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MIC5209-5.0YS
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Microchip Tech Linear Voltage Regulators (LDO), SOT-223-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMIC5209-5.0YS
Microchip Tech · Linear Voltage Regulators (LDO) · SOT-223-3
MIC5209-5.0YS from Microchip Tech, in a SOT-223-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Supply input; operating ratings give VIN of +2.5V to +16V, and the absolute maximum supply voltage is -20V to +20V. |
| 2 | GND | power_in | Ground; SOT-223 pin 2 and the TAB are internally connected. |
| 3 | OUT | power_out | Regulator output guaranteeing 500 mA over the full operating temperature range, with a maximum dropout of 500 mV at full load. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOT-223-3 |
| Category | Power Management ICs |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Accuracy | VOUT | -1 | 1 | % | 5 | ||
| Output Voltage Accuracy (% variation from nominal VOUT, bold values) | VOUT | -2 | 2 | % | Bold values, -40°C ≤ TJ ≤ +125°C | 5 | |
| Line Regulation | ΔVOUT/VOUT | 0.009 | 0.05 | % | VIN = VOUT + 1V to 16V | 5 | |
| Line Regulation (bold values) | ΔVOUT/VOUT | 0.1 | % | Bold values, -40°C ≤ TJ ≤ +125°C; VIN = VOUT + 1V to 16V | 5 | ||
| Load Regulation | ΔVOUT/VOUT | 0.05 | 0.5 | % | IL = 100 µA to 500 mA, Note 3 | 5 | |
| Load Regulation (bold values) | ΔVOUT/VOUT | 0.7 | % | Bold values, -40°C ≤ TJ ≤ +125°C; IL = 100 µA to 500 mA, Note 3 | 5 | ||
| Dropout Voltage | VIN, VOUT | 10 | 60 | mV | IL = 100 µA | 5 | |
| Dropout Voltage (bold values) | VIN, VOUT | 80 | mV | Bold values, -40°C ≤ TJ ≤ +125°C; IL = 100 µA | 5 | ||
| Dropout Voltage | VIN, VOUT | 115 | 175 | mV | IL = 50 mA | 5 | |
| Dropout Voltage (bold values) | VIN, VOUT | 250 | mV | Bold values, -40°C ≤ TJ ≤ +125°C; IL = 50 mA | 5 | ||
| Dropout Voltage | VIN, VOUT | 165 | 300 | mV | IL = 150 mA | 5 | |
| Dropout Voltage (bold values) | VIN, VOUT | 400 | mV | Bold values, -40°C ≤ TJ ≤ +125°C; IL = 150 mA | 5 | ||
| Dropout Voltage | VIN, VOUT | 350 | 500 | mV | IL = 500 mA | 5 | |
| Dropout Voltage (bold values) | VIN, VOUT | 600 | mV | Bold values, -40°C ≤ TJ ≤ +125°C; IL = 500 mA | 5 | ||
| Ground Pin Current | IGND | 80 | 130 | µA | VEN ≥ 3.0V, IOUT = 100 µA | 5 | |
| Ground Pin Current (bold values) | IGND | 170 | µA | Bold values, -40°C ≤ TJ ≤ +125°C; VEN ≥ 3.0V, IOUT = 100 µA | 5 | ||
| Ground Pin Current | IGND | 350 | 650 | µA | VEN ≥ 3.0V, IOUT = 50 mA | 5 | |
| Ground Pin Current (bold values) | IGND | 900 | µA | Bold values, -40°C ≤ TJ ≤ +125°C; VEN ≥ 3.0V, IOUT = 50 mA | 5 | ||
| Ground Pin Current | IGND | 1.8 | 2.5 | mA | VEN ≥ 3.0V, IOUT = 150 mA | 5 | |
| Ground Pin Current (bold values) | IGND | 3 | mA | Bold values, -40°C ≤ TJ ≤ +125°C; VEN ≥ 3.0V, IOUT = 150 mA | 5 | ||
| Ground Pin Current | IGND | 8 | 20 | mA | VEN ≥ 3.0V, IOUT = 500 mA | 5 | |
| Ground Pin Current (bold values) | IGND | 25 | mA | Bold values, -40°C ≤ TJ ≤ +125°C; VEN ≥ 3.0V, IOUT = 500 mA | 5 | ||
| Ripple Rejection | PSRR | 75 | dB | f = 120 Hz | 5 | ||
| Current Limit | ILIMIT | 700 | 900 | mA | VOUT = 0V | 5 | |
| Current Limit (bold values) | ILIMIT | 1000 | mA | Bold values, -40°C ≤ TJ ≤ +125°C; VOUT = 0V | 5 | ||
| Thermal Regulation | ΔVOUT/ΔPD | 0.05 | %/W | Note 7 | 5 | ||
| Output Voltage Temperature Coefficient | ΔVOUT/ΔT | 40 | ppm/°C | Note 2 | 5 | ||
| Supply Voltage (VIN) absolute maximum | VIN | -20 | 20 | V | 4 | ||
| Supply Voltage (VIN) operating range | VIN | 2.5 | 16 | V | 4 | ||
| Lead Temperature | 260 | °C | Soldering, 5 sec. | 7 | |||
| Storage Temperature Range | TS | -65 | 150 | °C | 7 | ||
| Junction Temperature | TJ | -40 | 125 | °C | 2.5V ≤ VOUT ≤ 15V | 7 | |
| Thermal Resistance SOT-223 junction to ambient | θJA | 62 | °C/W | EIA/JEDEC JESD51-7, 4 Layer Board | 7 | ||
| Thermal Resistance SOT-223 junction to case | θJC | 15 | °C/W | 7 |
CAD (KiCad official)
- Symbol:
MIC5209-5.0YS - Footprint:
Package_TO_SOT_SMD:SOT-223-3_TabPin2 - 3D model: SOT-223-3 (KiCad packages3D, STEP)
- 3D model files:
mic5209-5-0ys-etched.step/mic5209-5-0ys-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mic5209-5-0ys.step/mic5209-5-0ys.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (30 pp, sha256
46148b9c0d4d1f14, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).