component
MEM2307XG
Public Made by Adomby adom
MICRONE MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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mem2307xg: specified limits as data (metadata.characteristics, 33 rows from the datasheet)
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17d ago
MEM2307XG
MICRONE · MOSFETs · SOT-23
MEM2307XG from MICRONE, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; threshold VGS(th) is -1 to -2 V at ID=-250uA and absolute maximum gate-source voltage is ±20 V. |
| 2 | S | passive | Source of the P-channel MOSFET; maximum continuous body-diode current is -2.2 A. |
| 3 | D | passive | Drain; drain-source voltage is rated -30 V and continuous drain current is -4.1 A at TA=25℃ (pulsed -20 A). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MICRONE |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -30 | V | 1 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 1 | ||
| Drain Current | ID | -4.1 | A | TA=25℃ | 1 | ||
| Drain Current | ID | -3.5 | A | TA=70℃ | 1 | ||
| Pulsed Drain Current | IDM | -20 | A | 1 | |||
| Total Power Dissipation | Pd | 1.4 | W | TA=25℃ | 1 | ||
| Total Power Dissipation | Pd | 1 | W | TA=70℃ | 1 | ||
| Operating Temperature Range | TOpr | 150 | ℃ | 1 | |||
| Storage Temperature Range | Tstg | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance, Junction-to-Ambient (t≤10s) | RθJA | 65 | 90 | ℃/W | t≤10s | 2 | |
| Thermal Resistance, Junction-to-Ambient (Steady-State) | RθJA | 85 | 125 | ℃/W | Steady-State | 2 | |
| Thermal Resistance, Junction-to-Lead (Steady-State) | RθJL | 43 | 60 | ℃/W | Steady-State | 2 | |
| Drain-Source Breakdown Voltage | V(BR)DSS | -30 | V | VGS=0V, ID=-250uA | 2 | ||
| Gate Threshold Voltage | VGS(th) | -1 | -1.3 | -2 | V | VDS= VGS, ID=-250uA | 2 |
| Gate-Body Leakage | IGSS | 100 | nA | VDS=0V, VGS=20V | 2 | ||
| Gate-Body Leakage | IGSS | -100 | nA | VDS=0V, VGS=-20V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -1000 | nA | VDS=-24V, VGS=0V | 2 | ||
| Static Drain-Source On-Resistance | RDS(ON)1 | 88 | mΩ | VGS=-10V, ID=-4.1A | 2 | ||
| Static Drain-Source On-Resistance | RDS(ON)2 | 108 | mΩ | VGS=-4.5V, ID=-3A | 2 | ||
| Forward Transconductance | gFS | 5.5 | 8.2 | S | VDS = –5 V, ID = –4A | 2 | |
| Maximum Body-Diode Continuous Current | Is | -2.2 | A | 2 | |||
| Source-drain (diode forward) voltage | VSD | 0.77 | -1 | V | VGS=0V, IS=-1A | 2 | |
| Input Capacitance | Ciss | 700 | 840 | pF | VGS=0V, VDS=-15V, f=1MHz | 2 | |
| Output Capacitance | Coss | 120 | pF | VGS=0V, VDS=-15V, f=1MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 75 | pF | VGS=0V, VDS=-15V, f=1MHz | 2 | ||
| Gate resistance | Rg | 10 | 15 | Ω | VGS=0V, VDS=0V, f=1MHz | 2 | |
| Turn-On Delay Time | td(on) | 8.6 | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 | ||
| Rise Time | tr | 5 | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 28.2 | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 | ||
| Fall-Time | tf | 13.5 | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 | ||
| Total Gate Charge | Qg | 14.3 | nC | VDS = -15 V, VGS = -4.5 V, ID = -4A | 2 | ||
| Gate-Source Charge | Qgs | 3.1 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 3 | nC | 2 |
CAD (KiCad official)
- Symbol:
MEM2307XG - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
mem2307xg-etched.step/mem2307xg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mem2307xg.step/mem2307xg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MICRONE datasheet (6 pp, sha256
10ad645746a79b50, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MEM2307XG
**MICRONE** · MOSFETs · SOT-23
MEM2307XG from MICRONE, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; threshold VGS(th) is -1 to -2 V at ID=-250uA and absolute maximum gate-source voltage is ±20 V. |
| 2 | S | passive | Source of the P-channel MOSFET; maximum continuous body-diode current is -2.2 A. |
| 3 | D | passive | Drain; drain-source voltage is rated -30 V and continuous drain current is -4.1 A at TA=25℃ (pulsed -20 A). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MICRONE |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -30 | | | V | | 1 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | | 1 |
| Drain Current | ID | -4.1 | | | A | TA=25℃ | 1 |
| Drain Current | ID | -3.5 | | | A | TA=70℃ | 1 |
| Pulsed Drain Current | IDM | -20 | | | A | | 1 |
| Total Power Dissipation | Pd | | | 1.4 | W | TA=25℃ | 1 |
| Total Power Dissipation | Pd | | | 1 | W | TA=70℃ | 1 |
| Operating Temperature Range | TOpr | | | 150 | ℃ | | 1 |
| Storage Temperature Range | Tstg | -55 | | 150 | ℃ | | 1 |
| Thermal Resistance, Junction-to-Ambient (t≤10s) | RθJA | | 65 | 90 | ℃/W | t≤10s | 2 |
| Thermal Resistance, Junction-to-Ambient (Steady-State) | RθJA | | 85 | 125 | ℃/W | Steady-State | 2 |
| Thermal Resistance, Junction-to-Lead (Steady-State) | RθJL | | 43 | 60 | ℃/W | Steady-State | 2 |
| Drain-Source Breakdown Voltage | V(BR)DSS | -30 | | | V | VGS=0V, ID=-250uA | 2 |
| Gate Threshold Voltage | VGS(th) | -1 | -1.3 | -2 | V | VDS= VGS, ID=-250uA | 2 |
| Gate-Body Leakage | IGSS | | | 100 | nA | VDS=0V, VGS=20V | 2 |
| Gate-Body Leakage | IGSS | -100 | | | nA | VDS=0V, VGS=-20V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | -1000 | nA | VDS=-24V, VGS=0V | 2 |
| Static Drain-Source On-Resistance | RDS(ON)1 | | | 88 | mΩ | VGS=-10V, ID=-4.1A | 2 |
| Static Drain-Source On-Resistance | RDS(ON)2 | | | 108 | mΩ | VGS=-4.5V, ID=-3A | 2 |
| Forward Transconductance | gFS | 5.5 | 8.2 | | S | VDS = –5 V, ID = –4A | 2 |
| Maximum Body-Diode Continuous Current | Is | | | -2.2 | A | | 2 |
| Source-drain (diode forward) voltage | VSD | | 0.77 | -1 | V | VGS=0V, IS=-1A | 2 |
| Input Capacitance | Ciss | | 700 | 840 | pF | VGS=0V, VDS=-15V, f=1MHz | 2 |
| Output Capacitance | Coss | | 120 | | pF | VGS=0V, VDS=-15V, f=1MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 75 | | pF | VGS=0V, VDS=-15V, f=1MHz | 2 |
| Gate resistance | Rg | | 10 | 15 | Ω | VGS=0V, VDS=0V, f=1MHz | 2 |
| Turn-On Delay Time | td(on) | | 8.6 | | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 |
| Rise Time | tr | | 5 | | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 |
| Turn-Off Delay Time | td(off) | | 28.2 | | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 |
| Fall-Time | tf | | 13.5 | | ns | VGS=-10V, VDS=-15V, RL=3.6Ω, RGEN=6Ω | 2 |
| Total Gate Charge | Qg | | 14.3 | | nC | VDS = -15 V, VGS = -4.5 V, ID = -4A | 2 |
| Gate-Source Charge | Qgs | | 3.1 | | nC | | 2 |
| Gate-Drain Charge | Qgd | | 3 | | nC | | 2 |
## CAD (KiCad official)
- Symbol: `MEM2307XG`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `mem2307xg-etched.step` / `mem2307xg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mem2307xg.step` / `mem2307xg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MICRONE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586178722978541568) (6 pp, sha256 `10ad645746a79b50`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mem2307xg-datasheet.pdf)