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MCR100-8G

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by adom

FUXINSEMI Thyristors (SCR)/Modules, TO-92. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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MCR100-8G

FUXINSEMI · Thyristors (SCR)/Modules · TO-92

MCR100-8G from FUXINSEMI, in a TO-92. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode (K1) of the SCR; the on-state current IT(RMS) up to 0.8 A returns through this terminal.
2 G input Gate (G3) trigger input; gate trigger current IGT is 10 to 200 μA at VD=12V, peak gate current IGM is 0.2 A max.
3 A passive Anode (A2) of the SCR; VDRM/VRRM of 600/800 V, with IT(RMS) of 0.8 A.

Key specifications

Parameter Value
Manufacturer FUXINSEMI
Package TO-92
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak off-state voltage VDRM 800 V 2
Repetitive peak reverse voltage VRRM 800 V 2
RMS on-state current IT(RMS) 0.8 A 2
Non repetitive surge peak on-state current ITSM 8 A full cycle, F=50Hz 2
I2t value for fusing I2t 0.32 A2s tp=10ms 2
Critical rate of rise of on-state current dIT/dt 50 A/μs IG =2×IGT 2
Peak gate current IGM 0.2 A 2
Average gate power dissipation PG(AV) 0.1 W 2
Junction temperature TJ -40 110 ℃ 2
Storage temperature TSTG -40 150 ℃ 2
Gate trigger current IGT 10 200 μA VD =12V IT=10mA Tj =25℃ 2
Gate trigger voltage VGT 0.8 V 2
Gate non-trigger voltage VGD 0.2 V VD =1/2VDRM Tj =110℃ 2
Latching current IL 3 mA VD =12V IG=0.5mA RGK=1kΩ Tj =25℃ 2
Holding current IH 4 mA 2
Critical-rate of rise of commutation voltage dVD/dt 10 V/μs VD=2/3VDRM Gate Open Tj =110℃ 2
Forward on voltage VTM 1.5 V ITM =1.2A tp=380μs 2
Repetitive Peak Off-State Current IDRM 5 μA VD =VDRM VR =VRRM Tj=25℃ 2
Repetitive Peak Reverse Current IRRM 0.1 mA Tj=110℃ 2
Thermal resistance junction to case Rth(j-c) 60 ℃/W Junction to case 2
Thermal resistance junction to ambient Rth(j-a) 150 ℃/W Junction to ambient 2

CAD (KiCad official)

  • Symbol: MCR100-8G
  • Footprint: Package_TO_SOT_THT:TO-92_Inline
  • 3D model: TO-92 (KiCad packages3D, STEP)
  • 3D model files: mcr100-8g-etched.step / mcr100-8g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcr100-8g.step / mcr100-8g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUXINSEMI datasheet (4 pp, sha256 22d7b77fcce68cf9, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF