main
Ray Publish 0.1.0 3f10bec 16d ago

MIC2954-08YM-TR

Microchip Tech · Power Management - Specialized · SOIC-8

MIC2954-08YM-TR from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulator output; the -08 version is specified at 5V ±1% with 250mA load, and an output capacitor of 2.2µF or greater to ground is required to prevent oscillation.
2 SNS input Sense input at the output-side end of the internal resistive divider; connect to OUT for fixed 5V operation and leave unused in the adjustable configuration.
3 SHDN input Active-low shutdown input: low enables the regulator and high (2.0V minimum for the off state) shuts it down.
4 GND power_in Ground reference; the ground pin current is the regulator quiescent current, typically 140µA at a 1mA load and 5mA at a 250mA load.
5 /ERR output Open-collector active-low error flag that goes low when the output falls about 5% out of regulation; it requires an external pull-up (100k to 1MΩ suggested) and is rated to sink 400µA.
6 TAP output Resistive voltage divider tap that is approximately 1.23V when 5V is applied to SNS; connect it to FB for 5V operation.
7 FB input Error amplifier input compared to the internal 1.23V reference; it connects to an external divider for adjustable operation or to TAP for 5V operation.
8 IN power_in Supply input, operating from 2.0V to 30V continuous, with the device withstanding -20V reverse battery and +60V transients (limited to <10ms and <1% duty cycle).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output accuracy (±1% version, MIC2954-03/-08) -1 1 % MIC2954-08 (±1%) output voltage accuracy, guaranteed over junction temperature -40°C to +125°C 1
Output voltage VOUT 4.95 5 5.05 V MIC2954-03/-08 (±1%) 4
Output voltage VOUT 4.9 5.1 V MIC2954-03/-08 (±1%), -40°C ≤ TJ ≤ +125°C 4
Output voltage, 1mA to 250mA load VOUT 4.88 5 5.12 V MIC2954-03/-08 (±1%), 1mA ≤ IL ≤ 250mA 4
Output voltage temperature coefficient ∆VOUT/∆T 20 150 ppm/°C MIC2954-03/-08 (±1%); Note 6 4
Line regulation ∆VOUT/VOUT 0.03 0.2 %/V MIC2954-03/-08 (±1%), VIN = 6V to 26V; Note 7 4
Line regulation ∆VOUT/VOUT 0.4 %/V MIC2954-03/-08 (±1%), VIN = 6V to 26V, -40°C ≤ TJ ≤ +125°C; Note 7 4
Load regulation ∆VOUT/VOUT 0.04 0.2 %/V MIC2954-03/-08 (±1%), IL = 1 to 250mA; Note 8 4
Load regulation ∆VOUT/VOUT 0.3 %/V MIC2954-03/-08 (±1%), IL = 1 to 250mA, -40°C ≤ TJ ≤ +125°C; Note 8 4
Dropout voltage VIN, VOUT 60 100 mV IL = 1mA; Note 9 4
Dropout voltage VIN, VOUT 150 mV IL = 1mA, -40°C ≤ TJ ≤ +125°C; Note 9 4
Dropout voltage VIN, VOUT 220 250 mV IL = 50mA; Note 9 4
Dropout voltage VIN, VOUT 420 mV IL = 50mA, -40°C ≤ TJ ≤ +125°C; Note 9 4
Dropout voltage VIN, VOUT 250 300 mV IL = 100mA; Note 9 4
Dropout voltage VIN, VOUT 450 mV IL = 100mA, -40°C ≤ TJ ≤ +125°C; Note 9 4
Dropout voltage VIN, VOUT 375 450 mV IL = 250mA; Note 9 4
Dropout voltage VIN, VOUT 600 mV IL = 250mA, -40°C ≤ TJ ≤ +125°C; Note 9 4
Ground pin current IGND 140 200 µA IL = 1mA; Note 10 4
Ground pin current IGND 300 µA IL = 1mA, -40°C ≤ TJ ≤ +125°C; Note 10 4
Ground pin current IGND 0.5 1 mA IL = 50mA; Note 10 4
Ground pin current IGND 2 mA IL = 50mA, -40°C ≤ TJ ≤ +125°C; Note 10 4
Ground pin current IGND 1.7 2.5 mA IL = 100mA; Note 10 4
Ground pin current IGND 3.5 mA IL = 100mA, -40°C ≤ TJ ≤ +125°C; Note 10 4
Ground pin current IGND 5 9 mA IL = 250mA; Note 10 4
Ground pin current IGND 12 mA IL = 250mA, -40°C ≤ TJ ≤ +125°C; Note 10 4
Ground pin current at dropout IGND(DO) 180 300 µA VIN = 4.5V; Note 10 4
Current limit ILIMIT 750 800 mA VOUT = 0V; Note 11 5
Thermal regulation ∆VOUT/∆PD 0.05 0.2 %/W Note 12 5
Reference voltage VREF 1.21 1.235 1.26 V MIC2954-03/-08 (±1%) 5
Reference voltage VREF 1.2 1.27 V MIC2954-03/-08 (±1%), -40°C ≤ TJ ≤ +125°C 5
Reference voltage VREF 1.185 1.285 V MIC2954-03/-08 (±1%), Note 13 5
Feedback pin bias current 20 40 nA 5
Feedback pin bias current 60 nA -40°C ≤ TJ ≤ +125°C 5
Feedback pin bias current temperature coefficient 0.1 40 nA/°C 5
Error comparator output leakage current 0.01 1 µA VOH = 30V 5
Error comparator output leakage current 2 µA VOH = 30V, -40°C ≤ TJ ≤ +125°C 5
Error comparator output low voltage 150 250 mV VIN = 4.5V, IOL = 400µA 5
Error comparator output low voltage 400 mV VIN = 4.5V, IOL = 400µA, -40°C ≤ TJ ≤ +125°C 5
Error comparator upper threshold voltage 40 60 mV Note 14 5
Error comparator upper threshold voltage 25 mV Note 14, -40°C ≤ TJ ≤ +125°C 5
Error comparator lower threshold voltage 75 95 mV Note 14 5
Error comparator lower threshold voltage 140 mV Note 14, -40°C ≤ TJ ≤ +125°C 5
Shutdown input logic voltage, low (on) 0.7 V 5
Shutdown input logic voltage, low (on) 1.3 V Over temperature (second printed value) 5
Shutdown input logic voltage, high (off) 2 V 5
Shutdown pin input current 30 50 µA VSHDN = 2.4V 5
Shutdown pin input current 100 µA VSHDN = 2.4V, -40°C ≤ TJ ≤ +125°C 5
Shutdown pin input current 450 600 µA VSHDN = 30V 5
Shutdown pin input current 750 µA VSHDN = 30V, -40°C ≤ TJ ≤ +125°C 5
Regulator output current in shutdown 3 10 µA Note 15 5
Regulator output current in shutdown 20 µA Note 15, -40°C ≤ TJ ≤ +125°C 5
Supply voltage (VIN), absolute maximum VIN -20 60 V Note 17 4
Feedback voltage (VFB), absolute maximum VFB -1.5 26 V 4
Shutdown input voltage (VSHDN), absolute maximum VSHDN -0.3 30 V 4
Error output voltage (VERR), absolute maximum VERR -0.3 30 V 4
Lead temperature (soldering, 5 sec.), absolute maximum 260 °C Soldering, 5 sec. 4
Storage temperature Ts -65 150 °C 4
Supply voltage (VIN), operating VIN 2 30 V 4
Junction temperature (TJ), operating TJ -40 125 °C 4
Package thermal resistance, junction to ambient (θJA) θJA 160 °C/W 8-pin SOIC on single-layer FR4 PCB, worst case (no ground plane) 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper The MIC2954-07BM/-08BM (8-pin surface-mount pack￾age) has the following thermal characteristics when mounted on a single layer copper-clad printed circuit 11

CAD (KiCad official)

  • Symbol: MIC2954-08YM-TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mic2954-08ym-tr-etched.step / mic2954-08ym-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mic2954-08ym-tr.step / mic2954-08ym-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (15 pp, sha256 2625bfe2bb4285f6, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF