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MD85E50SF4

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · ESOP-8

MD85E50SF4 from Shanghai Mingda Microelectronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated output voltage pin. Fixed 5.0V (±2%) with up to 300mA output current. Requires a low-ESR ceramic output capacitor of 2.2µF or greater placed close to the pin.
2 NC unconnected No internal connection. Leave floating or tie to GND for improved layout.
3 NC unconnected No internal connection. Leave floating or tie to GND for improved layout.
4 EN input Enable pin (active high). Drive high (VENH ≥ 1.5V, up to 40V) to enable the regulator; drive low (VENL ≤ 0.6V) to place the device in shutdown with < 1uA ISHUT. Do not leave floating.
5 GND power_in Ground reference for the device. Connect to the system ground plane along with the exposed thermal pad.
6 NC unconnected No internal connection. Leave floating or tie to GND for improved layout.
7 NC unconnected No internal connection. Leave floating or tie to GND for improved layout.
8 VIN power_in Power input pin. Operating range 2.2V to 40V (absolute maximum 45V). Requires a 2.2µF or larger input capacitor placed close to the pin to prevent oscillation.
9 GND/Thermal Pad power_in Exposed thermal pad on the ESOP-8 underside. Electrically connected to the GND node and MUST be soldered to the PCB GND plane for proper thermal performance (RθJB = 80°C/W, PD = 1800mW).

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package ESOP-8
Category PMIC
Pins 9

Ordering variants

  • MD85E50SF4SF4
  • MD85E50SF4QC3
  • MD85E50SF4QA3
  • MD85E50SF4PA1

CAD (KiCad official)

  • Symbol: MD85E50SF4
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: md85e50sf4-etched.step / md85e50sf4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md85e50sf4.step / md85e50sf4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (None pp, sha256 b57d90f008c009b2, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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