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Contents

README

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MD7673C50SF4

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · ESOP-8-EP

MD7673C50SF4 from Shanghai Mingda Microelectronics, in a ESOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference for the regulator. Must be tied to the system ground plane; also connect to the ESOP-8 exposed thermal pad for best thermal performance.
2 EN input Enable input, active-high. Drive ≥1.6V to enable the regulator; drive ≤0.4V to shut down (IQ drops to ~0.01µA and VOUT is discharged to GND through ~30Ω).
3 VIN power_in Power supply input, 2V-6V. Decouple to GND with a 4.7µF (or larger) low-ESR X5R/X7R ceramic capacitor placed close to the pin. Pins 3 and 4 are tied together internally.
4 VIN power_in Power supply input (paralleled with pin 3) for reduced series resistance at 3A load. Bond both VIN pins to the same input rail.
5 VOUT power_out Regulated output pin, up to 3A. Requires a 4.7µF (or larger) low-ESR ceramic output capacitor to GND for stability. Pins 5 and 6 are tied together internally.
6 VOUT power_out Regulated output pin (paralleled with pin 5) for reduced series resistance at 3A load. Bond both VOUT pins to the same output rail.
7 ADJ input Adjust / feedback pin. Tie to GND to select the internal 5V fixed setting; connect to the tap of an external R1/R2 divider from VOUT to program VOUT = VREF × (1 + R1/R2), VREF = 0.7V nominal. ADJ input current is ≤10nA, ADJ threshold ~0.1V.
8 N.C. unconnected No internal connection. May be left floating or tied to GND per datasheet note.
EP GND power_in Exposed thermal pad on the bottom of the ESOP-8 package. Must be soldered to the PCB ground plane both for the electrical ground return and for thermal dissipation (θJA ≈ 80 °C/W).

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package ESOP-8-EP
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • MD7673C50SF4
  • MD7673C50SF4A50SF4
  • MD7673C50SF4B50SF4
  • MD7673C50SF4E50UB2
  • MD7673C50SF4E50VC1

CAD (KiCad official)

  • Symbol: MD7673C50SF4
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: ESOP-8-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
md7673c50sf4.step 125 KB You want the bare part, or you mark your own boards.
md7673c50sf4-etched.step 2.5 MB You want the part with MD7673C50SF4 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 601 faces against 152 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (13 pp, sha256 cdbd82a6988a0c52, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF