component
MD5118
Public Made by Adomby adom
Shanghai Mingda Microelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MD5118
Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-4-EP(1x1)
MD5118 from Shanghai Mingda Microelectronics, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated output (1.8V for MD5118, ±2%, up to 300mA max output); needs at least 0.1uF output capacitor and must not exceed VIN+0.3V. |
| 2 | GND | power_in | Ground; also the return for the internal COUT auto-discharge switch from VOUT. |
| 3 | CE | input | Chip enable, active high: VCE high level 1.0V to 6.0V enables the output, low level 0 to 0.38V shuts down the IC and discharges COUT. |
| 4 | VIN | power_in | Supply input, 1.5V to 7V operating (absolute maximum 8.0V); needs at least 1.0uF input capacitor placed close to the IC. |
| 5 | EP | passive | Exposed pad labelled EP (pin 5) in the DFNWB-4L top view; the datasheet text does not state its connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Mingda Microelectronics |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (MD5118, 1.8V nominal), offset from VOUT(S) | VOUT(S) | -0.03 | 0.03 | V | VIN=VOUT(S)+2.0V, IOUT=10mA, VOUT(S)<2.0V | 2 | |
| Line Regulation | ΔVOUT/(VOUT·ΔVIN) | 0.05 | 0.1 | %/V | VOUT(S)+0.5V≤VIN=VCE≤7V, IOUT=10mA | 2 | |
| Load Regulation | VOUT2 | 6 | 20 | mV | VIN=VCE=VOUT(S)+1.0V, 1mA≤IOUT≤100mA | 2 | |
| Temperature Stability | ΔVOUT/(VOUT·ΔT) | -50 | 50 | ppm/℃ | VIN=VCE=VOUT(S)+1.0V, IOUT=1mA, -40℃≤Ta≤85℃ | 2 | |
| Dropout Voltage (VOUT<3V) | VDROP | 70 | mV | VCE=VIN, VOUT<3V, IOUT=100mA | 2 | ||
| GND Current, no load | IGND | 0.5 | 0.9 | uA | CE=VIN, no load | 2 | |
| GND Current, IOUT=100mA | IGND | 40 | uA | CE=VIN, IOUT=100mA | 2 | ||
| Shutdown Current | ISHUT | 0.01 | 0.1 | uA | VIN=7.0V, VCE=0 | 2 | |
| Input Voltage | VIN | 1.5 | 7 | V | 2 | ||
| Maximum Output Current | IOUTMAX | 250 | 300 | mA | 2 | ||
| Current Limit | ILIM | 300 | 470 | mA | VIN=VCE=VOUT(S)+1.0V, VOUT=0.95×VOUT(S) | 2 | |
| COUT Auto Discharge Resistance | RDCHG | 280 | 450 | 640 | Ω | VCE=0, VOUT=VOUT(S) | 2 |
| Power Supply Rejection Ratio, 10Hz | PSRR | 60 | dB | f=10Hz, VOUT(S)=2.5V | 2 | ||
| Power Supply Rejection Ratio, 100Hz | PSRR | 45 | dB | f=100Hz, VOUT(S)=2.5V | 2 | ||
| Power Supply Rejection Ratio, 1kHz | PSRR | 25 | dB | f=1kHz, VOUT(S)=2.5V | 2 | ||
| CE 'H' Level Voltage | VCEH | 1 | 6 | V | 2 | ||
| CE 'L' Level Voltage | VCEL | 0 | 0.38 | V | 3 | ||
| CE 'H' Level Current | ICEH | -0.1 | 0.1 | uA | VIN=6.0V, VCE=VIN | 3 | |
| CE 'L' Level Current | ICEL | -0.1 | 0.1 | uA | VIN=6.0V, VCE=0 | 3 | |
| Short Circuit Current | ISHORT | 65 | mA | VIN=VCE=VOUT(S)+1.0V, VOUT=0V | 2 | ||
| Input Voltage (absolute maximum) | VIN | -0.3 | 8 | V | 2 | ||
| Output Voltage (absolute maximum) | VOUT | -0.3 | V | Maximum stated as VIN+0.3V | 2 | ||
| Power Dissipation, DFNWB-4L | PD | 100 | mW | DFNWB-4L package | 2 | ||
| Operating Ambient Temperature | Topr | -40 | 85 | ℃ | 2 | ||
| Storage Temperature | Tstg | -40 | 125 | ℃ | 2 | ||
| ESD Protection, HBM | ESD HBM | 6000 | V | 2 |
CAD (KiCad official)
- Symbol:
MD5118 - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
md5118-etched.step/md5118-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);md5118.step/md5118.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shanghai Mingda Microelectronics datasheet (14 pp, sha256
b9016866a24d108a, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MD5118
**Shanghai Mingda Microelectronics** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-4-EP(1x1)
MD5118 from Shanghai Mingda Microelectronics, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated output (1.8V for MD5118, ±2%, up to 300mA max output); needs at least 0.1uF output capacitor and must not exceed VIN+0.3V. |
| 2 | GND | power_in | Ground; also the return for the internal COUT auto-discharge switch from VOUT. |
| 3 | CE | input | Chip enable, active high: VCE high level 1.0V to 6.0V enables the output, low level 0 to 0.38V shuts down the IC and discharges COUT. |
| 4 | VIN | power_in | Supply input, 1.5V to 7V operating (absolute maximum 8.0V); needs at least 1.0uF input capacitor placed close to the IC. |
| 5 | EP | passive | Exposed pad labelled EP (pin 5) in the DFNWB-4L top view; the datasheet text does not state its connection. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Mingda Microelectronics |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management (PMIC) |
| Pins | 5 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (MD5118, 1.8V nominal), offset from VOUT(S) | VOUT(S) | -0.03 | | 0.03 | V | VIN=VOUT(S)+2.0V, IOUT=10mA, VOUT(S)<2.0V | 2 |
| Line Regulation | ΔVOUT/(VOUT·ΔVIN) | | 0.05 | 0.1 | %/V | VOUT(S)+0.5V≤VIN=VCE≤7V, IOUT=10mA | 2 |
| Load Regulation | VOUT2 | | 6 | 20 | mV | VIN=VCE=VOUT(S)+1.0V, 1mA≤IOUT≤100mA | 2 |
| Temperature Stability | ΔVOUT/(VOUT·ΔT) | -50 | | 50 | ppm/℃ | VIN=VCE=VOUT(S)+1.0V, IOUT=1mA, -40℃≤Ta≤85℃ | 2 |
| Dropout Voltage (VOUT<3V) | VDROP | | | 70 | mV | VCE=VIN, VOUT<3V, IOUT=100mA | 2 |
| GND Current, no load | IGND | | 0.5 | 0.9 | uA | CE=VIN, no load | 2 |
| GND Current, IOUT=100mA | IGND | | | 40 | uA | CE=VIN, IOUT=100mA | 2 |
| Shutdown Current | ISHUT | | 0.01 | 0.1 | uA | VIN=7.0V, VCE=0 | 2 |
| Input Voltage | VIN | 1.5 | | 7 | V | | 2 |
| Maximum Output Current | IOUTMAX | | 250 | 300 | mA | | 2 |
| Current Limit | ILIM | | 300 | 470 | mA | VIN=VCE=VOUT(S)+1.0V, VOUT=0.95×VOUT(S) | 2 |
| COUT Auto Discharge Resistance | RDCHG | 280 | 450 | 640 | Ω | VCE=0, VOUT=VOUT(S) | 2 |
| Power Supply Rejection Ratio, 10Hz | PSRR | | 60 | | dB | f=10Hz, VOUT(S)=2.5V | 2 |
| Power Supply Rejection Ratio, 100Hz | PSRR | | 45 | | dB | f=100Hz, VOUT(S)=2.5V | 2 |
| Power Supply Rejection Ratio, 1kHz | PSRR | | 25 | | dB | f=1kHz, VOUT(S)=2.5V | 2 |
| CE 'H' Level Voltage | VCEH | 1 | | 6 | V | | 2 |
| CE 'L' Level Voltage | VCEL | 0 | | 0.38 | V | | 3 |
| CE 'H' Level Current | ICEH | -0.1 | | 0.1 | uA | VIN=6.0V, VCE=VIN | 3 |
| CE 'L' Level Current | ICEL | -0.1 | | 0.1 | uA | VIN=6.0V, VCE=0 | 3 |
| Short Circuit Current | ISHORT | | 65 | | mA | VIN=VCE=VOUT(S)+1.0V, VOUT=0V | 2 |
| Input Voltage (absolute maximum) | VIN | -0.3 | | 8 | V | | 2 |
| Output Voltage (absolute maximum) | VOUT | -0.3 | | | V | Maximum stated as VIN+0.3V | 2 |
| Power Dissipation, DFNWB-4L | PD | | | 100 | mW | DFNWB-4L package | 2 |
| Operating Ambient Temperature | Topr | -40 | | 85 | ℃ | | 2 |
| Storage Temperature | Tstg | -40 | | 125 | ℃ | | 2 |
| ESD Protection, HBM | ESD HBM | | | 6000 | V | | 2 |
## CAD (KiCad official)
- Symbol: `MD5118`
- Footprint: `Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm`
- 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files: `md5118-etched.step` / `md5118-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `md5118.step` / `md5118.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Shanghai Mingda Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588917596187447296) (14 pp, sha256 `b9016866a24d108a`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/md5118-datasheet.pdf)