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MD7671A33PA1

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Shanghai Mingda Microelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-89-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MD7671A33PA1

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

MD7671A33PA1 from Shanghai Mingda Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground signal pin for the regulator, to be connected to the system ground.
2 VIN power_in Power input pin that must be closely decoupled to GND with a 4.7µF or greater ceramic capacitor, with an input voltage range of 2 V to 6 V.
3 VOUT power_out Regulator output pin, providing 3.3 V for this MD7671A33 variant with a continuous output current of up to 1 A.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-89-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 2 6 V 4
Output Voltage Tolerance VOUT(S) -2 2 % IOUT=1mA 4
Temperature Stability ΔVOUT/(ΔTa·VOUT(s)) -50 50 ppm/℃ VIN=VEN=VOUT(S)+1.0V, IOUT=1mA, -40℃≤TA≤125℃ 4
Reference Voltage Tolerance 0.686 0.7 0.714 V 4
Dropout Voltage VDROP 160 250 mV VEN=VIN, IOUT=1A, VOUT=3.3V 4
Line Regulation 3 15 mV VOUT(S)+1V≤VIN=VEN≤6V, IOUT=1mA 4
Load Regulation VOUT2 10 20 mV VIN=VEN=VOUT(S)+1.0V, 1mA≤IOUT≤1A 4
Input Voltage (absolute maximum) VIN -0.3 7 V 3
Output Voltage (absolute maximum) VOUT -0.3 V upper limit printed as VIN+0.3 (not numeric) 3
Operating Ambient Temperature Topr -40 85 ℃ 3
Storage Temperature Tstg -40 125 ℃ 3
Continuous Output Current IOUT 1 A VIN>2.1V 4
Ground Current (no load) IGND 40 μA VEN=VIN, no load 4
Ground Current (IOUT=100mA) IGND 390 μA VEN=VIN, IOUT=100mA 4
Shutdown Current ISHUT 0.01 μA VEN=0 4
Output Current Limit ILIM 1.4 A 4
Current Fold Back 0.4 A 4
Power Supply Ripple Rejection PSRR 70 dB f=1kHz, IOUT=10mA 4
Power Supply Ripple Rejection PSRR 68 dB f=10kHz, IOUT=10mA 4
Power Supply Ripple Rejection PSRR 47 dB f=100kHz, IOUT=10mA 4
Power Supply Ripple Rejection PSRR 55 dB f=1MHz, IOUT=10mA 4
Thermal Shutdown Temperature TSD 175 ℃ 4
Thermal Shutdown Hysteresis TSD_HYS 35 ℃ 4
ESD Protection (HBM) ESD HBM 4000 V 3
Thermal Resistance Junction-to-Board (SOT89-3) RθJB 100 ℃/W Mounted on JEDEC standard 4-layer (2s2p) PCB test board 3

CAD (KiCad official)

  • Symbol: MD7671A33PA1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: md7671a33pa1-etched.step / md7671a33pa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md7671a33pa1.step / md7671a33pa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (14 pp, sha256 5934758f3aa04fb8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF