# MLG1005S0N5BT000

**TDK** · Inductors (SMD) · 0402

MLG1005S0N5BT000 from TDK, in a 0402. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the 0.5 nH ±0.1nH inductor (SRF min. 10.0 GHz, DC resistance 0.10 ohm max., rated current 1000 mA max.), recommended land pad 0.5 x 0.5 mm. |
| 2 | 2 | passive | Other terminal of the 0.5 nH ±0.1nH inductor (SRF min. 10.0 GHz, DC resistance 0.10 ohm max., rated current 1000 mA max.), recommended land pad 0.5 x 0.5 mm with 0.4 mm gap between pads. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TDK |
| Package | 0402 |
| Category | Inductors, Coils, Chokes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Inductance tolerance (code B) |  | -0.1 |  | 0.1 | nH |  | 3 |
| Self-resonant frequency (min) |  | 10 |  |  | GHz |  | 6 |
| DC resistance (max) |  |  |  | 0.1 | Ω |  | 6 |
| Rated current (max) |  |  |  | 1000 | mA |  | 6 |
| Q (min) | Q | 22 |  |  |  | at 500 MHz | 10 |
| Q (min) | Q | 27 |  |  |  | at 800 MHz | 10 |
| Q (min) | Q | 46 |  |  |  | at 1.8 GHz | 10 |
| Q (min) | Q | 49 |  |  |  | at 2.0 GHz | 10 |
| Q (min) | Q | 53 |  |  |  | at 2.4 GHz | 10 |
| Operating temperature range |  | -55 |  | 125 | °C |  | 3 |
| Soldering peak temperature |  | 250 |  | 260 | °C | peak temperature in reflow | 4 |
| Soldering peak time |  |  |  | 10 | s | at peak temperature in reflow | 4 |
| Inductance (nominal) | L |  | 0.5 |  | nH | measured at 100 MHz | 6 |

## CAD (KiCad official)

- Symbol: `MLG1005S0N5BT000`
- Footprint: `Inductor_SMD:L_0402_1005Metric`
- 3D model: 0402 (KiCad packages3D, STEP)
- 3D model files: `mlg1005s0n5bt000-etched.step` / `mlg1005s0n5bt000-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mlg1005s0n5bt000.step` / `mlg1005s0n5bt000.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TDK datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588893544950484992) (16 pp, sha256 `281214084e9d2a57`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mlg1005s0n5bt000-datasheet.pdf)