component
ME8109BD8G
Public Made by Adomby adom
MICRONE AC-DC Controllers & Regulators, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownME8109BD8G
MICRONE · AC-DC Controllers & Regulators · DIP-8
ME8109BD8G from MICRONE, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection; the datasheet gives no function for this pin. |
| 2 | RT | bidirectional | Dual-function pin connected through an NTC resistor to ground for over-temperature shutdown/latch control (100 µA source, OTP threshold 1 V), or through a Zener to VDD for adjustable over-voltage protection. |
| 3 | GND | power_in | Ground. |
| 4 | FB | input | Voltage feedback pin, connected to a photo-coupler to control the duty cycle (abs max -0.3 to 7 V). |
| 5 | VDD | power_in | Chip DC power supply pin, recommended 10 to 30 V, UVLO on 9 V and off 14 V typical, abs max 40 V. |
| 6 | SENSE | input | Current sense input connected to the MOSFET current sensing resistor node (abs max -0.3 to 7 V). |
| 7 | DRAIN | passive | Drain of the internal high-voltage MOSFET, rated 600 V for ME8109B (pins 7 and 8 are common). |
| 8 | DRAIN | passive | Drain of the internal high-voltage MOSFET, rated 600 V for ME8109B (pins 7 and 8 are common). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MICRONE |
| Package | DIP-8 |
| Category | Power Supply Chip |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VDD/VIN DC Supply Voltage | VDD | 40 | V | 4 | |||
| Drain Voltage ME8109B | -0.3 | 600 | V | ME8109B | 4 | ||
| VDD DC Clamp Continuous Current | 10 | mA | 4 | ||||
| Voltage at FB, SENSE, RT | VFB, VSENSE, VRT | -0.3 | 7 | V | to GND | 4 | |
| Operating Junction Temperature | TJ | -20 | 85 | °C | 4 | ||
| Storage Temperature | Tstg | -55 | 150 | °C | 4 | ||
| VDD Supply Voltage | VDD | 10 | 30 | V | 5 | ||
| Operating Ambient Temperature | TA | -20 | 85 | °C | 5 | ||
| VDD Start up Current | IStartup | 2 | 20 | μA | VDD=11V, Measure leakage current into VDD | 5 | |
| Operation Current | IVDD_Operation | 1.8 | 3 | mA | VFB=3V | 5 | |
| VDD Under Voltage Lockout Enter | UVLOON | 8 | 9 | 10 | V | 5 | |
| VDD Under Voltage Lockout Exit (Recovery) | UVLOOFF | 13 | 14 | 15.5 | V | 5 | |
| VDD Clamp | VDD_Clamp | 30 | 32 | 34 | V | IVDD = 10 mA | 5 |
| VDD Over voltage protection enter | OVPON | 24 | 26 | 28 | V | CS=0V,FB=3V Ramp up VDD until gate clock is off | 5 |
| Max duty cycle | Maximum duty cycle | 75 | 80 | 85 | % | VDD=16V,VFB=3V, VCS=0V | 5 |
| VFB Open Loop Voltage | VFB_Open | 3.9 | 4.2 | V | 5 | ||
| Power limiting Debounce Time | TD_PL | 80 | 88 | 96 | mS | 5 | |
| Normal Oscillation Frequency | FOSC | 60 | 65 | 70 | KHz | VDD=16V,FB=3V,CS=0V | 6 |
| Drain-Source Voltage ME8109B | BVdss | 600 | V | Vgs=0, ME8109B | 6 | ||
| Static Drain-Source On-Resistance ME8109B | Ron | 4.4 | Ω | VGS=10V, Id=1.0A, ME8109B | 6 | ||
| MOSFET Maximum duty cycle | Duty | 75 | 80 | 85 | % | 6 | |
| Output current of RT pin | IRT | 95 | 100 | 105 | μA | 6 | |
| Threshold voltage for OTP | VOTP | 0.95 | 1 | 1.05 | V | 6 | |
| Continuous drain current | ID | 2 | A | 6 | |||
| VDD Pull-up PMOS active | VPULL-UP | 13 | V | 5 | |||
| PWM Input Gain | AVCS | 2 | V/V | ΔVFB /ΔVCS | 5 | ||
| Internal current limiting threshold voltage | VTH_OC | 0.875 | V | FB=3.3V | 6 | ||
| Leading edge blanking time | T_blanking | 220 | nS | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | ppa | body, such as exercise equipment, medical equipment, security systems, gas equipment, or any apparatus installed in airplanes and other vehicles, without prior written permission of Nanjing Micro | 11 |
CAD (KiCad official)
- Symbol:
ME8109BD8G - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
me8109bd8g-etched.step/me8109bd8g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);me8109bd8g.step/me8109bd8g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MICRONE datasheet (11 pp, sha256
c44aa3d071f80a62, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).