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MD5313

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3L

MD5313 from Shanghai Mingda Microelectronics, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin, reference for the 1.3V ±2% output; keep its wiring low impedance and place the output capacitor close to VOUT and GND.
2 VOUT power_out Regulated 1.3V ±2% output delivering at least 500mA, requiring a 2.2µF or larger output capacitor (ESR 0.5~5Ω recommended), short-circuit current typically 50mA, and must not exceed VIN+0.3V.
3 VIN power_in Input supply pin with operating input voltage up to 10V (absolute maximum 12V), requiring an input capacitor of 1.0µF or more.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-23-3L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN 12 V 2
Power dissipation (SOT-23) PD 250 mW SOT-23 package 2
Operating ambient temperature range TOPR -40 85 ℃ 3
Storage ambient temperature range TSTG -40 125 ℃ 3
Input voltage VIN 10 V 3
Output current IOUT 500 mA VIN=VOUT+1V 3
Output voltage accuracy (product table tolerance) -2 2 % 2
Input stability ΔVOUT1/ΔVIN*VOUT 0.15 0.3 %/V VOUT+1V≤VIN≤10V, IOUT=10mA 3
Load stability ΔVOUT2 15 30 mV VIN=VOUT+1V, 1mA≤IOUT≤100mA 3
Output voltage temperature coefficient ΔVOUT/ΔTa*VOUT -100 50 100 ppm/℃ VIN=VOUT+1V, IOUT=1mA, -40℃≤Ta≤125℃ 3
Quiescent (ground) current ISS1 1.2 2.5 uA VIN=10V, no load 3
Output short-circuit current ISHORT 50 70 mA VOUT=0V 3
Power supply ripple rejection PSRR 40 dB f=100Hz, IOUT=10mA 3
Power supply ripple rejection PSRR 20 dB f=1kHz, IOUT=10mA 3
Thermal resistance, junction to ambient (SOT-23) RθJA 200 ℃/W SOT-23 package 3

CAD (KiCad official)

  • Symbol: MD5313
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: md5313-etched.step / md5313-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md5313.step / md5313.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (17 pp, sha256 0399e6cc194b1b17, retrieved 2026-10-21, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF