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MD57E12WB6

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Shanghai Mingda Microelectronics Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management icsmd57e12wb6factory-2.0.0extractor-text

Verified MD57E12WB6

by Ray · last 5 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

5 Nov 2026RayPublished by the parts factory: tier lcsc, 5 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: MD57E12WB6 · XDFN-4-EP(1x1) · 5 pins
  • ✓copper: 5 copper pads, none touching another net
  • ✓datasheet: all 5 pin names found in the 12-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-lft77eyj/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 5 pins = 5 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 5 pins agree
  • ✓symbol_text: no pin names collide
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ md57e12wb6.kicad_sym✓ md57e12wb6.kicad_mod✓ md57e12wb6.step
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Contents

README

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MD57E12WB6

Shanghai Mingda Microelectronics · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

MD57E12WB6 from Shanghai Mingda Microelectronics, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply pin, specified from 2.2 V to 5.5 V with an absolute maximum rating of -0.3 V to 6.0 V, and requires a 1 µF ceramic input capacitor.
2 EN input Enable input: the voltage must exceed VENH (0.85 V min) to fully enable the device and be below VENL (0.35 V max) to disable it and activate output discharge, and it is internally pulled down to GND through 1 MΩ.
3 GND power_in Ground reference pin for the regulator.
4 VOUT power_out Regulated output of 1.2 V for this part (±2% tolerance) rated up to 300 mA, requiring at least a 1 µF ceramic output capacitor that may be placed up to 10 cm away.
5 EP passive Exposed thermal pad shown on the package drawing; the datasheet does not state its electrical function or required connection.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package XDFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage tolerance (VOUT(S) < 2.0 V, IOUT=1mA) VOUT(S) -0.03 0 0.03 V VIN=VOUT(S)+2.0V, IOUT=1mA, VOUT(S)<2.0V; printed as VOUT(S)-0.03 / VOUT(S)+0.03 4
Dropout Voltage (VOUT < 3 V) VDROP 130 mV VEN=VIN, VOUT<3V, IOUT=300mA 4
Line Regulation ΔVOUT/(VOUT·ΔVIN) 0.02 0.1 %/V VOUT(S)+1.0V≤VIN=VEN≤5.5V, IOUT=10mA 4
Line Transient (VIN rising VOUT+1V to VOUT+2V) VOUT_Line -1 mV VIN=VOUT+1V to VOUT+2V in 30us 4
Line Transient (VIN falling VOUT+2V to VOUT+1V) VOUT_Line 1 mV VIN=VOUT+2V to VOUT+1V in 30us 4
Load Regulation VOUT2 10 20 mV VIN=VEN=VOUT(S)+1.0V, 1mA≤IOUT≤300mA 4
Load Transient (IOUT 1mA to 300mA in 10µs) VOUT_Load -40 mV IOUT=1mA to 300mA in 10µs 4
Load Transient (IOUT 300mA to 1mA in 10µs) VOUT_Load 40 mV IOUT=300mA to 1mA in 10µs 4
Output Voltage Temperature Stability TCVOUT -100 100 ppm/℃ VIN=VEN=VOUT(S)+1.0V, IOUT=1mA, -40℃≤Ta≤125℃ 4
GND Current (no load) IGND 20 30 µA VEN=VIN, no load 4
GND Current (IOUT=300mA) IGND 470 µA VEN=VIN, IOUT=300mA 4
Shutdown Current ISHUT 0.01 0.1 µA VIN=5.5V, VEN=0 4
Input Voltage VIN 2.2 5.5 V 4
Maximum Output Current IOUTMAX 250 300 mA 4
Current Limit ILIM 500 mA VIN=VEN=VOUT(S)+1.0V, VOUT=0.95×VOUT(S) 4
COUT Auto Discharge Resistance RDCHG 240 Ω VEN=0, VOUT=VOUT(S) 4
Power Supply Rejection Ratio f=1kHz PSRR 94 dB f=1kHz, IOUT=20mA 4
Power Supply Rejection Ratio f=10kHz PSRR 72 dB f=10kHz, IOUT=20mA 4
Power Supply Rejection Ratio f=100kHz PSRR 77 dB f=100kHz, IOUT=20mA 4
Power Supply Rejection Ratio f=1MHz PSRR 53 dB f=1MHz, IOUT=20mA 4
Output Noise Voltage eN 20 µVRMS IOUT=20mA 4
Start-Up Time TSTART 80 150 µs From VEN>VENH to VOUT=95% of VOUT 4
Overshoot on Start-Up VOUT_Start-up 5 % Stated as a percentage of VOUT(S) 4
EN 'H' Level Voltage VENH 0.85 5.5 V 4
EN 'L' Level Voltage VENL 0 0.35 V 4
EN 'H' Level Current IENH -0.1 0.1 µA VIN=5.5V, VEN=VIN 4
EN 'L' Level Current IENL -0.1 0.1 µA VIN=5.5V, VEN=0 4
Over Temperature Protection OTP 155 ℃ IOUT=1mA 4
Input Voltage (absolute maximum) VIN -0.3 6 V 3
Power Dissipation (DFN1*1-4L) PD 200 mW DFN1*1-4L package 3
Thermal Resistance Junction-to-Board (DFN1*1-4L) RθJB 160 ℃/W DFN1*1-4L, mounted on JEDEC 4-layer (2s2p) PCB 3
Operating Ambient Temperature Topr -40 85 ℃ 3
Storage Temperature Tstg -40 125 ℃ 3
ESD Protection HBM ESD HBM 6000 V HBM 3
Operating Junction Temperature TJ -40 125 ℃ 10
Output Capacitor Range COUT 1 10 µF Design requirement 10
Input/Output Capacitor ESR Range ESR 5 500 mΩ Design requirement 10

CAD (KiCad official)

  • Symbol: MD57E12WB6
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: md57e12wb6-etched.step / md57e12wb6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md57e12wb6.step / md57e12wb6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (12 pp, sha256 42680ba6ee0683b4, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF