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MCP73833-FCI
Public Made by Adomby adom
Microchip Tech Battery Management ICs, DFN-10-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMCP73833-FCI
Microchip Tech · Battery Management ICs · DFN-10-EP(3x3)
MCP73833-FCI from Microchip Tech, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Battery management input supply; a supply of [VREG (typical) + 0.3V] to 6V is recommended, bypassed to VSS with a minimum of 1 µF. |
| 2 | VDD | power_in | Battery management input supply; a supply of [VREG (typical) + 0.3V] to 6V is recommended, bypassed to VSS with a minimum of 1 µF. |
| 3 | STAT1 | output | Open-drain charge status output for connection to an LED, or with a pull-up resistor for interfacing to a host microcontroller. |
| 4 | STAT2 | output | Open-drain charge status output for connection to an LED, or with a pull-up resistor for interfacing to a host microcontroller. |
| 5 | VSS | power_in | Battery management 0V reference, connected to the negative terminal of the battery and input supply. |
| 6 | PROG | passive | Current regulation set: a resistor from PROG to VSS scales the preconditioning, fast charge and termination currents, and floating the pin disables the charge controller. |
| 7 | PG | output | MCP73833 power good pseudo open-drain output that sinks but cannot source current, should only be pulled up to the input, and is low when the input is above the UVLO threshold and greater than the battery voltage (this pin is TE timer enable on the MCP73834). |
| 8 | THERM | input | Thermistor input with an internal 50 µA bias source for 10 kΩ NTC thermistors, compared against factory-set thresholds of 1.20V and 0.25V typical. |
| 9 | VBAT | power_out | Battery charge control output connected to the positive battery terminal (drain of the internal P-channel pass transistor), bypassed to VSS with a minimum of 1 µF for loop stability when the battery is disconnected. |
| 10 | VBAT | power_out | Battery charge control output connected to the positive battery terminal (drain of the internal P-channel pass transistor), bypassed to VSS with a minimum of 1 µF for loop stability when the battery is disconnected. |
| 11 | EP | power_in | Exposed thermal pad with an internal electrical connection to VSS; it must be connected to the same potential as VSS. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | DFN-10-EP(3x3) |
| Category | Power Management ICs |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | 7 | V | 3 | |||
| All inputs and outputs w.r.t. VSS | -0.3 | V | upper limit printed as (VDD+0.3)V | 3 | |||
| Storage temperature | -65 | 150 | °C | 3 | |||
| ESD HBM | 4 | kV | 1.5 kΩ in series with 100 pF, printed ≥ 4 kV | 3 | |||
| ESD MM | 300 | V | 200 pF, no series resistance | 3 | |||
| Supply Voltage | VDD | 3.75 | 6 | V | Charging | 3 | |
| Supply Voltage | VDD | 6 | V | Charge Complete, Standby; min printed as VREG(Typical)+0.3V | 3 | ||
| Supply Current | ISS | 2000 | 3000 | µA | Charging | 3 | |
| Supply Current | ISS | 150 | 300 | µA | Charge Complete | 3 | |
| Supply Current | ISS | 100 | 300 | µA | Standby (No Battery or PROG Floating) | 3 | |
| Supply Current | ISS | 50 | 100 | µA | Shutdown (VDD < VBAT, or VDD < VSTOP) | 3 | |
| UVLO Start Threshold | VSTART | 3.4 | 3.55 | 3.7 | V | VDD Low-to-High | 3 |
| UVLO Stop Threshold | VSTOP | 3.3 | 3.45 | 3.6 | V | VDD High-to-Low | 3 |
| UVLO Hysteresis | VHYS | 100 | mV | 3 | |||
| Regulated Output Voltage | VREG | 4.168 | 4.2 | 4.232 | V | VDD=[VREG(Typical)+1V], IOUT=10 mA, TA=-5°C to +55°C | 3 |
| Line Regulation | /(ΔVBAT/VBAT)/ΔVDD/ | 0.1 | 0.3 | %/V | VDD=[VREG(Typical)+1V] to 6V, IOUT=10 mA | 3 | |
| Load Regulation | /ΔVBAT/VBAT/ | 0.1 | 0.3 | % | IOUT=10 mA to 100 mA, VDD=[VREG(Typical)+1V] | 3 | |
| Fast Charge Current Regulation | IREG | 90 | 100 | 110 | mA | PROG = 10 kΩ | 3 |
| Fast Charge Current Regulation | IREG | 900 | 1000 | 1100 | mA | PROG = 1.0 kΩ, TA=-5°C to +55°C | 3 |
| Output Reverse Leakage Current | IDISCHARGE | 0.15 | 2 | µA | PROG Floating | 4 | |
| Output Reverse Leakage Current | IDISCHARGE | 0.25 | 2 | µA | VDD < VBAT | 4 | |
| Output Reverse Leakage Current | IDISCHARGE | -5.5 | -15 | µA | Charge Complete | 4 | |
| Sink Current | ISINK | 15 | 25 | mA | Status indicators STAT1, STAT2, PG | 4 | |
| Low Output Voltage | VOL | 0.4 | 1 | V | ISINK = 4 mA | 4 | |
| Input Leakage Current | ILK | 0.01 | 1 | µA | High Impedance, 6V on pin | 4 | |
| Charge Impedance Range | RPROG | 1 | 20 | kΩ | 4 | ||
| Standby Impedance | RPROG | 70 | 200 | kΩ | Minimum Impedance for Standby | 4 | |
| Thermistor Current Source | ITHERM | 47 | 50 | 53 | µA | 2 kΩ < RTHERM < 50 kΩ | 4 |
| Upper Trip Threshold | VT1 | 1.2 | 1.23 | 1.26 | V | VTHERM Low-to-High | 4 |
| Lower Trip Threshold | VT2 | 0.235 | 0.25 | 0.265 | V | VTHERM High-to-Low | 4 |
| THERM Input Sink Current | ISINK | 3 | 6 | 20 | µA | Stand-by or system test mode | 4 |
| Bypass Capacitance | CBAT | 1 | µF | IOUT < 250 mA | 4 | ||
| Bypass Capacitance | CBAT | 4.7 | µF | IOUT > 250 mA | 4 | ||
| Input High Voltage Level (TE) | VIH | 2 | V | 5 | |||
| Input Low Voltage Level (TE) | VIL | 0.6 | V | 5 | |||
| Input Leakage Current (TE) | ILK | 0.01 | 1 | µA | VTE = 6V | 5 | |
| UVLO Start Delay | tSTART | 5 | ms | VDD Low-to-High | 5 | ||
| Transition Time Out of Preconditioning | tDELAY | 1 | ms | VBATVPTH | 5 | ||
| Current Rise Time Out of Preconditioning | tRISE | 1 | ms | IOUT Rising to 90% of IREG | 5 | ||
| Preconditioning Comparator Filter Time | tPRECON | 0.4 | 1.3 | 3.2 | ms | Average VBAT Rise/Fall | 5 |
| Termination Comparator Filter Time | tTERM | 0.4 | 1.3 | 3.2 | ms | Average IOUT Falling | 5 |
| Charge Comparator Filter Time | tCHARGE | 0.4 | 1.3 | 3.2 | ms | Average VBAT Falling | 5 |
| Thermistor Comparator Filter Time | tTHERM | 0.4 | 1.3 | 3.2 | ms | Average THERM Rise/Fall | 5 |
| Status Output turn-off | tOFF | 200 | µs | ISINK = 1 mA to 0 mA | 5 | ||
| Status Output turn-on | tON | 200 | µs | ISINK = 0 mA to 1 mA | 5 | ||
| Specified Temperature Range | TA | -40 | 85 | °C | 5 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | 5 | ||
| Storage Temperature Range | TA | -65 | 150 | °C | 5 | ||
| Thermal Resistance, DFN-10, 3 mm x 3 mm | θJA | 41 | °C/W | 4-Layer JC51-7 Standard Board, Natural Convection | 5 | ||
| Maximum Output Current Limit | IMAX | 1200 | mA | PROG < 833Ω | 3 | ||
| Pass Transistor ON-Resistance | RDSON | 300 | mΩ | VDD = 3.75V, TJ = 105°C | 4 | ||
| Die Temperature (thermal shutdown) | TSD | 150 | °C | 5 |
CAD (KiCad official)
- Symbol:
MCP73833-FCI - Footprint:
Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm - 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
mcp73833-fci-etched.step/mcp73833-fci-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp73833-fci.step/mcp73833-fci.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (32 pp, sha256
c7fe3f17750ca7fd, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).