component
MICRF213AYQS-TR
Public Made by Adomby adom
Microchip Tech RF Transceiver ICs, QSOP-16-150mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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MICRF213AYQS-TR
Microchip Tech · RF Transceiver ICs · QSOP-16-150mil
MICRF213AYQS-TR from Microchip Tech, in a QSOP-16-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO1 | passive | Reference resonator input connection to the Colpitts oscillator stage, which may also be driven by an external reference signal of 1.5V p-p amplitude maximum. |
| 2 | GNDRF | power_in | Negative supply connection associated with the ANT RF input. |
| 3 | ANT | input | RF signal input from the antenna, internally AC-coupled; a matching network with an inductor-to-RF ground is recommended to improve ESD protection. |
| 4 | GNDRF | power_in | Negative supply connection associated with the ANT RF input. |
| 5 | VDD | power_in | Positive supply connection for all chip functions (operating range 3.0V to 3.6V per the operating ratings). |
| 6 | SQ | input | Squelch control logic input with an active internal pull-up when not shut down. |
| 7 | SEL0 | input | Logic control input with active internal pull-up, used in conjunction with SEL1 to control the demodulator low-pass filter bandwidth. |
| 8 | SHDN | input | Shutdown logic control input with active internal pull-up. |
| 9 | GND | power_in | Negative supply connection for all chip functions except the RF input. |
| 10 | DO | output | Demodulated data output (driving capability of 0.4mA per the application section). |
| 11 | SEL1 | input | Logic control input with active internal pull-up, used in conjunction with SEL0 to control the demodulator low-pass filter bandwidth. |
| 12 | CTH | passive | Demodulation threshold voltage integration capacitor connection; an external capacitor is tied across CTH and GND, with values above 1nF recommended. |
| 13 | CAGC | passive | AGC filter capacitor connection; a CAGC capacitor normally greater than 0.47uF is connected from this pin to GND. |
| 14 | RSSI | output | Received signal strength indication output from a buffer with 200 ohms typical output impedance. |
| 15 | NC | unconnected | Not connected; the datasheet specifies that this pin should be connected to ground. |
| 16 | RO2 | passive | Reference resonator input to the Colpitts oscillator stage, 7pF in parallel with a low-resistance MOS switch-to-GND during normal operation, and driven by the startup excitation circuit during startup. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QSOP-16-150mil |
| Category | RF & Radio |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VDD) | VDD | 5 | V | 3 | |||
| Input Voltage | 5 | V | 3 | ||||
| Junction Temperature | 150 | °C | 3 | ||||
| Lead Temperature | 260 | °C | soldering, 10sec | 3 | |||
| Storage Temperature | TS | -65 | 150 | °C | 3 | ||
| Maximum Receiver Input Power | 10 | dBm | 3 | ||||
| ESD Rating | 3 | KV | HBM | 3 | |||
| Supply voltage (VDD) | VDD | 3 | 3.6 | V | 3 | ||
| Ambient Temperature (TA) | TA | -40 | 105 | °C | 3 | ||
| Input Voltage (VIN) | VIN | 3.6 | V | 3 | |||
| Maximum Input RF Power | -20 | dBm | 3 | ||||
| Receive Modulation Duty Cycle | 20 | 80 | % | 3 | |||
| AGC pin leakage current | -2 | 2 | nA | TA = 25ºC | 3 | ||
| AGC pin leakage current | -800 | 800 | nA | TA = +105ºC | 3 | ||
| Reference Oscillator Input Range | 0.2 | 1.5 | Vp-p | 3 | |||
| CTH Leakage Current | -2 | 2 | nA | TA = 25ºC | 4 | ||
| CTH Leakage Current | -800 | 800 | nA | TA = +105ºC | 4 | ||
| Operating Supply Current | IDD | 3.9 | mA | Continuous Operation, fRX = 315MHz | 3 | ||
| Shut down Current | ISHUT | 0.33 | µA | 3 | |||
| Image Rejection | 20 | dB | 3 | ||||
| 1st IF Center Frequency | 0.86 | MHz | fRX = 315MHz | 3 | |||
| Receiver Sensitivity @ 1kbps | -110 | dBm | fRX = 315MHz (matched to 50Ω) BER=10-2 | 3 | |||
| IF Bandwidth | 235 | kHz | fRX = 315MHz | 3 | |||
| AGC Attack / Decay Ratio | tATTACK / tDECAY | 0.1 | 3 | ||||
| AGC Dynamic Range | 1.13 | V | RFIN @ -50dBm | 3 | |||
| AGC Dynamic Range | 1.7 | V | RFIN @ -110dBm | 3 | |||
| Reference Oscillator Frequency | 9.81563 | MHz | fRX = 315MHz, Crystal Load Cap = 10pF | 3 | |||
| Reference Oscillator Input Impedance | 300 | kΩ | 3 | ||||
| Reference Oscillator Source Current | 3.5 | µA | V(REFOSC) = 0V | 3 | |||
| CTH Source Impedance | 165 | kΩ | FREFOSC = 9.81563MHz | 4 | |||
| Demodulator Filter Bandwidth @ 315MHz | 1180 | Hz | SEL0=0, SEL1=0 | 4 | |||
| Demodulator Filter Bandwidth @ 315MHz | 2360 | Hz | SEL0=1, SEL1=0 | 4 | |||
| Demodulator Filter Bandwidth @ 315MHz | 4720 | Hz | SEL0=0, SEL1=1 | 4 | |||
| Demodulator Filter Bandwidth @ 315MHz | 9400 | Hz | SEL0=1, SEL1=1 | 4 | |||
| DO pin output current | 260 | µA | As output source @ 0.8Vdd | 4 | |||
| DO pin output current | 600 | µA | sink @ 0.2Vdd | 4 | |||
| Output rise and fall times | 2 | µsec | CI = 15pF, pin DO, 10-90% | 4 | |||
| RSSI DC Output Voltage Range | 0.4 | V | -110dBm | 4 | |||
| RSSI DC Output Voltage Range | 1.9 | V | -50dBm | 4 | |||
| RSSI response slope | 25 | mV/dB | -110dBm to -50dBm | 4 | |||
| RSSI Output Current | 400 | µA | 4 | ||||
| RSSI Output Impedance | 200 | Ω | 4 | ||||
| RSSI Response Time | 0.3 | Sec | 50% data duty cycle, input power to Antenna = -20dBm | 4 |
CAD (KiCad official)
- Symbol:
MICRF213AYQS-TR - Footprint:
Package_SO:QSOP-16_3.9x4.9mm_P0.635mm - 3D model: QSOP-16-150mil (KiCad packages3D, STEP)
- 3D model files:
micrf213ayqs-tr-etched.step/micrf213ayqs-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);micrf213ayqs-tr.step/micrf213ayqs-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (17 pp, sha256
12d20c7d1edfb72a, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).