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MD85E57PA1

Shanghai Mingda Microelectronics · Linear Voltage Regulators (LDO) · SOT-89-3L

MD85E57PA1 from Shanghai Mingda Microelectronics, in a SOT-89-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated output voltage pin; VOUT must not exceed VIN+0.3V, and the absolute maximum output voltage is Vss-0.3 to VIN+0.3V.
2 GND power_in Ground pin, the reference node for the device.
3 VIN power_in Power input pin; the absolute maximum input voltage is -0.3 to 45V and the operating input range is 2.2V to 40V.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-89-3L
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage VOUT(S) 0.98 1.02 ×VOUT(S) VIN=VOUT(S)+2V, IOUT=1mA 4
Line Regulation 0.01 0.02 %/V VOUT(S)+2V≤VIN≤40V, IOUT=1mA 4
Load Regulation VOUT2 50 80 mV VIN=VOUT(S)+2V, 1mA≤IOUT≤300mA, VOUT(S)>5.3V 4
Temperature Stability -50 50 ppm/℃ VIN=VOUT(S)+2V, IOUT=10mA, -40℃≤Ta≤125℃ 4
GND Current (no load) IGND 1.5 2.3 3.5 uA VEN=VIN, no load, VOUT(S)>5.3V 4
Shutdown Current ISHUT 0.1 1 uA VIN=40.0V, VEN=0 4
Input Voltage VIN 2.2 40 V 4
EN 'H' Level Voltage VENH 1.5 40 V 4
EN 'L' Level Voltage VENL 0 0.6 V 4
EN 'H' Level Current IENH -0.1 0.1 uA VIN=40V, VEN=VIN 4
EN 'L' Level Current IENL -0.1 0.1 uA VIN=40V, VEN=0 4
Short Circuit Current ISHORT 65 mA VIN=VEN=VOUT(S)+2.0V, VOUT=0V 4
Input Voltage (absolute maximum) VIN -0.3 45 V Unless otherwise indicated Ta=25℃ 3
Power Dissipation, SOT89-3 PD 1000 mW SOT89-3 package, Ta=25℃ 3
Thermal Resistance, junction-to-board, SOT89-3 RθJB 100 ℃/W Mounted on JEDEC standard 4-layer (2s2p) PCB test board 3
Operating Ambient Temperature Topr -40 85 ℃ 3
Storage Temperature Tstg -40 125 ℃ 3
ESD Protection, HBM ESD HBM 5000 V HBM 3

CAD (KiCad official)

  • Symbol: MD85E57PA1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3L (KiCad packages3D, STEP)
  • 3D model files: md85e57pa1-etched.step / md85e57pa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md85e57pa1.step / md85e57pa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (13 pp, sha256 b57d90f008c009b2, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF