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MD7602D60

Shanghai Mingda Microelectronics · Linear Voltage Regulators (LDO) · TO-252

MD7602D60 from Shanghai Mingda Microelectronics, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply pin, with an input voltage range of 2.2V to 40V and an absolute maximum rating of 45V.
2 GND power_in Ground reference pin, which must be connected to the VOUT pin for the short-circuit current test with impedance below 0.1 ohm.
3 VOUT power_out Regulated output pin, which must not be driven above VIN+0.3V because reverse current through the parasitic diodes can destroy the IC.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package TO-252
Category Power Supply Chip
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN -0.3 45 V 2
Input Voltage VIN 2.2 40 V 3
CE H Level Voltage VCEH 1.5 40 V 3
CE L Level Voltage VCEL 0 0.6 V 3
Output Voltage Accuracy VOUT(S) -2 2 % Output voltage accuracy ±2% as printed in features 1
Temperature Stability ΔVOUT/(VOUT·ΔT) -50 50 ppm/℃ VIN = VOUT(S)+2V, IOUT=10mA, -40℃≤Ta≤85℃ 3
Line Regulation ΔVOUT/(VOUT·ΔVIN) 0.01 0.02 %/V VOUT(S)+2V≤VIN≤40V, IOUT=1mA 3
Load Regulation VOUT2 20 80 mV VIN=VOUT(S)+2V, 1mA≤IOUT≤300mA, VOUT(S)≤10V 3
Dropout Voltage VDROP 4 8 mV IOUT=1mA 3
Dropout Voltage VDROP 1000 1500 mV IOUT=1A 3
GND Current IGND 1.5 2.3 3 uA no load, VOUT(S)>5.3V 3
Shutdown Current ISHUT 0.01 0.1 uA VIN=40.0V, VCE=0 3
Maximum Output Current IOUTMAX 1 A 3
Current Limit ILIM 1.8 A VIN= VOUT(S)+2V, VOUT = 0.95 ×VOUT(S) 3
Short Circuit Current ISHORT 95 mA VIN=VOUT(S)+2V, VOUT=0V 3
CE H Level Current ICEH -0.1 0.1 uA VIN=40V, VCE=VIN 3
CE L Level Current ICEL -0.1 0.1 uA VIN=40V, VCE=0 3
Over Temperature Protection OTP 145 ℃ IOUT=10mA 3
Power Dissipation PD 1800 mW TO 252 package 2
Operating Ambient Temperature Topr -40 85 ℃ 2
Storage Temperature Tstg -40 125 ℃ 2
ESD Protection ESD HBM 2000 V HBM 2

CAD (KiCad official)

  • Symbol: MD7602D60
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: md7602d60-etched.step / md7602d60-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md7602d60.step / md7602d60.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (12 pp, sha256 9e179526083a4a88, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF