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MD52A40PA1

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3L

MD52A40PA1 from Shanghai Mingda Microelectronics, in a SOT-89-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin; the internal COUT auto-discharge switch is connected between the VOUT and GND pins.
2 VIN power_in Input supply pin with an operating range of 2.2V to 7.0V and an absolute maximum rating of -0.3V to 8V; a 1.0µF input capacitor is specified.
3 VOUT power_out Regulated output pin, which must not be driven above VIN+0.3V; a 1.0µF output capacitor is specified.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-89-3L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 2.2 7 V 4
Output Voltage tolerance (VOUT(S)=4.0V for MD52A40PA1) VOUT(S) -2 2 % VIN=VOUT(S)+1.0V, IOUT=10mA, VOUT(S)≥2.0V 4
Line Regulation ΔVOUT/ΔVIN 0.05 0.1 %/V VOUT(S)+0.5V≤VIN=VEN≤7V, IOUT=10mA 4
Load Regulation VOUT2 50 90 mV VIN=VEN=VOUT(S)+1.0V, 1mA≤IOUT≤500mA 4
Temperature Stability -50 50 ppm/℃ VIN=VEN=VOUT(S)+1.0V, IOUT=1mA, -40℃≤Ta≤125℃ 4
GND Current IGND 0.6 0.9 μA VEN=VIN, no load 4
Shutdown Current ISHUT 0.01 0.1 μA VIN=7.0V, VEN=0 4
Maximum Output Current IOUTMAX 450 500 mA 4
COUT Auto Discharge RDCHG 280 450 640 Ω VEN=0, VOUT=VOUT(S) 4
EN 'H' Level Voltage VENH 1 7 V 4
EN 'L' Level Voltage VENL 0 0.38 V 4
EN 'H' Level Current IENH -0.1 0.1 μA VIN=7.0V, VEN=VIN 4
EN 'L' Level Current IENL -0.1 0.1 μA VIN=7.0V, VEN=0 4
Input Voltage (absolute maximum) VIN -0.3 8 V 3
Power Dissipation PD 1000 mW SOT89-3 package 3
Operating Ambient Temperature Topr -40 85 ℃ 3
Storage Temperature Tstg -40 125 ℃ 3
ESD Protection HBM ESD HBM 6000 V HBM 3
Thermal Resistance junction-to-board (SOT89-3) RθJB 100 ℃/W Mounted on JEDEC standard 4-layer (2s2p) PCB 3

CAD (KiCad official)

  • Symbol: MD52A40PA1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3L (KiCad packages3D, STEP)
  • 3D model files: md52a40pa1-etched.step / md52a40pa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md52a40pa1.step / md52a40pa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (14 pp, sha256 4168b8cf3e52f15f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF