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Contents

README

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MIC39301S-3.3

HGSEMI · Linear Voltage Regulators (LDO) · TO-263-5

MIC39301S-3.3 from HGSEMI, in a TO-263-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input CMOS/TTL-compatible enable control input; logic high = enable, logic low or open = shutdown.
2 IN power_in Supply input, +16V maximum supply.
3 GND power_in Ground pin, internally connected to the TAB.
4 OUT power_out Regulator output.
5 FLG output Open-collector error flag output that signals undervoltage and overcurrent conditions.
6 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer HGSEMI
Package TO-263-5
Category Power Management ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage accuracy (initial) VOUT -1 1 % 10mA 6
Output Voltage accuracy (over line/load) VOUT -2 2 % 10mA ≤ IOUT ≤ 3A, VOUT+1V ≤ VIN ≤ 8V 6
Line Regulation 0.06 0.5 % IOUT=10mA, VOUT+1V ≤ VIN ≤ 8V 6
Load Regulation 0.2 1 % VIN=VOUT+1V, 10mA 6
Output Voltage Temp. Coefficient ΔVOUT/ΔT 20 100 ppm/°C Note 5 6
Dropout Voltage VDO 80 200 mV IOUT=100mA, ΔVOUT=-1% 6
Dropout Voltage VDO 200 mV IOUT=750mA, ΔVOUT=-1% 6
Dropout Voltage VDO 320 mV IOUT=1.5A, ΔVOUT=-1% 6
Dropout Voltage VDO 400 550 mV IOUT=3A, ΔVOUT=-1% 6
Ground Current IGND 10 20 mA IOUT=750mA, VIN=VOUT=+1V 6
Ground Current IGND 17 mA IOUT=1.5A, VIN=VOUT=+1V 6
Ground Current IGND 45 mA IOUT=3A, VIN=VOUT=+1V 6
Dropout Ground Pin Current IGND(do) 6 mA VIN ≤ VOUT(nominal)-0.5V, IOUT=10mA 6
Current Limit IOUT(lim) 4.5 A VOUT=0V, VIN=VOUT+1V 6
Enable Input Voltage logic low (off) VEN 0.8 V logic low (off) 7
Enable Input Voltage logic high (on) VEN 2.25 V logic (on) 7
Enable Input Current IIN 15 30 µA VEN=VIN 7
Enable Input Current IIN 2 µA VEN=0.8V 7
Shutdown Output Current IOUT(shdn) 10 20 µA Note 8 7
Flag Output Leakage Current IFLG(leak) 0.01 1 µA VOH=16V 7
Flag Output Low Voltage VFLG(do) 220 300 mV VIN=2.250V, IOL=250µA, Note 9 7
Flag Low Threshold VFLG 93 % % of VOUT 7
Flag High Threshold VFLG 99.2 % 7
Flag Hysteresis VFLG 1 % 7
Supply Voltage (absolute maximum) VIN -20 20 V 4
Enable Voltage (absolute maximum) VEN 20 V 4
Storage Temperature TS -65 150 °C 4
Lead Temperature 245 °C soldering, 10 sec 4
Supply Voltage (operating) VIN -2.25 16 V 4
Enable Voltage (operating) VEN 16 V 4
Operating Temperature Ta -40 125 °C 4
Thermal Resistance Junction-to-Case TO263 θJC 5 °C/W TO263 4

CAD (KiCad official)

  • Symbol: MIC39301S-3.3
  • Footprint: Package_TO_SOT_SMD:TO-263-5_TabPin6
  • 3D model: TO-263-5 (KiCad packages3D, STEP)
  • 3D model files: mic39301s-3-3-etched.step / mic39301s-3-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mic39301s-3-3.step / mic39301s-3-3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (16 pp, sha256 fb1e3af1d6c4f9ad, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF