component
MCP6V03-E
Public Made by Adomby adom
Microchip Tech Precision OpAmps, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownMCP6V03-E
Microchip Tech · Precision OpAmps · SOIC-8
MCP6V03-E from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection on the MCP6V03 SOIC package; this pin is not connected internally. |
| 2 | VIN- | power_in | Inverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 3 | VIN+ | power_in | Non-inverting input of op amp A, a high-impedance CMOS input with low bias current; for normal operation it must be between VSS and VDD. |
| 4 | VSS | power_in | Negative power supply; VDD is 1.8V to 5.5V higher than VSS, and in single-supply use VSS is connected to ground. |
| 5 | NC | unconnected | No internal connection on the MCP6V03 SOIC package; this pin is not connected internally. |
| 6 | VOUT | output | Analog output of op amp A, a low-impedance voltage source. |
| 7 | VDD | power_in | Positive power supply, 1.8V to 5.5V higher than VSS; VDD needs bypass capacitors. |
| 8 | CS | input | CMOS, Schmitt-triggered Chip Select input that places the MCP6V03 op amps into a low power mode of operation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Operational Amplifier/Comparator |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | -2 | 2 | µV | TA = +25°C (Note 1) | 3 | |
| Input Offset Voltage Drift with Temperature (linear Temp. Co.) | TC1 | -50 | 50 | nV/°C | TA = -40 to +125°C (Note 1) | 3 | |
| Power Supply Rejection | PSRR | 130 | 143 | dB | (Note 1) | 3 | |
| Input Bias Current across Temperature | IB | 600 | 5000 | pA | TA = +125°C | 3 | |
| Input Offset Current across Temperature | IOS | -1000 | -75 | 1000 | pA | TA = +125°C | 3 |
| Common-Mode Rejection | CMRR | 130 | 142 | dB | VDD = 1.8V, VCM = -0.2V to 2.0V (Note 1, Note 2) | 3 | |
| Common-Mode Rejection | CMRR | 140 | 152 | dB | VDD = 5.5V, VCM = -0.2V to 5.7V (Note 1, Note 2) | 3 | |
| DC Open-Loop Gain (large signal) | AOL | 130 | 145 | dB | VDD = 1.8V, VOUT = 0.2V to 1.6V (Note 1) | 3 | |
| DC Open-Loop Gain (large signal) | AOL | 140 | 156 | dB | VDD = 5.5V, VOUT = 0.2V to 5.3V (Note 1) | 3 | |
| Supply Voltage | VDD | 1.8 | 5.5 | V | 4 | ||
| Quiescent Current per amplifier | IQ | 200 | 300 | 400 | µA | IO = 0 | 4 |
| POR Trip Voltage | VPOR | 1.15 | 1.65 | V | 4 | ||
| CS Pull-Down Resistor (MCP6V03) | RPD | 3 | 5 | MΩ | 5 | ||
| CS Low to Amplifier Output On Turn-on Time | tON | 11 | 100 | µs | CS Low = VSS+0.3 V, G = +1 V/V, VOUT = 0.9 VDD/2 | 5 | |
| Specified Temperature Range | TA | -40 | 125 | °C | 5 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | (Note 1) | 5 | |
| Storage Temperature Range | TA | -65 | 150 | °C | 5 | ||
| Max. Junction Temperature | 150 | °C | 3 | ||||
| Current at Input Pins | -2 | 2 | mA | 3 | |||
| Current at Output and Supply Pins | -30 | 30 | mA | 3 | |||
| ESD protection on all pins | 4 | kV | HBM | 3 | |||
| ESD protection on all pins | 300 | V | MM | 3 | |||
| Thermal Resistance, 8L-SOIC | θJA | 150 | °C/W | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | gold | SN = Plastic SOIC (150mil Body), 8-lead * Y = nickel palladium gold manufacturing designator. Only | 41 |
CAD (KiCad official)
- Symbol:
MCP6V03-E - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
mcp6v03-e-etched.step/mcp6v03-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp6v03-e.step/mcp6v03-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (44 pp, sha256
28cdd67b1fe05611, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).