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MD3156E33QA3

Shanghai Mingda Microelectronics · DC-DC Converters · SOT-23-3L

MD3156E33QA3 from Shanghai Mingda Microelectronics, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground Connection. It should be connected as close as possible to the output capacitor avoiding the high current switch paths.
2 SW output To connect inductor to VIN.
3 OUT power_out Output voltage pin, with 10μF ceramic capacitor closely connected to GND.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-23-3L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage Range VIN 1.1 5 V 4
Startup Voltage VSTART 1.1 V IOUT=1mA 4
Hold Voltage VHOLD 0.5 0.7 V IOUT=50mA 4
Output Voltage Range VOUT 1.8 3.6 V 4
Output Voltage accuracy 2 % IOUT=0mA 4
Line regulation 0.1 0.2 %/V IOUT=50mA 4
Load regulation 1 2 % IOUT=0~300mA 4
Switching Frequency FOSC 0.7 1 1.4 MHz VOUT=0.95*VO, No inductor 4
Max Duty cycle 85 90 95 % VOUT=0.95*VO, No inductor 4
Quiescent Current at VOUT IQ 5 8 15 μA VOUT=1.05*VO 4
Supply current at VIN 20 μA IOUT=0mA 4
Efficiency 85 % IOUT=100mA 4
PMOS Rdson RdsonP 400 600 mohm ISW=100mA 4
NMOS Rdson RdsonN 200 300 mohm ISW=100mA 4
SW Leakage Current ISWLK 1 μA VOUT=3.6V, VSW=0 or 5.2V 4
SW Voltage VSW -0.3 6 V 3
Output Voltage VOUT -0.3 6 V 3
Enable Voltage VEN -0.3 6 V 3
Power Dissipation SOT23-3L PD 500 mW 3
Thermal Resistance SOT23-3L RθJB 180 ℃/W Mounted on JEDEC standard 4layer (2s2p) PCB test board 3
Operating Ambient Temperature Topr -40 85 ℃ 3
Storage Temperature Tstg -40 125 ℃ 3
ESD Protection HBM ESD HBM 8000 V 3
Lead Temperature 260 ℃ 10 S 3

CAD (KiCad official)

  • Symbol: MD3156E33QA3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: md3156e33qa3-etched.step / md3156e33qa3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md3156e33qa3.step / md3156e33qa3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (10 pp, sha256 ac12d36d083b72b9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF