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MD7672E50UB2

Shanghai Mingda Microelectronics · Linear Voltage Regulators (LDO) · TO-252-4L

MD7672E50UB2 from Shanghai Mingda Microelectronics, in a TO-252-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable pin: minimum 1.6V enables the device and maximum 0.4V shuts it down.
2 VIN power_in Power input pin, operating range 2 to 6V, to be closely decoupled to GND with a 4.7µF or greater ceramic capacitor.
3 GND power_in Ground signal pin.
4 VOUT power_out Regulator output pin delivering up to 2A, with a 4.7µF or larger ceramic output capacitor recommended.
5 ADJ input Adjustable pin: set the output voltage with an external resistor divider (reference 0.7V nominal), or connect to GND for the internally set VOUT = 5V.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package TO-252-4L
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 2 6 V 3
Output Voltage Tolerance VOUT(S) -2 2 % IOUT=1mA 3
Line Regulation 3 15 mV VOUT(S)+1V≤VIN=VCE≤6V, IOUT=1mA 3
Load Regulation VOUT2 10 20 mV VIN=VCE=VOUT(S)+1.0V, 1mA≤IOUT≤2A 3
Reference Voltage Tolerance 0.686 0.7 0.714 V 3
ADJ Pin Threshold 0.05 0.1 0.2 V 3
Shutdown Pin Current 0.1 0.5 μA 3
Continuous Output Current IOUT 2 A VIN>2.3V 3
Enable Turn-On Threshold 1.6 V Output ON 3
Enable Turn-Off Threshold 0.4 V Output OFF 3
Max Output Discharge Resistance 30 Ω to GND during Shutdown 3
PGOOD Sink Capability 0.05 V IPGOOD = 10mA 3
Ground Current IGND 40 μA VEN=VIN, no load 3
Ground Current IGND 390 μA VEN=VIN, IOUT=100mA 3
Shutdown Current ISHUT 0.01 μA VEN=0 3
Output Current Limit ILIM 3 A 3
Current Fold Back 0.8 A 3
Dropout Voltage VDROP 250 mV VCE=VIN, VOUT≥3V, IOUT=2A 3
Temperature Stability -50 50 ppm/℃ VIN=VCE=VOUT(S)+1.0V, IOUT=1mA, -40℃≤TA≤125℃ 3
ADJ Pin Current 10 nA VADJ = VREF 3
Shutdown Exit Delay Time 0 μs 3
PGOOD Rise Threshold PGHTH 90 % 3
PGOOD Hysteresis PGHYS 10 % 3
PGOOD Delay PGDLY 1 ms 3
Power Supply Ripple Rejection PSRR 70 dB f=1kHz, IOUT=10mA 3
Power Supply Ripple Rejection PSRR 68 dB f=10kHz, IOUT=10mA 3
Power Supply Ripple Rejection PSRR 47 dB f=100kHz, IOUT=10mA 3
Power Supply Ripple Rejection PSRR 55 dB f=1MHz, IOUT=10mA 3
Output Noise Voltage VOUTN 115 µVRMS CBP = 1µF, VOUT=3.3V f=10Hz ~100KHz 3
Thermal Shutdown Temperature TSD 175 ℃ 3
Thermal Shutdown Hysteresis TSD_HYS 35 ℃ 3
Input Voltage VIN -0.3 7 V Ta=25℃ 2
Output Voltage VOUT -0.3 V max is VIN+0.3, Ta=25℃ 2
Operating Ambient Temperature Topr -40 85 ℃ 2
Storage Temperature Tstg -40 125 ℃ 2
ESD Protection HBM ESD 4000 V HBM 2
Thermal Resistance RθJB 60 ℃/W TO252-5, JEDEC 4-layer (2s2p) PCB 2

CAD (KiCad official)

  • Symbol: MD7672E50UB2
  • Footprint: Package_TO_SOT_SMD:TO-252-4
  • 3D model: TO-252-4L (KiCad packages3D, STEP)
  • 3D model files: md7672e50ub2-etched.step / md7672e50ub2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md7672e50ub2.step / md7672e50ub2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (11 pp, sha256 e70bd5ca9e1c146d, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF