# MFU0805FF00500P100

**Vishay Intertech** · Disposable Fuses · 0805

MFU0805FF00500P100 from Vishay Intertech, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Insulation resistance |  | 0.1 |  |  | MΩ | at 2.0 x UR (DC), residual resistance test 9.3.3 | 11 |
| Operating temperature range |  | -55 |  | 125 | °C |  | 1 |
| Permissible film temperature | F max |  |  | 125 | °C |  | 1 |
| Rated voltage, Umax DC | Umax |  |  | 32 | V | DC; MFU 0805 | 1 |
| Breaking capacity, Imax at Umax DC | Imax |  |  | 50 | A | at 32 V DC; MFU 0805 | 5 |
| Permissible continuous current rating |  |  |  | 0.7 | x IR | at amb = 23 °C | 1 |
| Resistance change after substrate bending | R/R | -10 |  | 10 | % | substrate bending; depth 1 mm; rate 1 mm/s; 1 time | 11 |
| Resistance change after resistance to soldering heat | R/R | -10 |  | 10 | % | reflow method 2; (260 ± 5) °C; (10 ± 1) s | 11 |
| Resistance change after damp heat, steady state | R/R | -10 |  | 10 | % | (40 ± 2) °C; 56 days; (93 ± 3) % RH | 12 |
| Resistance change after rapid change of temperature | R/R | -10 |  | 10 | % | 30 min at LCT; 30 min at UCT; LCT = -55 °C; UCT = 125 °C; 5 cycles | 12 |
| Resistance change after vibration | R/R | -10 |  | 10 | % | 10 Hz to 2000 Hz; amplitude 1.5 mm or 200 m/s2; 6 h | 12 |
| Resistance change after endurance test | R/R | -10 |  | 10 | % | I = 1.0 x IR(DC); 1.0 h on, 0.25 h off; 23 °C; 100 times | 12 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of | 6 |

## CAD (KiCad official)

- Symbol: `MFU0805FF00500P100`
- Footprint: `Fuse:Fuse_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `mfu0805ff00500p100-etched.step` / `mfu0805ff00500p100-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mfu0805ff00500p100.step` / `mfu0805ff00500p100.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Vishay Intertech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589785481480609792) (13 pp, sha256 `61f92ab1a77d5779`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mfu0805ff00500p100-datasheet.pdf)