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MD7218D33UA2

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-252-2L

MD7218D33UA2 from Shanghai Mingda Microelectronics, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply pin; the absolute maximum rating is -0.3 V to 15 V, while the electrical characteristics table lists an input voltage range of 2.2 V to 18 V.
2 VOUT power_out Regulated output pin rated for up to 1 A; VOUT must not exceed VIN+0.3 V, because reverse current through parasitic diodes can destroy the IC.
3 GND power_in Ground reference pin, labelled 3 on the TO252-2L top view; the datasheet gives no further functional description for it.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package TO-252-2L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage (min/max printed as multiples of VOUT(S); VOUT(S)=3.3 V for this MPN) VOUT(S) 0.98 1.02 V VIN= VOUT(S)+2V, IOUT=1mA 4
Output Voltage Accuracy -2 2 % 1
Dropout Voltage VDROP 4 8 mV IOUT=1mA 4
Dropout Voltage VDROP 650 900 mV IOUT=1A 4
Line Regulation 0.01 0.02 %/V VOUT(S)+2V≤VIN≤15V, IOUT=1mA 4
Load Regulation VOUT2 80 mV VIN=VOUT(S)+2V, 1mA≤IOUT≤1A, VOUT(S)≤5.0V 4
Temperature Stability -50 50 ppm/℃ VIN = VOUT(S)+2V, IOUT=1mA, -40℃≤Ta≤125℃ 4
GND Current IGND 1 1.6 2 µA no load, VOUT(S)≤5.0V 4
Input Voltage VIN 2.2 18 V 4
Input Voltage (absolute maximum) VIN -0.3 15 V 3
Operating Ambient Temperature Topr -40 85 ℃ 3
Storage Temperature Tstg -40 125 ℃ 3
Power Dissipation (TO252-2L) PD 1800 mW TO252-2L 3
Thermal Resistance RθJB (TO252-2L) RθJB 55 ℃/W TO252-2L, mounted on JEDEC standard 4-layer (2s2p) PCB test board 3
ESD Protection HBM ESD HBM 4000 V HBM 3

CAD (KiCad official)

  • Symbol: MD7218D33UA2
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: md7218d33ua2-etched.step / md7218d33ua2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md7218d33ua2.step / md7218d33ua2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (15 pp, sha256 a1ab1acfaf9f63a7, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF