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MD9927ESF4

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Shanghai Mingda Microelectronics Motor Driver ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MD9927ESF4

Shanghai Mingda Microelectronics · Motor Driver ICs · SOP-8

MD9927ESF4 from Shanghai Mingda Microelectronics, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VM power_in Motor power supply, operating from 0 to 12 V; bypass this pin to GND with a 0.1 µF ceramic capacitor rated for VM.
2 OUT1 output Motor output, connected to one end of the motor winding (H-bridge output 1).
3 OUT2 output Motor output, connected to the other end of the motor winding (H-bridge output 2).
4 GND power_in Device ground; this pin must be connected to ground.
5 IN2 input IN2 PWM input for the H-bridge; logic-level input with VIL and VIH thresholds scaled to VCC and an internal pulldown of about 100 kΩ.
6 IN1 input IN1 PWM input for the H-bridge; logic-level input with VIL and VIH thresholds scaled to VCC and an internal pulldown of about 100 kΩ.
7 nSLEEP input Sleep mode input; logic low enters low-power sleep mode and logic high gives normal operation, with an internal pulldown of about 100 kΩ.
8 VCC power_in Logic power supply, operating from 1.8 to 7 V; bypass this pin to GND with a 0.1 µF ceramic capacitor rated for VCC.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOP-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Motor power-supply voltage VM 0 12 V 2
Logic power-supply voltage VCC 1.8 7 V 2
Logic level input voltage VLOGIC 0 5.5 V 2
Motor peak current IOUT 0 1.8 A 2
Externally applied PWM frequency fPWM 0 250 kHZ 2
Operating ambient temperature TA -40 85 ℃ 2
Motor power-supply voltage VM -0.3 18 V 2
Logic power-supply voltage VCC -0.3 7 V 2
Control pin voltage IN1, IN2, nSLEEP -0.3 7 V 2
ESD human body model V(ESD) -4000 4000 V Human body model (HBM) 2
Operating virtual junction temperature TJ -40 150 ℃ 2
Storage temperature Tstg -60 150 ℃ 2
VM operating voltage VM 0 12 V 3
VM operating supply current, no PWM IVM 30 100 μA VM = 5 V; VCC = 3 V; No PWM 3
VM operating supply current, 50 kHz PWM IVM 0.45 1.5 mA VM = 5 V; VCC = 3 V; 50 kHz PWM 3
VM sleep mode supply current IVMQ 30 90 nA VM = 5 V; VCC = 3 V; nSLEEP = 0 3
VCC operating voltage VCC 1.8 7 V 3
VCC operating supply current, no PWM IVCC 0.23 0.5 mA VM = 5 V; VCC = 3 V; No PWM 3
VCC operating supply current, 50 kHz PWM IVCC 0.45 1.5 mA VM = 5 V; VCC = 3 V; 50 kHz PWM 3
VCC sleep mode supply current IVCCQ 15 30 nA VM = 5 V; VCC = 3 V; nSLEEP = 0 3
Input logic-low voltage, falling threshold VIL 0.25 0.38 × VCC Falling threshold 3
Input logic-high voltage, rising threshold VIH 0.46 0.5 × VCC Rising threshold 3
Input logic hysteresis VHYS 0.08 × VCC 3
Input logic low current IIL -5 5 μA VIN = 0 V 3
Input logic high current, IN1 or IN2 pin IIH 60 μA VIN = 3.3 V, IN1 or IN2 pin 3
Input logic high current, nSLEEP pin IIH 50 μA VIN = 3.3 V, nSLEEP pin 3
Pulldown resistance RPD 100 kΩ 3
HS + LS FET on-resistance 500 mΩ VM = 5 V; VCC = 3 V; IO = 800 mA; TJ = 25°C 3
Off-state leakage current -200 200 nA VOUT = 0 V 3
VCC undervoltage lockout, falling VUVLO 1.7 V VCC falling 3
VCC undervoltage lockout, rising VUVLO 1.8 V VCC rising 3
Overcurrent protection trip level IOCP 1.9 3.5 A 3
Overcurrent deglitch time tDEG 1 μs 3
Overcurrent retry time tRETRY 1 ms 3
Thermal shutdown temperature tTSD 170 ℃ Die temperature TJ 3
Output enable time t1 300 ns 4
Output disable time t2 300 ns 4
Delay time, INx high to OUTx high t3 160 ns 4
Delay time, INx low to OUTx low t4 160 ns 4
Output rise time t5 30 188 ns 4
Output fall time t6 30 188 ns 4

CAD (KiCad official)

  • Symbol: MD9927ESF4
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: md9927esf4-etched.step / md9927esf4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md9927esf4.step / md9927esf4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (11 pp, sha256 09a1b45e259fa9f4, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF