analog/PWM mode and used as /SS (Slave Select) in Serial Protocol mode; the pinout table gives no electrical limits for it.
4 OUT2 / SCLK output OUT2 is the second ratiometric analog or PWM output in Analog/PWM mode, with absolute limits of +10 V (+14 V for 200 µs max at 25 °C), output current ±30 mA, reverse output voltage -0.3 V and reverse output current -50 mA; it is SCLK in Serial Protocol mode.
5 OUT1 / MOSI/MISO bidirectional OUT1 is the first ratiometric analog or PWM output in Analog/PWM mode, with absolute limits of +10 V (+14 V for 200 µs max at 25 °C), output current ±30 mA, reverse output voltage -0.3 V and reverse output current -50 mA; it is MOSI/MISO in Serial Protocol mode.
6 Test 1 passive Test pin that is recommended to be connected to ground for optimal EMC behaviour.
7 VDIG power_in Pinout lists this as the digital supply pin; the extracted pages give no electrical limits for it.
8 VSS power_in Ground reference (GND) for the device.

Key specifications

Parameter Value
Manufacturer Melexis(比利时迈来芯)
Package SOIC-8
Category Magnetic Sensors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage, VDD (overvoltage) VDD 20 V 9
Reverse Voltage Protection -10 V 9
Positive Output Voltage (Analog or PWM), Both Outputs OUT1 and OUT2 10 V 9
Positive Output Voltage (Analog or PWM), Both Outputs OUT1 and OUT2 14 V 200 s max, TA = + 25 Deg.C 9
Output Current (IOUT) IOUT -30 30 mA 9
Reverse Output Voltage, Both Outputs OUT1 and OUT2 -0.3 V 9
Reverse Output Current, Both Outputs OUT1 and OUT2 -50 mA 9
Operating Ambient Temperature Range TA -40 150 Deg.C 9
Storage Temperature Range TS -40 150 Deg.C 9
Magnetic Flux Density -4 4 T 9
Nominal Supply Voltage VDD 4.5 5 5.5 V 10
Supply Current (slow mode) IDD 8.5 11 mA Slow mode 10
Supply Current (fast mode) IDD 13.5 16 mA Fast mode 10
POR Supply Under Voltage VDD 2 2.7 3 V POR Supply Under Voltage 10
Output Current, Both Outputs OUT1 and OUT2 (Analog Output mode) IOUT -8 8 mA Analog Output mode 10
Output Current, Both Outputs OUT1 and OUT2 (PWM Output mode) IOUT -20 20 mA PWM Output mode 10
Output Short Circuit Current, Both Outputs OUT1 and OUT2 Ishort 12 15 mA VOUT = 0 V 10
Output Short Circuit Current, Both Outputs OUT1 and OUT2 Ishort 24 45 mA VOUT = 14 V (TA = 25 Deg.C) 10
Output Load, Both Outputs OUT1 and OUT2 RL 1 10 kΩ Pull-down to Ground 10
Output Load, Both Outputs OUT1 and OUT2 RL 1 kΩ Pull-up to 5V (4); max printed as ∞ (5) 10
Analog Saturation Output Level, Low (Vsat_lo) Vsat_lo 3 %VDD Pull-up load RL ≥ 10 kΩ 10
Analog Saturation Output Level, High (Vsat_hi) Vsat_hi 96 %VDD Pull-down load RL ≥ 5 kΩ 10
Digital Saturation Output Level, Low (VsatD_lo) VsatD_lo 1.5 %VDD Pull-up Low Side RL ≥ 10 kΩ, Push-Pull (IOUT = -20mA) 10
Digital Saturation Output Level, High (VsatD_hi) VsatD_hi 97 %VDD Push-Pull (IOUT = 20mA) 10
Active Diagnostic Output Level, Low (Diag_lo) Diag_lo 1 %VDD Pull-down load RL ≥ 5 kΩ 10
Active Diagnostic Output Level, Low (Diag_lo) Diag_lo 1.5 %VDD Pull-up load RL ≥ 10 kΩ 10
Active Diagnostic Output Level, High (Diag_hi) Diag_hi 96 %VDD Pull-down load RL ≥ 5 kΩ 10
Active Diagnostic Output Level, High (Diag_hi) Diag_hi 98 %VDD Pull-up load RL ≥ 5 kΩ 10
Passive Diagnostic Output Level (Broken VSS) BVSSPD 4 %VDD Broken VSS; Pull-down load RL ≤ 10 kΩ 10
Sampling Rate 600 1000 μs Slow mode 12
Sampling Rate 200 330 μs Fast mode 12
Analog Output Slew Rate 200 V/ms COUT = 42 nF 12
Analog Output Slew Rate 100 V/ms COUT = 100 nF 12
PWM Frequency FPWM 100 1000 Hz PWM Output Enabled 12
Maximum Field Amplitude Change vs. Field Frequency (AGC 90%) -10 10 % Slow mode, Field Freq > 40Hz 13
Maximum Field Amplitude Change vs. Field Frequency (AGC 90%) -30 30 % Slow mode, Field Freq = 20Hz 13
Maximum Field Amplitude Change vs. Field Frequency (AGC 90%) -12 12 % Fast mode, Field Freq > 150Hz 13
Maximum Field Amplitude Change vs. Field Frequency (AGC 64%) -22 22 % Slow mode, Field Freq > 80Hz 13
Maximum Field Amplitude Change vs. Field Frequency (AGC 64%) -30 30 % Slow mode, Field Freq = 50Hz 13
Maximum Field Amplitude Change vs. Field Frequency (AGC 64%) -60 60 % Fast mode, Field Freq = 50Hz 13
Offset on the Raw Signals X, Y and Z X0, Y0, Z0 -60 60 LSB15 TA = 25 Deg.C 13
Mismatch on the Raw Signals X and Y SMISMXY -1 1 % TA = 25 Deg.C, Between X and Y 13
Mismatch on the Raw Signals X and Z SMISMXZ -30 30 % TA = 25 Deg.C, Between X and Z 13
Mismatch on the Raw Signals Y and Z SMISMYZ -30 30 % TA = 25 Deg.C, Between Y and Z 13
Magnetic Angle Phase Error Between X and Y ORTHXY -0.3 0.3 Deg. TA = 25 Deg.C 14
Magnetic Angle Phase Error Between X and Z ORTHXZ -10 10 Deg. TA = 25 Deg.C 14
Magnetic Angle Phase Error Between Y and Z ORTHYZ -10 10 Deg. TA = 25 Deg.C 14
Thermal Offset Drift #1 on the Raw Signals X, Y and Z (Thermal Offset Drift at the DSP input) -90 90 LSB15 Temperature suffix L 14
Thermal Offset Drift #2 of the DAC and Output Stage -0.4 0.4 %VDD Temperature suffix L 14
Thermal Drift of Sensitivity Mismatch XY ΔSMISMXY -0.5 0.5 % Temperature suffix L 14
Thermal Drift of Sensitivity Mismatch XZ ΔSMISMXZ -1.5 1.5 % Temperature suffix L 14
Thermal Drift of Sensitivity Mismatch YZ ΔSMISMYZ -1.5 1.5 % Temperature suffix L 14
Analog Output INL (12 bits DAC) INL -4 4 %VDD 12 bits DAC (Theoretical, Noise free) 14
Magnetic Flux Density BX, BY BX, BY 20 50 70 mT 15
Magnetic Flux Density BZ BZ 24 140 mT 15
IMC Gain in X and Y GainIMCXY 1.2 1.4 1.8 15
Magnet Temperature Coefficient TCm -2400 0 ppm/Deg.C 15

CAD (KiCad official)

  • Symbol: MLX90333LDC-BCT-000-RE
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mlx90333ldc-bct-000-re-etched.step / mlx90333ldc-bct-000-re-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mlx90333ldc-bct-000-re.step / mlx90333ldc-bct-000-re.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Melexis(比利时迈来芯) datasheet (48 pp, sha256 cfb81ac4a1b5d0c5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF