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Contents

README

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MD9927

Shanghai Mingda Microelectronics · Motor Driver ICs · WDFN-8-EP(2x2)

MD9927 from Shanghai Mingda Microelectronics, in a WDFN-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VM power_in Motor power supply, 0 to 12 V recommended, to be bypassed to GND with a 0.1 µF ceramic capacitor rated for VM.
2 OUT1 output Motor output that connects to the motor winding.
3 OUT2 output Motor output that connects to the motor winding.
4 GND power_in Device ground, which must be connected to ground.
5 IN2 input IN2 logic input controlling OUT2 (PWM interface), with an internal pulldown of about 100 kΩ.
6 IN1 input IN1 logic input controlling OUT1 (PWM interface), with an internal pulldown of about 100 kΩ.
7 nSLEEP input Sleep mode input: logic low puts the device in low-power sleep mode, logic high gives normal operation, with an internal pulldown.
8 VCC power_in Logic power supply, 1.8 to 7 V, to be bypassed to GND with a 0.1 µF ceramic capacitor rated for VCC.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package WDFN-8-EP(2x2)
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Motor power-supply voltage VM -0.3 18 V Ta=25°C 2
Logic power-supply voltage VCC -0.3 7 V Ta=25°C 2
Control pin voltage IN1, IN2, nSLEEP -0.3 7 V Ta=25°C 2
ESD HBM V(ESD) -4000 4000 V Human body model 2
Operating virtual junction temperature TJ -40 150 °C 2
Storage temperature Tstg -60 150 °C 2
Motor power-supply voltage VM 0 12 V Ta=25°C 2
Logic power-supply voltage VCC 1.8 7 V Ta=25°C 2
Logic level input voltage VLOGIC 0 5.5 V Ta=25°C 2
Motor peak current IOUT 0 1.8 A Ta=25°C 2
Externally applied PWM frequency fPWM 0 250 kHz Ta=25°C 2
Operating ambient temperature TA -40 85 °C 2
VM operating voltage VM 0 12 V 3
VM operating supply current IVM 30 100 µA VM = 5 V; VCC = 3 V; No PWM 3
VM operating supply current IVM 0.45 1.5 mA VM = 5 V; VCC = 3 V; 50 kHz PWM 3
VM sleep mode supply current IVMQ 30 90 nA VM = 5 V; VCC = 3 V; nSLEEP = 0 3
VCC operating voltage VCC 1.8 7 V 3
VCC operating supply current IVCC 0.23 0.5 mA VM = 5 V; VCC = 3 V; No PWM 3
VCC operating supply current IVCC 0.45 1.5 mA VM = 5 V; VCC = 3 V; 50 kHz PWM 3
VCC sleep mode supply current IVCCQ 15 30 nA VM = 5 V; VCC = 3 V; nSLEEP = 0 3
Input logic-low voltage falling threshold VIL 0.25 0.38 V values are multiples of VCC (0.25 × VCC, 0.38 × VCC) 3
Input logic-high voltage rising threshold VIH 0.46 0.5 V values are multiples of VCC (0.46 × VCC, 0.5 × VCC) 3
Input logic low current IIL -5 5 µA VIN = 0 V 3
Input logic high current, IN1 or IN2 IIH 60 µA VIN = 3.3 V, IN1 or IN2 pin 3
Input logic high current, nSLEEP IIH 50 µA VIN = 3.3 V, nSLEEP pin 3
Off-state leakage current -200 200 nA VOUT = 0 V 3
HS + LS FET on-resistance 500 mΩ VM = 5 V; VCC = 3 V; IO = 800 mA; TJ = 25°C 3
Overcurrent protection trip level IOCP 1.9 3.5 A 3
VCC undervoltage lockout, falling VUVLO 1.7 V VCC falling 3
VCC undervoltage lockout, rising VUVLO 1.8 V VCC rising 3
Input logic hysteresis VHYS 0.08 V 0.08 × VCC 3
Pulldown resistance RPD 100 kΩ 3
Overcurrent deglitch time tDEG 1 µs 3
Overcurrent retry time TRETRY 1 ms 3
Thermal shutdown temperature tTSD 170 °C Die temperature TJ 3
Output enable time t1 300 ns 4
Output disable time t2 300 ns 4
Delay time, INx high to OUTx high t3 160 ns 4
Delay time, INx low to OUTx low t4 160 ns 4
Output rise time t5 30 188 ns 4
Output fall time t6 30 188 ns 4

CAD (KiCad official)

  • Symbol: MD9927
  • Footprint: Package_DFN_QFN:WDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm
  • 3D model: WDFN-8-EP(2x2), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: md9927-etched.step / md9927-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md9927.step / md9927.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (11 pp, sha256 b265c99dba064782, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF