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MG32F103RBT6

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Megawin Tech Microcontrollers (MCU/MPU/SOC), LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MG32F103RBT6

Megawin Tech · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

MG32F103RBT6 from Megawin Tech, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup supply input, 1.8 V to 3.6 V, which powers the RTC, the external 32 kHz oscillator and the backup registers when VDD is off.
2 PC13 bidirectional General-purpose I/O (max 16 mA per pin), with alternate function TAMPER/RTC.
3 PC14 bidirectional General-purpose I/O (max 16 mA per pin), with the OSC32_IN function for the 32.768 kHz LSE crystal.
4 PC15 bidirectional General-purpose I/O (max 16 mA per pin), with the OSC32_OUT function for the 32.768 kHz LSE crystal.
5 PD0 bidirectional General-purpose I/O (max 16 mA per pin), with the OSC_IN function for the 4 to 16 MHz HSE crystal.
6 PD1 bidirectional General-purpose I/O (max 16 mA per pin), with the OSC_OUT function for the 4 to 16 MHz HSE crystal.
7 NRST input External reset pin, active low, which triggers a system reset when driven low.
8 PC0 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions I2S_WS, SPIM2_NSS0, SPIS2_NSS and analog input ADC_IN10.
9 PC1 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions I2S_SCLK, SPIM2_SCK, SPIS2_SCK and analog input ADC_IN11.
10 PC2 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions I2S_SD0, SPIM2_MI, SPIS2_SO and analog input ADC_IN12.
11 PC3 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions I2S_SD1, SPIM2_MO, SPIS2_SI and analog input ADC_IN13.
12 VSSA power_in Analog ground for the ADC; must be connected to the same ground system as the other VSS pins.
13 VDDA power_in Analog supply for the ADC, 2.4 V to 3.6 V while the ADC operates; the datasheet recommends using the same supply for VDD and VDDA.
14 PA0 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM2_CH1_ETR, UART2_CTS, WKUP (a rising edge exits Standby mode) and analog input ADC_IN0.
15 PA1 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM2_CH2, UART2_RTS and analog input ADC_IN1.
16 PA2 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM2_CH3, UART2_TX and analog input ADC_IN2.
17 PA3 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM2_CH4, UART2_RX and analog input ADC_IN3.
18 VSS_4 power_in Digital ground pin; all VSS pins must be connected to the external supply system, with a maximum difference of 50 mV between ground pins.
19 VDD_4 power_in Digital supply for I/O pins and the internal LDO, 2.0 V to 3.6 V; all VDD pins must be connected to the supply system.
20 PA4 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions QSPI_NSS0, SPIS1_NSS, UART2_CK and analog input ADC_IN4.
21 PA5 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions QSPI_SCK, SPIS1_SCK and analog input ADC_IN5.
22 PA6 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_BKIN, TIM3_CH1, QSPI_MI_IO1, SPIS1_SO and analog input ADC_IN6.
23 PA7 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH1N, TIM3_CH2, QSPI_MO_IO0, SPIS1_SI and analog input ADC_IN7.
24 PC4 bidirectional General-purpose I/O (max 16 mA per pin), with alternate function TRACECK and analog input ADC_IN14.
25 PC5 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions SPIM2_NSS2, TRACED0 and analog input ADC_IN15.
26 PB0 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH2N, TIM3_CH3, I2S_MCLK, QSPI_IO2 and analog input ADC_IN8.
27 PB1 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH3N, TIM3_CH4, QSPI_IO3 and analog input ADC_IN9.
28 PB2 bidirectional General-purpose I/O (max 16 mA per pin), which also serves as the BOOT1 boot-mode select pin sampled at startup.
29 PB10 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM2_CH3, TIM4_CH1, I2C2_SCL, QSPI_NSS2, UART3_TX.
30 PB11 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM2_CH4, I2C2_SDA, SPIM2_NSS1, UART3_RX.
31 VSS_1 power_in Digital ground pin; all VSS pins must be connected to the external supply system.
32 VDD_1 power_in Digital supply for I/O pins and the internal LDO, 2.0 V to 3.6 V; all VDD pins must be connected to the supply system.
33 PB12 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_BKIN, I2S_WS, LED4, SPIM2_NSS0, SPIS2_NSS, UART3_CK.
34 PB13 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH1N, I2S_SCLK, LED5, SPIM2_SCK, SPIS2_SCK, UART3_CTS.
35 PB14 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH2N, LED6, SPIM2_MI, SPIS2_SO, UART3_RTS.
36 PB15 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH3N, LED7, SPIM2_MO, SPIS2_SI, I2S_SD0.
37 PC6 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM3_CH1, I2S_MCLK, LED0.
38 PC7 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM3_CH2, I2S_MCLK, LED1.
39 PC8 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM3_CH3, LED2.
40 PC9 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM3_CH4, LED3, TRACED1.
41 PA8 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH1, LED0, UART1_CK, MCO and analog comparator input CMPA_P0.
42 PA9 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH2, LED1, UART1_TX and analog comparator input CMPA_N0.
43 PA10 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH3, LED2, UART1_RX.
44 PA11 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_CH4, LED3, UART1_CTS and the USB D- signal USBDM.
45 PA12 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM1_ETR, UART1_RTS and the USB D+ signal USBDP.
46 PA13 bidirectional General-purpose I/O (max 16 mA per pin), with the SWDIO debug data function, alternate function QSPI_NSS1 and analog comparator input CMPA_P3.
47 VSS_2 power_in Digital ground pin; all VSS pins must be connected to the external supply system.
48 VDD_2 power_in Digital supply for I/O pins and the internal LDO, 2.0 V to 3.6 V; all VDD pins must be connected to the supply system.
49 PA14 bidirectional General-purpose I/O (max 16 mA per pin), with the SWDCLK debug clock function, alternate function QSPI_NSS2 and analog comparator input CMPA_N3.
50 PA15 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM2_CH1_ETR, I2S_WS, I2C1_SMBAI, QSPI_NSS0, SPIS1_NSS and analog comparator input CMPB_P3.
51 PC10 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions LED4, UART3_TX, TRACED2 and analog comparator input CMPB_P1.
52 PC11 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions LED5, UART3_RX, TRACED3 and analog comparator input CMPB_P2.
53 PC12 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM4_ETR, LED6, UART3_CK and analog comparator input CMPB_N0.
54 PD2 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM3_ETR, LED7 and analog comparator input CMPB_P0.
55 PB3 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions SWO, TIM2_CH2, I2S_SCLK, QSPI_SCK, SPIS1_SCK and analog comparator input CMPB_N3.
56 PB4 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM3_CH1, QSPI_MI_IO1, SPIS1_SO and analog comparator input CMPA_P1.
57 PB5 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM3_CH2, I2S_SD1, I2C1_SMBAI, QSPI_MO_IO0, SPIS1_SI and analog comparator input CMPA_P2.
58 PB6 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM4_CH1, I2C1_SCL, QSPI_NSS1, UART1_TX and analog comparator input CMPA_N1.
59 PB7 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM4_CH2, I2C1_SDA, SPIM2_NSS1, UART1_RX and analog comparator input CMPA_N2.
60 BOOT0 input Boot-mode select pin sampled at startup to choose between user Flash, system memory and internal SRAM boot.
61 PB8 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM4_CH3, I2C1_SCL, SPIM2_NSS2, UART1_CTS and analog comparator input CMPB_N1.
62 PB9 bidirectional General-purpose I/O (max 16 mA per pin), with alternate functions TIM4_CH4, I2C1_SDA, UART1_RTS and analog comparator input CMPB_N2.
63 VSS_3 power_in Digital ground pin; all VSS pins must be connected to the external supply system.
64 VDD_3 power_in Digital supply for I/O pins and the internal LDO, 2.0 V to 3.6 V; all VDD pins must be connected to the supply system.

Key specifications

Parameter Value
Manufacturer Megawin Tech
Package LQFP-64(10x10)
Category Embedded Processors & Controllers
Pins 64

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD-VSS external main supply voltage (including VDDA and VDD) VDD-VSS -0.5 3.6 V 24
Voltage difference between different supply pins /ΔVDDx/ 50 mV 24
Voltage difference between different ground pins /VSSx-VSS/ 50 mV 24
Total current through VDD/VDDA supply lines (supply current) IVDD 60 mA 24
Total current through VSS ground lines (sink current) IVSS 60 mA 24
Output sink current on any I/O and control pin IIO 16 mA 24
Output source current on any I/O and control pin IIO -16 mA 24
Injection current on a pin IINJ(PIN) -5 5 mA 24
Sum of injection currents on pins ΣIINJ(PIN) -25 25 mA 24
Storage temperature range TSTG -45 150 °C 25
Maximum junction temperature TJ 100 °C 25
Internal AHB clock frequency fHCLK 72 MHz 25
Internal APB1 clock frequency fPCLK1 72 MHz 25
Internal APB2 clock frequency fPCLK2 72 MHz 25
Standard operating voltage VDD 2 3.6 V 25
Analog operating voltage VDDA 2 3.6 V 25
Backup-domain operating voltage VBAT 1.8 3.6 V 25
Operating temperature T -40 85 °C 25
External HSE clock frequency fHSEext 8 16 MHz 28
HSE input high/low level time TW(HSE) 16 ns 28
HSE rise/fall time Tr(HSE)/Tf(HSE) 5 ns 28
HSE duty cycle DuCy(HSE) 45 55 % 28
LSE input high/low level time TW(LSE) 450 ns 28
LSE duty cycle DuCy(LSE) 30 70 % 28
Internal fast clock 0 (MHSI) duty cycle DuCy(MHSI) 45 55 % 29
Internal fast clock 0 (MHSI) oscillator startup time TSU(MHSI) 1 2 us VSS ≤ Vin ≤ VDD 29
Internal fast clock 1 (FHSI) duty cycle DuCy(FHSI) 45 55 % 29
Internal fast clock 1 (FHSI) oscillator startup time TSU(FHSI) 200 500 ns VSS ≤ Vin ≤ VDD 29
Internal slow clock (LSI) frequency fLSI 20 40 KHz 29
PLL input clock frequency fPLLIN 1 8 16 MHz 30
PLL input clock duty cycle PLL input duty 40 60 % 30
PLL lock time TLOCK 200 us 30
Flash page program current IDDPROG 2 mA 30
Flash page/chip erase current IDDERASE 1.5 mA 30
Flash read current at 48 MHz IDDREAD 4.7 mA @48MHz 30
Flash endurance (erase/write cycles) NEND 100 千次 30
Data retention time tRET 10 year 30
ESD human body model voltage VESD(HBM) 4000 V TA = +25 ◦C, conforms to JEDEC JS-001-2017 31
ESD charged device model voltage VESD(CDM) 500 V TA = +25 ◦C, conforms to JEDEC JS-002-2018 31
Input low voltage VIL -0.5 V 32
Input leakage current Ilkg -1 1 uA VSS ≤ Vin ≤ VDD 32
Weak pull-up equivalent resistance Rpu 30 40 50 kΩ Vin=VSS 32
Weak pull-down equivalent resistance Rpd 30 40 50 kΩ Vin=VDD 32
Maximum output frequency, speed x0 fmax(IO)out 10 MHz CL=50pF,VDD=2V to 3.6V 32
Maximum output frequency, speed x1 fmax(IO)out 50 MHz CL=50pF,VDD=2V to 3.6V 32
High-to-low output time, speed x1 tf(IO)out 25 ns CL=50pF,VDD=2V to 3.6V 32
Low-to-high output time, speed x1 tr(IO)out 25 ns CL=50pF,VDD=2V to 3.6V 32
Comparator input voltage Vin 0.6 V 33
Comparator hysteresis VHYST 2 5 mV 33
Comparator input offset voltage VOFF 5 15 mV 33
Comparator propagation delay TPGD 200 nS 33
Comparator average operating current Iq 8.5 uA 33
Timer resolution unit Tres(TIM) 1 TTIMxCLK 32
Timer resolution RESTIM 20 bit 32
ADC supply voltage VDDA 2.4 3.6 V 33
ADC sampling rate fs 0.05 1 MHz 33
External trigger frequency fTRIG 823 KHz fADC =14MHz 33
External input impedance RAIN 200 Ω 33
ADC conversion rate (12-bit) FCONV 940 KSPS 12-bit 33
ADC conversion voltage range VAIN 0 V 33

CAD (KiCad official)

  • Symbol: MG32F103RBT6
  • Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
  • 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: mg32f103rbt6-etched.step / mg32f103rbt6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mg32f103rbt6.step / mg32f103rbt6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Megawin Tech datasheet (41 pp, sha256 d60b1d138834b89b, retrieved 2026-10-20, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF