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MD8933ESF4

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Shanghai Mingda Microelectronics DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MD8933ESF4

Shanghai Mingda Microelectronics · DC-DC Converters · ESOP-8

MD8933ESF4 from Shanghai Mingda Microelectronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT output A 0.1μF bootstrap capacitor is required between the BOOT and PH pins, and if its voltage falls below the minimum requirement the high-side MOSFET is forced off until the capacitor is refreshed.
2 VIN power_in This pin is the 3.5V to 28V input supply voltage.
3 EN input Enable pin: pull below 0.5V to disable and float to enable, with programming the input undervoltage lockout using two resistors recommended.
4 SS input Slow-start pin, where an external capacitor connected to this pin sets the output rise time.
5 VSENSE input This pin is the inverting node of the transconductance (gm) error amplifier.
6 COMP output Error-amplifier output and input to the PWM comparator, with frequency compensation components connected to this pin.
7 GND power_in Ground pin, which must be connected to the exposed PowerPAD on the ESOP8 package for proper operation.
8 PH output The PH pin is the source of the internal high-side power MOSFET.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package ESOP-8
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN VIN -0.3 30 V 3
Output voltage PH PH -0.6 30 V 3
EN pin voltage EN -0.3 6 V 3
BOOT voltage BOOT 38 V 3
VSENSE voltage VSENSE -0.3 3 V 3
COMP voltage COMP -0.3 3 V 3
SS voltage SS -0.3 3 V 3
BOOT-PH voltage BOOT-PH 8 V 3
PH 10-ns transient from ground to negative peak PH -5 V 10-ns transient from ground to negative peak 3
EN source current EN 100 μA source current 3
BOOT source current BOOT 100 mA source current 3
VSENSE source current VSENSE 10 μA source current 3
PH source current PH 9 A source current 3
VIN sink current VIN 9 A sink current 3
COMP sink current COMP 100 μA sink current 3
SS sink current SS 200 μA sink current 3
Operating ambient temperature Topr -40 150 °C 3
Storage temperature range Tstg -65 150 °C 3
ESD HBM -2500 2500 V HBM 3
ESD CDM -2000 2000 V CDM 3
Power dissipation ESOP8 PD 1500 mW ESOP8 3
Thermal resistance ESOP8 RθJA 66 °C/W ESOP8 3
Internal undervoltage lockout threshold 3.5 V Rising and falling 4
Shutdown supply current 1.2 4 μA EN = 0V, VIN = 12V, -40°C to 85°C 4
Operating non-switching supply current 100 190 μA VSENSE = 0.85 V 4
Enable threshold rising 1.2 V Rising 4
Enable threshold falling 0.5 V Falling 4
Input current at enable rise threshold minus 50mV 3.2 μA Enable rise threshold, 50mV 4
Input current at enable rise threshold plus 50mV 3.5 μA Enable rise threshold + 50mV 4
Voltage reference Vref 0.772 0.8 0.828 V 4
On resistance high-side MOSFET RDS(on) 66 mΩ BOOT-PH = 3V, VIN = 3.5V 4
On resistance high-side MOSFET RDS(on) 60 mΩ BOOT-PH = 6V, VIN = 12V 4
Error amplifier source/sink current -8 8 μA V(COMP) = 1V, 100-mV overdrive 4
Current-limit threshold 3.5 5 A VIN = 12V 4
Switching frequency 456 570 684 KHz VIN = 12V 4
Minimum controllable on time 160 200 ns VIN = 12V 4
Maximum controllable duty ratio 90 93 % BOOT-PH = 6V 4
Error amplifier transconductance (gm) gm 90 μmhos -2μA < I(COMP) < 2μA, V(COMP) = 1V 4
Error amplifier DC gain 800 V/V VSENSE = 0.8V 4
Error amplifier unity gain bandwidth 2.7 MHz 5pF capacitance from COMP to GND pins 4
Switch current to COMP transconductance 10 A/V VIN = 12V 4
Pulse skipping Eco-mode switch current threshold 220 mA 4
Thermal shutdown 165 °C 4
SS charge current 2 μA V(SS) = 0.4V 4
SS to VSENSE matching -35 mV V(SS) = 0.4V 4

CAD (KiCad official)

  • Symbol: MD8933ESF4
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: md8933esf4-etched.step / md8933esf4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md8933esf4.step / md8933esf4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (26 pp, sha256 08733d3b925067d8, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF