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Contents

README

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MCU60N04A-TP

MCC Micro Commercial Components · MOSFETs · DPAK

MCU60N04A-TP from MCC Micro Commercial Components, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GATE input Gate terminal of the N-channel MOSFET; gate-source voltage is rated at ±20 V (VGS).
2 DRAIN passive Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 40 V (VDS) with 60 A continuous drain current.
3 SOURCE passive Source terminal of the N-channel MOSFET, the reference for gate-source voltage (±20 V) and drain-source ratings.

Key specifications

Parameter Value
Manufacturer MCC Micro Commercial Components
Package DPAK
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 40 V VGS=0V, ID=250µA 2
Gate-Threshold Voltage VGS(th) 0.9 2 V VDS=VGS, ID=250µA 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS=40V, VGS=0V 2
Drain-Source On-Resistance (VGS=10V) RDS(on) 5.4 7 mΩ VGS=10V, ID=20A 2
Drain-Source On-Resistance (VGS=4.5V) RDS(on) 6.8 9.6 mΩ VGS=4.5V, ID=20A 2
Drain-Source Diode Forward Voltage VSD 1.2 V VGS=0V, IS=20A 2
Continuous Drain-Source Diode Forward Current IS 60 A 2
Pulsed Drain-Source Diode Forward Current ISM 240 A 2
Drain-Source Voltage VDS 40 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 60 A 1
Drain Current-Pulsed IDM 240 A 1
Single Pulsed Avalanche Energy EAS 400 mJ VDD=50V, VG=10V, RG=25Ω, starting TJ=25°C (Note 1) 1
Power Dissipation PD 70 W 1
Operating Junction Temperature Range -55 150 °C 1
Storage Temperature Range -55 150 °C 1
Thermal Resistance 2.15 °C/W Junction to Case 1

CAD (KiCad official)

  • Symbol: MCU60N04A-TP
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: mcu60n04a-tp-etched.step / mcu60n04a-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcu60n04a-tp.step / mcu60n04a-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC Micro Commercial Components datasheet (4 pp, sha256 61bf954fde905a99, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF