main
Ray Publish 0.1.0 5dea02f 23d ago

MIC2039BYM6-TR

Microchip Tech · Power Distribution Switches · SOT-23-6

MIC2039BYM6-TR from Microchip Tech, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power switch and logic supply input, specified for 2.5 V to 5.5 V operation with absolute maximum of -0.3 V to +6 V to GND.
2 GND power_in Input and output return (ground) pin for the device.
3 EN input Logic-compatible enable control that turns the switch on/off; logic-low is at most 0.5 V and logic-high at least 1.5 V, it must not be left floating, and it should not exceed VIN by more than 500 mV.
4 FAULT/ output Active-low open-drain fault status flag that goes low on an overcurrent lasting longer than tFAULT/ or on thermal shutdown, requires an external pull-up (10 kΩ recommended) to an external supply, and is rated up to 5.5 V with a maximum sink current of 25 mA.
5 ILIMIT passive Current-limit set pin; connect a resistor from this pin to GND to program the limit from 0.2 A to 2.5 A (for example 287 Ω gives 1.0 A), and do not leave it floating.
6 VOUT power_out Power switch output, rated from -0.3 V to VIN.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage Range VIN 2.5 5.5 V 4
Input Supply Undervoltage Lockout Threshold (rising) VUVLO 2 2.25 2.5 V VIN rising 4
Input Supply Undervoltage Lockout Threshold (falling) VUVLO 1.9 2.15 2.4 V VIN falling 4
Input Supply Undervoltage Lockout Threshold Hysteresis VUVLOHYS 100 mV VIN rising or VIN falling 4
Supply Current, Switch OFF (Active-Low Enable B) IDD 0.75 5 µA Switch OFF; Active-Low Enable (B): VEN = 1.5V, VIN = 5V, IOUT = 0A 4
Supply Current, Switch ON (Active-Low Enable B) IDD 100 300 µA Switch ON; Active-Low Enable (B): VEN = 0V, VIN = 5V, IOUT = 0A 4
Switch On-Resistance RDS(ON) 100 177 mΩ VIN = 2.5V, IOUT = 350 mA 4
Switch On-Resistance RDS(ON) 85 145 mΩ VIN = 3.3V, IOUT = 350 mA 4
Switch On-Resistance RDS(ON) 75 125 mΩ VIN = 5V, IOUT = 350 mA 4
Output Leakage Current ILKG 0.22 15 µA Switch OFF, VOUT = 0V 4
Current Limit (RLIMIT = 115Ω) ILIMIT 2.35 2.5 2.65 A RLIMIT = 115Ω, VIN = 5V, VOUT = 0.8V × VIN 4
Current Limit (RLIMIT = 145Ω) ILIMIT 1.9 2 2.1 A RLIMIT = 145Ω, VIN = 5V, VOUT = 0.8V × VIN 4
Current Limit (RLIMIT = 287Ω) ILIMIT 0.95 1 1.05 A RLIMIT = 287Ω, VIN = 5V, VOUT = 0.8V × VIN 4
Current Limit (RLIMIT = 576Ω) ILIMIT 0.475 0.5 0.525 A RLIMIT = 576Ω, VIN = 5V, VOUT = 0.8V × VIN 4
Current Limit (RLIMIT = 1.45 kΩ) ILIMIT 0.19 0.2 0.21 A RLIMIT = 1.45 kΩ, VIN = 5V, VOUT = 0.8V × VIN 4
Enable Voltage Logic-Low VEN 0.5 V Logic-Low 5
Enable Voltage Logic-High VEN 1.5 V Logic-High 5
Enable Input Current IEN 1 µA 0V ≤ VEN ≤ 5V 5
FAULT/ Output Resistance RFAULT/ 25 Ω IOUT = 10 mA 5
FAULT/ Off Current IFAULT/_OFF 10 µA VFAULT/ = VIN 5
Thermal Shutdown Threshold TSD 157 °C TJ rising 5
Thermal Shutdown Hysteresis TSDHYS 15 °C 5
Output Turn-On Rise Time tRISE 700 µs RLOAD = 10Ω; COUT = 1 µF 5
Output Turn-Off Fall Time tFALL 32 µs VEN = OFF; RLOAD = 10Ω; COUT = 1 µF 5
Output Turn-On Delay tON_DLY 700 µs RLOAD = 10Ω; COUT = 1 µF 5
Output Turn-Off Delay tOFF_DLY 5 µs RLOAD = 10Ω; COUT = 1 µF 5
Short Circuit Response Time tSC_RESP 10 µs VOUT = 0V (short-circuit) 5
Overcurrent Fault Response Delay Time (Non-kickstart parts) tFAULT/ 16 32 49 ms Non-kickstart parts. 5
Junction Operating Temperature Range TJ -40 125 °C Note 1 6
Storage Temperature Range TS -65 150 °C 6
Lead Temperature 260 °C Soldering, 10s 6
Thermal Resistance, Junction to Air, SOT-23-6 θJA 177.2 °C/W 6
VIN to GND VIN -0.3 6 V 3
VOUT to GND (maximum printed as VIN) VOUT -0.3 V Maximum printed as VIN 3
VILIMIT to GND (maximum printed as VIN + 0.3V) VILIMIT -0.3 V Maximum printed as VIN + 0.3V 3
VEN to GND (maximum printed as VIN) VEN -0.3 V Maximum printed as VIN 3
VFAULT/ to GND (maximum printed as VIN + 0.3V) VFAULT/ -0.3 V Maximum printed as VIN + 0.3V 3
FAULT/ Current IFAULT/ 25 mA 3
ESD Rating (HBM) 3 kV Human body model, 1.5 kΩ in series with 100 pF 3
ESD Rating (MM) 300 V 3
VFAULT/ operating voltage VFAULT/ -0.3 5.5 V 3

CAD (KiCad official)

  • Symbol: MIC2039BYM6-TR
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: mic2039bym6-tr-etched.step / mic2039bym6-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mic2039bym6-tr.step / mic2039bym6-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (26 pp, sha256 6492d821172447d9, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF