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Contents

README

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MD7218A36PA1

Shanghai Mingda Microelectronics · Linear Voltage Regulators (LDO) · SOT-89-3L

MD7218A36PA1 from Shanghai Mingda Microelectronics, in a SOT-89-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the regulator.
2 VIN power_in Input supply, 2.2V to 18V operating (absolute maximum -0.3 to 15V), also connected to the package tab; place a 2.2uF input capacitor close to the IC.
3 VOUT power_out Regulated 3.6V output delivering up to 1A, must not exceed VIN+0.3V; use a 2.2uF low-ESR ceramic output capacitor placed close to the IC.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-89-3L
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage VOUT(S) 0.98 1 1.02 ×VOUT(S) VIN=VOUT(S)+2V, IOUT=1mA 4
Dropout Voltage VDROP 4 8 mV IOUT=1mA 4
Dropout Voltage VDROP 650 900 mV IOUT=1A 4
Line Regulation 0.01 0.02 %/V VOUT(S)+2V≤VIN≤15V, IOUT=1mA 4
Temperature Stability -50 50 ppm/℃ VIN=VOUT(S)+2V, IOUT=1mA, -40℃≤Ta≤125℃ 4
GND Current IGND 1 1.6 2 µA no load, VOUT(S)≤5.0V 4
Input Voltage VIN 2.2 18 V 4
Maximum Output Current IOUTMAX 1 A 4
Input Voltage VIN -0.3 15 V Ta=25℃ 3
Power Dissipation SOT89-3L PD 1000 mW Ta=25℃ 3
Operating Ambient Temperature Topr -40 85 ℃ 3
Storage Temperature Tstg -40 125 ℃ 3
ESD Protection HBM ESD 4000 V HBM 3
Thermal Resistance SOT89-3L RθJB 100 ℃/W JEDEC 4layer (2s2p) PCB 3
Load Regulation ΔVOUT2 80 mV VIN=VOUT(S)+2V, 1mA≤IOUT≤1A, VOUT(S)≤5.0V 4
GND Current IGND 420 µA IOUT=100mA 4
Current Limit ILIM 1.5 A VIN=VOUT(S)+2V, VOUT=0.95×VOUT(S) 4
Short Circuit Current ISHORT 30 mA VIN=VOUT(S)+2.0V, VOUT=0V 4
Over Temperature Protection OTP 150 ℃ IOUT=1mA 4
PSRR PSRR 70 dB f=100Hz, IOUT=10mA 4

CAD (KiCad official)

  • Symbol: MD7218A36PA1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3L (KiCad packages3D, STEP)
  • 3D model files: md7218a36pa1-etched.step / md7218a36pa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md7218a36pa1.step / md7218a36pa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (15 pp, sha256 a1ab1acfaf9f63a7, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF