# MCP6494-E

**Microchip Tech** · Operational Amplifier · TSSOP-14

MCP6494-E from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUTA | output | Analog output of op amp A, a low-impedance voltage source. |
| 2 | VINA- | input | Inverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 3 | VINA+ | input | Non-inverting input of op amp A, a high-impedance CMOS input with low bias current. |
| 4 | VDD | power_in | Positive power supply, 2.4V to 5.5V higher than VSS, which needs bypass capacitors. |
| 5 | VINB+ | input | Non-inverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 6 | VINB- | input | Inverting input of op amp B, a high-impedance CMOS input with low bias current. |
| 7 | VOUTB | output | Analog output of op amp B, a low-impedance voltage source. |
| 8 | VOUTC | output | Analog output of op amp C, a low-impedance voltage source. |
| 9 | VINC- | input | Inverting input of op amp C, a high-impedance CMOS input with low bias current. |
| 10 | VINC+ | input | Non-inverting input of op amp C, a high-impedance CMOS input with low bias current. |
| 11 | VSS | power_in | Negative power supply; in single-supply operation VSS is connected to ground. |
| 12 | VIND+ | input | Non-inverting input of op amp D, a high-impedance CMOS input with low bias current. |
| 13 | VIND- | input | Inverting input of op amp D, a high-impedance CMOS input with low bias current. |
| 14 | VOUTD | output | Analog output of op amp D, a low-impedance voltage source. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | TSSOP-14 |
| Category | Operational Amplifier/Comparator |
| Pins | 14 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | 8-lead (TDFN) SN = Lead Plastic Small Outline (150 mil body), | 47 |

## CAD (KiCad official)

- Symbol: `MCP6494-E`
- Footprint: `Package_SO:TSSOP-14_4.4x5mm_P0.65mm`
- 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files: `mcp6494-e-etched.step` / `mcp6494-e-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mcp6494-e.step` / `mcp6494-e.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Microchip Tech datasheet](docs/mcp6494-e-datasheet.pdf) (50 pp, sha256 `36b62696c4d9f8b2`, retrieved 2026-10-29, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mcp6494-e-datasheet.pdf)