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MD53U30

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

MD53U30 from Shanghai Mingda Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground (VSS) pin; place the output capacitor close to the VOUT and GND pins and keep the ground wiring low impedance.
2 VDD power_in Input supply pin (VIN); operating input voltage up to 10V (absolute maximum 12V), and the datasheet advises a capacitor at the input when source impedance is high.
3 VOUT power_out Regulated 3.0V output (±2%) delivering 500mA; requires a 2.2uF or larger output capacitor with 0.5-5 ohm ESR, and must not exceed VIN+0.3V.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-89-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage VOUT 2.94 3 3.06 V VIN= 4.0V,IOUT=50mA 3
Output current IOUT 500 mA VIN= 4.0V 3
Input-output voltage difference (dropout) Vdrop 10 14 mV IOUT=10 mA 3
Input-output voltage difference (dropout) Vdrop 200 280 mV IOUT=200 mA 3
Input stability △VOUT1 0.05 0.2 %/V 4.0V≤VIN≤10V IOUT=1mA 3
Load stability △VOUT2 25 40 mV VIN=4.0V 1.0mA≤IOUT≤200mA 3
Output voltage temperature coefficient △VOUT -100 50 100 Ppm/℃ VIN=4.0V,IOUT=10mA -40℃≤Ta≤85℃ 3
Current consumption ISS 25 40 uA VIN= VOUT(S)+2V 无负载 3
Input voltage VIN 10 V 3
Output short-circuit current Ilim 50 70 mA Vout=0V 3
Input voltage (absolute maximum) VIN 12 V 2
Allowable power dissipation PD 500 Mw SOT_89 package 2
Operating ambient temperature range Topr -40 85 ℃ 2
Storage ambient temperature range Tstg -40 125 ℃ 2
Ripple rejection PSRR 65 dB VIN=VOUT(S)+1V+1Vp_p f = 1KC Iout=50mA 3

CAD (KiCad official)

  • Symbol: MD53U30
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: md53u30-etched.step / md53u30-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md53u30.step / md53u30.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (11 pp, sha256 5a4556463821b84c, retrieved 2026-10-20, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF